芯片抗摔保护封装结构

Abstract

本实用新型涉及芯片抗摔保护技术领域，公开了芯片抗摔保护封装结构，包括底座和放置片，所述底座和放置片的相邻之间设置有抗摔机构，所述抗摔机构用于对封装芯片的防摔，所述放置片的顶部设置有固定机构，所述固定机构用于对芯片的封装和固定，所述抗摔机构包括多个连接顶，多个所述连接顶的顶部均固定连接在放置片的底部四个拐角处，多个所述连接顶的底部均固定连接有抗摔液压杆。本实用新型中，底座上设置了多个抗摔弹簧，可利用自身的弹性形变，配合弹簧内部阻尼杆，在芯片受到外力冲击时，将作用于芯片的外力削弱，使得传递到芯片本身的外力不足以对芯片产生破坏，为芯片提供可靠的抗摔保护。

Claims

1. A chip anti-shock protection package structure, comprising a base (1) and a chip (2), characterized in that: A drop-resistant mechanism (3) is provided between the adjacent base (1) and the placement plate (2). The drop-resistant mechanism (3) is used to prevent the packaged chip from being dropped. A fixing mechanism (4) is provided on the top of the placement plate (2). The fixing mechanism (4) is used to package and fix the chip. The anti-fall mechanism (3) includes multiple connecting tops (31), the tops of which are fixedly connected to the four corners of the bottom of the placement piece (2), the bottoms of which are fixedly connected to anti-fall hydraulic rods (32), the four corners of the top of the base (1) are fixedly connected to connecting bottoms (34), the adjacent connecting tops (31) and connecting bottoms (34) are fixedly connected to anti-vibration springs (33), and the four corners of the top of the placement piece (2) are provided with bolt assemblies (35).

2. The chip anti-drop protection package structure of claim 1, wherein: The fixing mechanism (4) includes a fixing shell (41), the bottom of which is fixedly connected to the top of the placement piece (2). A front latch (42) is provided on the front side of the fixing shell (41). A rotating shaft (44) is fixedly connected to the rear top side of the fixing shell (41). Two rotating shells (43) are rotatably connected to the outer wall of the rotating shaft (44). The same top cover (45) is fixedly connected to the front side of both rotating shells (43). A buckle assembly (46) is provided on the front side of the top cover (45). A heat dissipation assembly (47) is provided inside the fixing shell (41).

3. The chip anti-drop protection packaging structure of claim 1, wherein: The bolt assembly (35) includes multiple threaded bases (351), the bottoms of which are fixedly connected to the four corners of the top of the placement piece (2), and the tops of which are threaded with nuts (352).

4. The chip anti-drop protection packaging structure of claim 2, wherein: The buckle assembly (46) includes a buckle plate (461), the top of which is fixedly connected to the front side of the top cover (45), a buckle lock (462) is fixedly connected to the front side of the buckle plate (461), a thrust spring (464) is fixedly connected inside the fixed housing (41), and an unlocking buckle (463) is fixedly connected to the front of the thrust spring (464).

5. The chip anti-drop protection package structure of claim 2, wherein: The heat dissipation assembly (47) includes two heat dissipation pads (471), and the two heat dissipation pads (471) are fixedly connected to the left and right sides of the inside of the fixed housing (41) respectively. The top cover (45) has multiple heat dissipation holes (472) on the left and right sides of its interior.

6. The chip anti-drop protection package structure of claim 1, wherein: The top of the base (1) is fixedly connected to a plurality of female pins (6), and the interior of each of the plurality of female pins (6) is slidably connected to a plurality of female pins (5), and the top of each of the plurality of female pins (5) is fixedly connected to the same placement piece (2).

7. The chip anti-drop protection package structure of claim 1, wherein: The base (1) is fixedly connected to the front and rear sides of the outside with bottom reinforcing ribs (7), and the two bottom reinforcing ribs (7) are provided with reinforcing rib grooves (8).

8. The chip anti-drop protection packaging structure of claim 1, wherein: The base (1) has side connecting plates (9) fixedly connected to its left and right sides, and multiple main pins (10) are fixedly connected to the top of the two side connecting plates (9).

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