一种多功能半导体运输箱

Abstract

本实用新型涉及一种多功能半导体运输箱，其包括箱体、舱门和冷却机构，所述冷却机构设置在所述箱体的侧壁上，所述舱门和所述箱体可拆卸连接，所述箱体的开口处设置连接块，所述连接块上设置有环形槽，所述环形槽的上下两壁均设置有插槽，所述舱门嵌入所述环形槽内，所述舱门上设置有快拆机构，所述快拆机构通过所述插槽配合固定所述舱门，借助快拆机构与插槽的快速分离的特性，舱门开关时间大幅缩短，在半导体晶圆的转运环节，缩短舱门开启时长能减少箱内低温环境与外界常温空气的热交换，降低晶圆因温度波动产生的晶格应力风险；同时，减少操作步骤也降低了人员接触晶圆的频次，间接降低污染概率。

Claims

1. A multi-functional semiconductor transport case, characterized by: The device includes a housing (1), a hatch (2), and a cooling mechanism (3). The cooling mechanism (3) is located on the side wall of the housing (1). The hatch (2) and the housing (1) are detachably connected. A connecting block (4) is provided at the opening of the housing (1). An annular groove (5) is provided on the connecting block (4). Slots (6) are provided on both the upper and lower walls of the annular groove (5). The hatch (2) is embedded in the annular groove (5). A quick-release mechanism (7) is provided on the hatch (2). The quick-release mechanism (7) is used to fix the hatch (2) through the slots (6).

2. The multi-functional semiconductor transport case of claim 1, wherein: The outer wall of the hatch (2) is provided with a groove, and the quick-release mechanism (7) is disposed in the groove. The quick-release mechanism (7) includes a key (71), a cam (72), an insert plate (73), and a tension spring (74). The key (71) is fixed on the cam (72), and the cam (72) is provided with two sets of arc-shaped grooves (75). One end of the insert plate (73) is provided with a pin, and the other end of the insert plate (73) passes through the groove wall of the hatch (2). The pin is inserted into the arc-shaped groove (75). A limiting bolt (76) is provided in the groove, and a waist-shaped groove (77) is provided on the insert plate (73). The limiting bolt (76) passes through the waist-shaped groove (77). When the cam (72) rotates, it pushes the pin and the insert plate (73) to move linearly. The end of the insert plate (73) is aligned with the slot (6). One end of the tension spring (74) is fixed to the cam (72), and the other end of the tension spring (74) is fixed in the groove. The insert plate (73) is inserted into the slot (6) under the action of the tension spring (74).

3. The multi-functional semiconductor transport case of claim 1, wherein: The hatch (2) is also provided with a glass cover plate (12), which is connected to the hatch (2) by bolts. The glass cover plate (12) has holes for the key (71) and the limiting bolt (76) to pass through.

4. The multi-functional semiconductor transport case of claim 3, wherein: Two sets of fixing blocks (8) are provided on the back plate of the hatch (2). The fixing blocks (8) are arranged vertically. Several sets of inclined elastic strips (9) are provided on the two sets of fixing blocks (8). The ends of the elastic strips (9) are provided with pressure blocks (10) with V-grooves.

5. The multi-functional semiconductor transport case of claim 4, wherein: The inner wall of the box (1) is provided with a number of spaced placement slots (11), and a flexible pad is provided in the placement slot (11). The horizontal position of the placement slot (11) corresponds one-to-one with the horizontal position of the pressure block (10).

6. The multi-functional semiconductor transport case of claim 1, wherein: The cooling mechanism (3) includes a connecting frame (31), a power supply, a fan (32), a cooling plate (33), a heat sink (34), and a cooling fin (35). The power supply is located outside the housing (1) and is electrically connected to the cooling plate (33) and the fan (32). The connecting frame (31) is fixed to the side wall of the housing (1). The heat sink (34) is fixed to the side of the connecting frame (31) located outside the housing (1). The fan (32) is fixed to the heat sink (34). The cooling plate (33) is located on the side of the connecting frame (31) located inside the housing (1). The cooling fin (35) is fixed to the cooling plate (33).

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