一种芯片电容除杂电子级离子交换树脂的添加设备

Abstract

本实用新型涉及半导体制造技术领域，且公开了一种芯片电容除杂电子级离子交换树脂的添加设备，包括树脂储存仓：所述树脂储存仓的顶端安装有密封盖，所述树脂储存仓的底端安装有电阀，所述电阀的底端安装有连接管，所述连接管的前端与后端均固定连接有连接管，所述连接管的内部与固定块的底端均安装有输送管。该芯片电容除杂电子级离子交换树脂的添加设备，通过可以将输送管进行快速安拆的设计，当工作人员需要使用输送管输送树脂时，仅需通过简单的对准卡接，即可实现输送管的快速安装，且拆卸过程同样简单便捷，进而有效提升了树脂输送的工作效率，降低了操作难度，同时也便于设备的维护与保养。

Claims

1. A device for adding electronic grade ion exchange resin to chip capacitors, comprising a resin storage bin (1), characterized in that, A sealing cap (2) is installed at the top of the resin storage chamber (1), an electric valve (3) is installed at the bottom of the resin storage chamber (1), a connecting pipe (4) is installed at the bottom of the electric valve (3), a connecting pipe (4) is fixedly connected to both the front and rear ends of the connecting pipe (4), a conveying pipe (6) is installed inside the connecting pipe (4) and at the bottom of the fixing block (5), a mounting plate (7) is fixedly connected to both the front and rear ends of the surface of the conveying pipe (6), two slots (8) are opened on the surface of the mounting plate (7), a fixing plate (9) is fixedly connected inside the fixing block (5), and the fixing plate (9) Both sides of the fixed block (5) are fixedly connected with elastic springs (10). The inside of the fixed block (5) is slidably connected with two buckles (11) that are engaged with the slot (8). The side of the elastic spring (10) close to the buckle (11) is fixedly connected to the buckle (11). Both sides of the fixed block (5) are fixedly connected with sliding sleeves (12). Both sides of the fixed block (5) and the inside of the sliding sleeves (12) are provided with sliding grooves (13). The inside of the sliding grooves (13) is slidably connected with sliding rods (14). The side of the sliding rods (14) away from the sliding sleeves (12) is fixedly connected with a push-pull plate (15).

2. The apparatus for adding electronic grade ion exchange resin for removing impurities of a chip capacitor according to claim 1, wherein: The front and rear ends of the sliding sleeve (12) are provided with stop grooves (16), and the front and rear ends of the sliding rod (14) are fixedly connected with stop blocks (17). The inside of the stop groove (16) is slidably connected to the stop block (17).

3. The apparatus according to claim 1, wherein the apparatus is characterized by: The surface of the sliding rod (14) is fitted with an energy storage spring (18), and the two sides of the energy storage spring (18) are fixedly connected to the sliding sleeve (12) and the push-pull plate (15) respectively.

4. The device for adding electronic-grade ion exchange resin for removing impurities from chip capacitors according to claim 1, characterized in that: The front and rear ends of the fixing block (5) are provided with guide grooves (19), and the front and rear ends of the buckle (11) are fixedly connected with guide blocks (20). The interior of the guide groove (19) is slidably connected to the guide block (20).

5. The apparatus according to claim 1, wherein the apparatus is characterized by: The buckle (11) has a rounded corner (21) at its end, and two rubber plates (22) are installed at the bottom of the mounting plate (7).

6. The apparatus according to claim 1, wherein: The surface of the conveying pipe (6) is fitted with a sealing sleeve (23), and the number of sealing sleeves (23) is several and they are evenly distributed on the surface of the conveying pipe (6).

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