一种内存芯片加工用的上料装置
By introducing a gas buffering technology combining venting channels and baffles into the memory chip loading device, the problems of chip impact and inaccurate positioning have been solved, achieving non-destructive flexible loading and precise positioning, and improving loading efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- QIANYI STORAGE (SHENZHEN) CO LTD
- Filing Date
- 2025-09-11
- Publication Date
- 2026-07-17
AI Technical Summary
Existing memory chip feeding devices are prone to chip damage during the conveying process, and the chip arrangement is inaccurate, affecting the difficulty of subsequent operations.
By using a combination of exhaust channels and baffles in the material receiving mechanism, utilizing a gas buffer chip and limiting the position through the baffles, combined with rubber pads and servo motor drive, flexible buffering and precise positioning are achieved.
This reduces chip impact damage, ensures precise loading position, lowers the difficulty of subsequent operations, and improves loading efficiency and accuracy.
Smart Images
Figure CN224512240U_ABST
Abstract
Claims
1. A feeding device for memory chip processing, characterized in that, include: A frame, on the outside of which a conveyor belt (100) and a support plate (200) are provided, and a guide plate (300) is installed between the support plate (200) and the conveyor belt (100). It also includes a receiving mechanism (400), which is disposed on the support plate (200) and is used to flexibly receive the chip to reduce the phenomenon of bump damage; The receiving mechanism (400) includes a set of upright plates (410) and a set of exhaust grooves (420). The exhaust grooves (420) are opened into the interior of the upright plates (410), and two symmetrically arranged baffles (411) are installed on the upright plates (410).
2. The feeding device for processing memory chips according to claim 1, wherein An electric push rod (412) is installed on the upright plate (410), and an adjustment plate (413) is installed at one end of the electric push rod (412). The adjustment plate (413) is used to adjust the exposure range of the exhaust groove (420).
3. The feeding device for processing memory chips according to claim 1, wherein A set of rubber pads (110) is provided on the outer side of the conveyor belt (100). The rubber pads (110) have a receiving groove. A set of plug rods are installed on the outer side of the rubber pads (110). A set of plug holes that are adapted to the plug rods are provided on the conveyor belt (100).
4. The feeding device for processing memory chips according to claim 1, wherein A support plate (210) is rotatably connected to the support plate (200). A servo motor (220) is provided on the outer side of the support plate (200). The output shaft of the servo motor (220) is connected to the outer side of the support plate (210) through a coupling.
5. The feeding device for processing memory chips according to claim 4, wherein A riser (211) is provided on the outside of the support plate (210), and a horizontal pipe (212) is provided between the riser (211) and the exhaust groove (420). A solenoid valve is provided on the outside of the horizontal pipe (212).
6. The feeding device for processing memory chips according to claim 5, wherein A miniature air pump (213) is provided on the outside of the support plate (210), and a folded pipe (214) connected to the riser (211) is installed at the output end of the miniature air pump (213).
7. The feeding device for processing memory chips according to claim 1, wherein The baffle (411) is connected to the upright plate (410) by bolts, and the outer side of the upright plate (410) is provided with a set of threaded holes arranged at equal intervals.
8. The feeding device for processing memory chips according to claim 1, wherein The baffle (411) has a through groove inside, and the width of the through groove is greater than the thickness of the adjusting plate (413).