一种自动包胶装置
By controlling the glue feeding device in the automatic glue coating device, the glue feeding device conveys the tape, and the glue cutting device moves towards the board, the second pressing mechanism makes priority contact with the second bonding surface of the board and sticks the tape to the second bonding surface. Subsequently, the first pressing mechanism makes contact with the first bonding surface of the board. By limiting the length and time, corners are prioritized for bonding before cutting and pasting, which solves the problems of air bubbles and hollowness in the prior art and improves the glue coating accuracy and sealing performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEICHENXING ROBOT TECHNOLOGY (SHENZHEN) CO LTD
- Filing Date
- 2025-09-02
- Publication Date
- 2026-07-17
AI Technical Summary
In existing PCB board and battery encapsulation equipment, the edges of the adhesive tape tend to curl after cutting or suction, preventing air from being expelled simultaneously. This leads to problems such as air bubbles and voids at the bonding point between the bottom and top surfaces, affecting sealing performance and product yield.
An automatic tape-coating device is employed, which uses an automatically controlled tape-feeding device and a conveying device. The conveying device includes a tape-feeding device for the board and a tape-carrying device for the board. The tape-cutting device moves towards the board. The second pressing mechanism makes priority contact with the second bonding surface 112 of the board and presses it against the second bonding surface 112. Then, the first pressing mechanism makes priority contact with the second pressing mechanism 320 of the board and sticks the tape to the second bonding surface 112. Subsequently, the first pressing mechanism 310 contacts the first bonding surface 111 of the board 110 and contacts the second bonding surface 111. By limiting the first length, second length, and third length, the tape bonding sequence is controlled, achieving priority bonding at corners before cutting and pasting, and simultaneously removing air.
It effectively reduces the generation of air bubbles. By simultaneously removing air and then bonding the second gas, it significantly improves the coating precision and sealing performance, avoiding the air bubble risks in traditional processes.
Smart Images
Figure CN224512853U_ABST
Abstract
Claims
1. An automatic encapsulation apparatus characterized by comprising: This device is used for coating three facing surfaces or bonding surfaces of a board on one side. It is equipped with a glue feeding device and a conveying device. The conveying device is used to transport the board to one side of the coating device. The glue feeding device is used to convey the tape between the board and the coating device. The coating device includes a first pressing mechanism corresponding to the first bonding surface of the board, a second pressing mechanism corresponding to the second bonding surface, and a glue cutting mechanism. The moving bonding distance from the first pressing mechanism to the tape is a first length, the moving bonding distance from the second pressing mechanism to the tape is a third length, and the moving shearing distance from the end of the glue cutting mechanism to the tape is a second length. The first length is less than the second length, and the second length is less than the third length.
2. The automatic encapsulation device according to claim 1, characterized in that The board is placed horizontally, and the glue feeding device is located above the board, used to lower the conveyor belt to one side of the board.
3. The automatic encapsulation device according to claim 1, wherein A control mechanism is provided on one side of the rubber cutting mechanism. The control mechanism is equipped with a motor and a first contact end driven by the motor to make a circular motion. The end of the rubber cutting mechanism is equipped with a contact link. One end of the contact link is rotatably connected to the rubber cutting mechanism, and the other end is movably set on both sides of the circular motion trajectory. When the end of the contact link abuts against the inner side of the first contact end, the contact link slides to one side.
4. An automatic encapsulation apparatus according to claim 3, wherein The motor drive is connected to an output wheel, and the first abutting end is installed on the inner side of the edge of the output wheel. One end of the abutting rod has a protrusion facing the output wheel. A rotating hole is provided on one side of the rubber cutting mechanism, and the other end of the abutting rod is connected to the rotating hole.
5. An automatic encapsulation apparatus according to claim 4, wherein The first contact end is a curved ellipse, and the protrusion is a cylindrical part.
6. The automatic encapsulation device according to claim 3, wherein The cutting mechanism is equipped with an elastic mechanism on one side to return the abutting link to its initial position. The cutting process of the cutter is achieved by the contact between the first abutting end and the abutting link and the return of the elastic mechanism.
7. The automatic encapsulation device according to claim 1, wherein A guide mechanism is provided that is connected to the glue cutting mechanism. The guide mechanism includes a crossbeam, a sliding assembly, and a slide rail. The glue cutting mechanism is connected to one side of the crossbeam. The glue cutting mechanism is also connected to the sliding assembly. The sliding assembly is movably connected to the slide rail. One end of the elastic mechanism is connected to one side of the slide rail, and the other end of the elastic mechanism is connected to the crossbeam.
8. An automatic encapsulation apparatus according to claim 7, wherein One end of the crossbeam is connected to the glue cutting mechanism, which is provided with a second abutment. The cutter is provided with a rotating plate that abuts against the second abutment. An elastic element is also provided between one side of the rotating plate and the second abutment, and a sliding kit is provided on the other side of the second abutment.
9. The automatic encapsulation device according to claim 7, wherein The second pressing mechanism includes a second pressure roller, and the extension direction of the cutter is tangent to the second pressure roller.
10. The automatic encapsulation device according to claim 7, wherein The motor is detachable.