Low-voltage gate operator controller and driver integrated machine

Abstract

This utility model relates to the field of elevator technology and discloses a low-voltage door operator controller and drive unit, including a door operator housing. A low-voltage motor and drive module are housed inside the door operator housing. A rear cover is threaded to one side of the door operator housing, and the drive module is attached to one side of the rear cover. A heat dissipation mechanism is provided on the other side of the rear cover. A power conversion circuit, an MCU module, a debugging module, a half-bridge drive circuit, a MOSFET power device module, a current sampling circuit, a three-phase motor output module, and a power input and communication module are mounted on one side of the PCB board. In this utility model, the heat dissipation mechanism, through the housing, motor, drive module, and rear cover, effectively dissipates heat from the drive module, thus solving the problem of traditional dispersed modules resulting in a large overall size, occupying a lot of installation space, and being difficult to install in limited spaces such as elevator car tops or small industrial door operator installation environments.

Description

Technical Field

[0001] This utility model relates to the field of elevator technology, and in particular to a low-voltage door operator controller and drive integrated machine. Background Technology

[0002] In the field of modern building and industrial automation, gantry crane systems, as key equipment for realizing automatic door opening and closing control, are widely used, covering various locations such as elevators, industrial plants, commercial buildings, and residential communities. The low-voltage gantry crane controller and drive unit, as the core component of the gantry crane system, is responsible for the precise driving and control of the gantry crane motor. Its performance directly affects the stability, safety, and intelligence level of the gantry crane system.

[0003] Traditional low-voltage door operator controllers and drive units mostly adopt a modular design, with each functional unit such as the controller, driver, power supply module, and communication module set up independently and then electrically connected by a large number of connecting cables. When applied to elevator door operator systems, this design can achieve basic door operator control functions, but the dispersed modules result in a large overall size, occupying a lot of installation space. In some environments with limited space, such as the top of the elevator car or small industrial door operator installation environments, installation is quite difficult. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides an integrated low-voltage door operator controller and driver, which aims to solve the problem that traditional dispersed modules result in a large overall size, occupy a lot of installation space, and are difficult to install in some space-constrained elevator car tops or small industrial door operator installation environments.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a low-voltage door operator controller and driver integrated machine, including a door operator housing, a low-voltage motor and a drive module are provided inside the door operator housing, a rear cover is threadedly connected to one side of the door operator housing, one side of the drive module is attached to one side of the rear cover, the drive module is used to drive the low-voltage motor to rotate, and a heat dissipation mechanism is provided on the other side of the rear cover.

[0006] The above technical solution integrates the drive module and low-voltage motor inside the door operator housing, and uses a threaded connection between the rear cover and the door operator housing to protect one side of the door operator housing and limit the internal space. This solves the problem that traditional dispersed modules result in a large overall size, occupy a lot of installation space, and are difficult to install in some elevator car tops or small industrial door operator installation environments with limited space.

[0007] As a further description of the above technical solution: The drive module includes a PCB board. On one side of the PCB board are mounted a power conversion circuit, an MCU module, a debugging module, a half-bridge drive circuit, a MOSFET power device module, a current sampling circuit, a three-phase motor output module, and a power input and communication module. The power conversion circuit is electrically connected to the power input and communication module, the half-bridge drive circuit, the MCU module, the debugging module, the MOSFET power device module, and the current sampling circuit. The MCU module is electrically connected to the power input and communication module, the half-bridge drive circuit, the current sampling circuit, and the debugging module. The MOSFET power device module is electrically connected to the three-phase motor output module, which is electrically connected to a low-voltage motor. The debugging module is electrically connected to the power input and communication module. The MOSFET power device module is electrically connected to the half-bridge drive circuit and the current sampling circuit.

[0008] The above technical solution achieves the function of driving a low-voltage motor by cooperating with the power conversion circuit, MCU module, debugging module, half-bridge drive circuit, MOSFET power device module, current sampling circuit, motor three-phase output module, and power input and communication module.

[0009] As a further description of the above technical solution: A magnetic encoding module is installed on one side of the PCB board. The magnetic encoding module is electrically connected to the power input and communication module, the power conversion circuit, and the MCU module.

[0010] The above technical solution enables real-time monitoring of the low-voltage motor's operating status via a magnetic coding module, and uploads the data to a host computer or external device via an MCU module and a power input and communication module, thereby achieving the function of real-time monitoring of the low-voltage motor's operating status by the host computer or external device.

[0011] As a further description of the above technical solution: The power input and communication module are electrically connected to a frequency converter.

[0012] The above technical solution involves using a frequency converter to change the frequency and voltage of the power supply to the low-voltage motor, thereby achieving precise control over the operating parameters of the low-voltage motor, such as speed and torque.

[0013] As a further description of the above technical solution: A temperature and humidity sensor and a vibration sensor are provided on one side of the door machine housing. The power conversion circuit is electrically connected to both the temperature and humidity sensor and the vibration sensor. The MCU module is also electrically connected to both the temperature and humidity sensor and the vibration sensor.

[0014] The above technical solution involves real-time monitoring of temperature, humidity, and vibration data during the operation of low-voltage motors using temperature and humidity sensors and vibration sensors, thereby facilitating real-time monitoring of the operating environment of low-voltage motors.

[0015] As a further description of the above technical solution: The lower side of the door operator housing is bolted to one side of the elevator car door or elevator shaft door.

[0016] The above technical solution enables the rapid installation of the integrated machine by bolting the door operator housing onto the elevator car door or elevator shaft door.

[0017] As a further description of the above technical solution: The heat dissipation mechanism includes heat dissipation fins, one side of which is fixedly connected to the other side of the back cover. A heat dissipation component is fixedly connected inside the heat dissipation fins, and one outer wall of the heat dissipation component is attached to one side of the MCU module.

[0018] The above technical solution achieves the heat dissipation function of the all-in-one machine by transferring the heat generated by the MCU module to the heat sink fins through the heat dissipation components, and then transferring the heat to the external environment through the heat sink fins.

[0019] As a further description of the above technical solution: The heat dissipation component includes a thermal pad, one side of which is attached to one side of the MCU module. A one-way heat pipe is provided inside the thermal pad, and the other end of the one-way heat pipe is fixedly connected to the inside of the heat dissipation fins.

[0020] The above technical solution involves using a thermal pad to conduct the heat generated by the MCU module to a unidirectional heat pipe, which then conducts the heat to the heat dissipation fins. The heat dissipation fins increase the heat dissipation area of ​​the unidirectional heat pipe, thus transferring the heat to the external environment and achieving the heat dissipation function of the all-in-one machine.

[0021] This utility model has the following beneficial effects: 1. In this utility model, the low-voltage motor is supported by the door machine housing. The low-voltage motor and the drive module are integrated and installed inside the door machine housing. The rear cover and the door machine housing are connected by bolts. The drive module is cooled by a heat dissipation mechanism. This solves the problem that the traditional dispersed modules result in a large overall size, occupy a lot of installation space, and are difficult to install in some elevator car tops or small industrial door machine installation environments with limited space.

[0022] 2. In this utility model, the drive module, which consists of a power conversion circuit, an MCU module, a debugging module, a half-bridge drive circuit, a MOSFET power device module, a current sampling circuit, a three-phase motor output module, and a power input and communication module, is installed on one side of the PCB board. This achieves the integrated installation of each module, and through the cooperation of each module and the drive of the frequency converter, the precise operation of the integrated machine is realized.

[0023] 3. In this utility model, the operating status of the low-voltage motor is monitored in real time by a magnetic coding module, and the data is transmitted to the frequency converter, thereby realizing the real-time monitoring of the operating status of the low-voltage motor by the frequency converter, which improves the accuracy of the frequency converter in controlling the low-voltage motor drive.

[0024] 4. In this utility model, the heat generated by the operation of each module on one side of the PCB board is conducted to the unidirectional heat pipe through the thermal pad, and then the heat is conducted to the heat dissipation fins through the unidirectional heat pipe, and then conducted to the external environment through the heat dissipation fins, thereby realizing the heat dissipation function of the all-in-one machine. Attached Figure Description

[0025] Figure 1 This is a three-dimensional structural diagram of the integrated low-pressure door operator controller and driver proposed in this utility model. Figure 2 This is a three-dimensional structural diagram of the PCB board of the low-voltage door operator controller driver integrated machine proposed in this utility model. Figure 3 This is an exploded structural diagram of the heat dissipation mechanism of the low-pressure door operator controller drive integrated machine proposed in this utility model. Figure 4 This is a schematic diagram showing the layout of the modules of the low-pressure door operator controller drive integrated machine proposed in this utility model; Figure 5 This is a schematic diagram of the overall architecture of the low-pressure door operator controller and drive integrated machine proposed in this utility model; Figure 6 This is a schematic diagram of the vibration sensor structure of the low-pressure door operator controller drive integrated machine proposed in this utility model. Figure 7 This is a three-dimensional structural diagram of the frequency converter of the low-voltage door operator controller drive integrated machine proposed in this utility model.

[0026] Legend: 1. Door machine housing; 2. Low-voltage motor; 3. Heat dissipation mechanism; 30. Heat dissipation fins; 31. Heat dissipation assembly; 310. Thermal pad; 311. One-way heat pipe; 4. Temperature and humidity sensor; 5. Vibration sensor; 6. Frequency converter; 7. PCB board; 8. Back cover; 9. Debugging module; 10. Current sampling circuit; 11. Half-bridge drive circuit; 12. MOSFET power device module; 13. Motor three-phase output module; 14. Power input and communication module; 15. Power conversion circuit; 16. Magnetic encoding module; 17. MCU module. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Reference Figure 1 , Figure 2 and Figure 5 An embodiment of this utility model is provided: a low-voltage door operator controller and drive integrated machine, including a door operator housing 1, a low-voltage motor 2 and a drive module are provided inside the door operator housing 1, a rear cover 8 is threadedly connected to one side of the door operator housing 1, one side of the drive module is attached to one side of the rear cover 8, the drive module is used to drive the low-voltage motor 2 to rotate, and a heat dissipation mechanism 3 is provided on the other side of the rear cover 8. Specifically, the low-voltage motor 2 is supported by the door operator housing 1. The drive module used to drive, monitor and debug the low-voltage motor 2 is integrated and installed inside the door operator housing 1. The low-voltage motor 2 and the drive module are protected and their positions are limited by the bolt connection between the rear cover 8 and the door operator housing 1. The heat dissipation mechanism 3 is used to dissipate heat from the drive module. This solves the problem that the traditional dispersed modules result in a large overall size, occupy a lot of installation space, and are difficult to install in some elevator car tops or small industrial door operator installation environments with limited space.

[0029] Reference Figure 2 , Figure 4 and Figure 5The drive module includes a PCB board 7. On one side of the PCB board 7, a power conversion circuit 15, an MCU module 17, a debugging module 9, a half-bridge drive circuit 11, a MOSFET power device module 12, a current sampling circuit 10, a three-phase motor output module 13, and a power input and communication module 14 are mounted. The power conversion circuit 15 is electrically connected to the power input and communication module 14, the half-bridge drive circuit 11, the MCU module 17, the debugging module 9, the MOSFET power device module 12, and the current sampling circuit 10. The MCU module 17 is electrically connected to the power input and communication module 14, the half-bridge drive circuit 11, the current sampling circuit 10, and the debugging module 9. The MOSFET power device module 12 is electrically connected to the three-phase motor output module 13. The three-phase motor output module 13 is electrically connected to the low-voltage motor 2. The debugging module 9 is electrically connected to the power input and communication module 14. The MOSFET power device module 12 is electrically connected to the half-bridge drive circuit 11 and the current sampling circuit 10. Specifically, with Figure 4 The orientation is front, back, left, and right. The integrated installation positions of each module on PCB board 7 can be as follows: the middle of the debugging module 9 has a half-bridge drive circuit 11, the right and top of the half-bridge drive circuit 11 are power conversion circuits 15, the upper left of the half-bridge drive circuit 11 is the power input and communication module 14, the left of the half-bridge drive circuit 11 is the MOSFET power device module 12, the left of the MOSFET power device module 12 is the motor three-phase output module 13, the bottom of the half-bridge drive circuit 11 is the current sampling circuit 10, the lower right of the power conversion circuit 15 is the debugging module 9, and the right of the power conversion circuit 15 is the MCU module 17. The power input and communication module 14 includes a power input interface, a communication interface spacer, and corresponding filtering and protection components to facilitate external wiring and system electrical isolation and matching. The power input interface is used for system power supply to the power conversion circuit 15, and the communication interface spacer is used for communication between the various modules in the drive module and external devices such as the host computer and other controllers. The power conversion circuit 15 includes a DC-DC chip and conversion circuitry to convert the input power from the power input and communication module 14 into different voltages for the system, providing stable power to each module. The MCU module 17 is the main controller for embedding relevant programs and algorithms. The chip, half-bridge drive circuit 11 is used to amplify the weak signal output by MCU module 17, MOSFET power device module 12 converts the control signal into actual high-power electrical energy output, and converts DC power into the three-phase AC voltage required by low-voltage motor 2 through rapid on / off switching, current sampling circuit 10 is used to collect the current of the corresponding connected module, convert the current into a signal and transmit it to MCU module 17 for processing and analysis, motor three-phase output module 13 is used to connect to low-voltage motor 2 and provide three-phase current to low-voltage motor 2, and debugging module 9 is used to realize the interaction between external devices and internal modules of the system; all of the above are existing technologies; When the drive module is running, it connects to the external power supply and signal interaction through the power input and communication module 14. The power input and communication module 14 inputs the external power to the power conversion circuit 15 for conversion to power each module. The power input and communication module 14 transmits the signal to the MCU module 17 for processing and analysis, transmission of instructions and feedback of operating status. It also connects the debugging module 9 and external devices through the power input and communication module 14 to download the MCU module 17 program, perform online debugging and fault diagnosis, and transmit signals and data. Then, the MCU module 17 issues the corresponding instruction signal, which is amplified by the half-bridge drive circuit 11 and transmitted to the MOSFET power device module 12. The switching action converts the DC power into three-phase AC power and transmits it to the low-voltage motor 2 through the motor three-phase output module 13, so that the low-voltage motor 2 rotates at the corresponding speed and direction. During this period, the half-bridge drive circuit 11 feeds back status signals to the MCU module 17, and the MOSFET power device module 12 feeds back status signals to the half-bridge drive circuit 11. The circuit data of the MOSFET power device module 12 is collected in real time through the current sampling circuit 10 and converted into signals and transmitted to the MCU module 17 for processing and analysis. This enables the drive module to drive the low-voltage motor 2, and achieves the effect of integrated installation of each module, improving space utilization. This helps to solve the problem that traditionally dispersed modules result in a large overall size, occupy a lot of installation space, and are difficult to install in some space-constrained elevator car tops or small industrial door machine installation environments.

[0030] Reference Figure 4 and Figure 5 A magnetic encoding module 16 is installed on one side of the PCB board 7. The magnetic encoding module 16 is electrically connected to the power input and communication module 14, the power conversion circuit 15, and the MCU module 17. Specifically, the magnetic encoding module 16 includes a magnetic encoding chip, a matching magnet, and peripheral circuitry. It is used to monitor the speed, angle, and position of the low-voltage motor 2. This is existing technology and can be installed on the upper right side of the PCB board 7. The magnetic encoding module 16 transmits the monitored data to the MCU module 17 for processing and analysis, and then transmits it to the host computer for display and control via the power input and communication module 14, thereby realizing the function of real-time monitoring of the low-voltage motor 2.

[0031] Reference Figure 1 , Figure 5 and Figure 7 The power input and communication module 14 is electrically connected to the frequency converter 6; Specifically, the frequency converter 6 provides input power to the power input and communication module 14, and achieves stepless speed regulation and precise start and stop of the low-voltage motor 2 by adjusting parameters. As is the existing technology, with the cooperation of the magnetic encoding module 16, the frequency converter 6 can monitor the rotation signal of the low-voltage motor 2 in real time. Based on the monitoring of the rotation signal of the low-voltage motor 2, the frequency converter 6 can accurately control the rotation of the low-voltage motor 2, thereby realizing the start and stop control of the elevator door operator and the precise adjustment of the acceleration of the running curve.

[0032] Reference Figure 1 and Figure 6 A temperature and humidity sensor 4 and a vibration sensor 5 are provided on one side of the door machine housing 1. The power conversion circuit 15 is electrically connected to the temperature and humidity sensor 4 and the vibration sensor 5. The MCU module 17 is electrically connected to the temperature and humidity sensor 4 and the vibration sensor 5. Specifically, the temperature and humidity data of the environment surrounding the low-voltage motor 2 are monitored in real time by the temperature and humidity sensor 4, and the signal is transmitted to the MCU module 17 for processing and analysis. The data is compared with preset data to determine whether the operating environment of the low-voltage motor 2 is abnormal. The data is then uploaded to the host computer through the power input and communication module 14. The vibration data of the low-voltage motor 2 is measured in real time by the vibration sensor 5, and the signal is transmitted to the MCU module 17 for processing and analysis. This data serves as one of the data sources for determining whether the operating status of the low-voltage motor 2 is abnormal, thereby realizing the function of monitoring the operating environment of the low-voltage motor 2.

[0033] Reference Figure 1 The lower side of the door operator housing 1 is bolted to one side of the elevator car door or elevator shaft door; Specifically, the door operator housing 1 is installed on one side of the elevator car door or elevator shaft door by bolts, which helps to improve the efficiency of installing and removing the low-voltage motor 2.

[0034] Reference Figure 1 , Figure 2 and Figure 3 The heat dissipation mechanism 3 includes heat dissipation fins 30. One side of the heat dissipation fins 30 is fixedly connected to the other side of the rear cover 8. A heat dissipation component 31 is fixedly connected inside the heat dissipation fins 30. One side of the outer wall of the heat dissipation component 31 is attached to one side of the MCU module 17. Specifically, during the operation of the MCU module 17, heat is generated. Through the contact between one side of the MCU module 17 and the other side of the heat dissipation component 31, the heat generated by the MCU module 17 is conducted to the heat dissipation fins 30, and the heat dissipation fins 30 conduct the heat to the external environment, thereby realizing the heat dissipation function of the all-in-one machine.

[0035] Reference Figure 1 , Figure 2 and Figure 3 The heat dissipation component 31 includes a thermal pad 310, one side of which is attached to one side of the MCU module 17. A one-way heat pipe 311 is provided inside the thermal pad 310, and the other end of the one-way heat pipe 311 is fixedly connected to the inside of the heat dissipation fin 30. Specifically, the unidirectional heat pipe 311 is a valve-type unidirectional heat pipe, and the thermal pad 310 is a thermally conductive adhesive. One side of the thermal pad 310 can also be designed to fit with each module on one side of the PCB board 7, so that the heat generated by each module on one side of the PCB board 7 can be conducted to the thermal pad 310. The unidirectional heat pipe 311 is U-shaped, with one U-shaped end of the unidirectional heat pipe 311 fixed inside the thermal pad 310, and the outer wall of the other end of the unidirectional heat pipe 311 passing through the heat dissipation fins 30. This allows the unidirectional heat pipe 311 to conduct the heat inside the thermal pad 310 to the heat dissipation fins 30, and then conduct it to the external environment through the heat dissipation fins 30, thereby realizing the heat dissipation function of the all-in-one machine.

[0036] Working principle: By installing the drive module and magnetic encoding module 16, which consist of the power conversion circuit 15, MCU module 17, debugging module 9, half-bridge drive circuit 11, MOSFET power device module 12, current sampling circuit 10, motor three-phase output module 13 and power input and communication module 14, on one side of the PCB board 7, the integrated installation of each module is achieved, reducing the space occupied. The magnetic coding module 16 monitors the operating status of the low-voltage motor 2 in real time and transmits the data to the frequency converter 6, thereby realizing the real-time monitoring of the operating status of the low-voltage motor 2 by the frequency converter 6, which improves the accuracy of the frequency converter 6 in controlling the drive of the low-voltage motor 2. The heat generated by the operation of each module on one side of the PCB board 7 is conducted through the thermal pad 310 to the unidirectional heat pipe 311, and then through the unidirectional heat pipe 311 to the heat dissipation fins 30. The heat is then conducted to the external environment through the heat dissipation fins 30, thereby realizing the heat dissipation function of the all-in-one machine. This solves the problem that the traditional dispersed modules result in a large overall size, occupy a lot of installation space, and are difficult to install in some limited space environments such as the top of elevator cars or small industrial door machine installation environments.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A low-voltage door machine controller and drive integrated machine, comprising a door machine shell (1), characterized in that: The door machine housing (1) is equipped with a low-voltage motor (2) and a drive module. A rear cover (8) is threadedly connected to one side of the door machine housing (1). One side of the drive module is attached to one side of the rear cover (8). The drive module is used to drive the low-voltage motor (2) to rotate. A heat dissipation mechanism (3) is provided on the other side of the rear cover (8).

2. The low-voltage door controller and drive integrated machine of claim 1, wherein: The drive module includes a PCB board (7). On one side of the PCB board (7) are mounted a power conversion circuit (15), an MCU module (17), a debugging module (9), a half-bridge drive circuit (11), a MOSFET power device module (12), a current sampling circuit (10), a three-phase motor output module (13), and a power input and communication module (14). The power conversion circuit (15) is connected to the power input and communication module (14), the half-bridge drive circuit (11), the MCU module (17), the debugging module (9), the MOSFET power device module (12), and the current sampling circuit (10). 10) All are electrically connected. The MCU module (17) is electrically connected to the power input and communication module (14), the half-bridge drive circuit (11), the current sampling circuit (10), and the debugging module (9). The MOSFET power device module (12) is electrically connected to the motor three-phase output module (13). The motor three-phase output module (13) is electrically connected to the low-voltage motor (2). The debugging module (9) is electrically connected to the power input and communication module (14). The MOSFET power device module (12) is electrically connected to the half-bridge drive circuit (11) and the current sampling circuit (10).

3. The low-voltage door controller and drive integrated machine of claim 2, wherein: A magnetic encoding module (16) is installed on one side of the PCB board (7). The magnetic encoding module (16) is electrically connected to the power input and communication module (14), the power conversion circuit (15), and the MCU module (17).

4. The low-pressure door operator controller drive integrated machine according to claim 2, characterized in that: The power input and communication module (14) is electrically connected to a frequency converter (6).

5. The low-voltage door controller drive integrated machine of claim 2, wherein: A temperature and humidity sensor (4) and a vibration sensor (5) are provided on one side of the door machine housing (1). The power conversion circuit (15) is electrically connected to the temperature and humidity sensor (4) and the vibration sensor (5). The MCU module (17) is electrically connected to the temperature and humidity sensor (4) and the vibration sensor (5).

6. The low-voltage door controller drive integrated machine of claim 1, wherein: The lower side of the door operator housing (1) is bolted to one side of the elevator car door or elevator shaft door.

7. The low-voltage door controller drive integrated machine of claim 1, wherein: The heat dissipation mechanism (3) includes heat dissipation fins (30), one side of which is fixedly connected to the other side of the back cover (8), and a heat dissipation component (31) is fixedly connected inside the heat dissipation fins (30), with one side of the outer wall of the heat dissipation component (31) and one side of the MCU module (17) in contact.

8. The low-voltage door controller drive integrated machine of claim 7, wherein: The heat dissipation component (31) includes a thermal pad (310), one side of which is attached to one side of the MCU module (17). A one-way heat pipe (311) is provided inside the thermal pad (310), and the other end of the one-way heat pipe (311) is fixedly connected to the inside of the heat dissipation fins (30).

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