一种化学镀装置和玻璃通孔加工设备
By setting up external and internal jet pipes in the chemical plating apparatus, combined with a plating solution circulation component, the problem of uneven plating solution was solved, and the uniformity of the coating and the deposition rate were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUN FAITH CHEM CO LTD
- Filing Date
- 2025-07-29
- Publication Date
- 2026-07-17
AI Technical Summary
In existing chemical plating equipment, the plating solution has uneven composition and poor fluidity, resulting in uneven coating, difficulty in the plating solution entering the workpiece through holes, and slow processing speed.
The external and internal spray pipes are arranged opposite each other and combined with the plating solution circulation component. The spray is formed through the inlet and outlet pipes, which increases the contact time and contact area between the plating solution and the workpiece surface. The plating solution circulates in the plating tank to ensure uniform distribution.
It improves the uniformity and deposition rate of the coating, reduces plating defects, and improves the quality of the deposition on the workpiece surface.
Smart Images
Figure CN224513622U_ABST
Abstract
Claims
1. A chemical plating apparatus characterized by comprising: include: Plating tub, used to store plating solution; Both the external jet pipe and the internal jet pipe are located inside the plating cylinder; A plating solution circulation assembly is provided with two outlet pipes and one inlet pipe. The two outlet pipes are respectively connected to the external spray pipe and the internal spray pipe, and the inlet pipe is connected to the plating cylinder. The outer jet pipe and the inner jet pipe are arranged opposite to each other. A first jet hole is formed on the side of the outer jet pipe facing the inner jet pipe, and a second jet hole is formed on the side of the inner jet pipe facing the outer jet pipe.
2. The electroless plating apparatus according to claim 1, wherein The external jet pipe includes a hollow external flow base and a hollow external jet rod. The external flow base is connected to the plating cylinder. The external jet rod is inserted into the external flow base and communicates with the external flow base. The internal jet pipe includes a hollow internal distribution base and a hollow internal jet rod. The internal distribution base is connected to the plating cylinder, and the internal jet rod is inserted into the internal distribution base and communicates with the internal distribution base. The two liquid outlet pipes are respectively connected to the outer diversion base and the inner diversion base; the outer spray rod and the inner spray rod are arranged in parallel and both extend along the axial direction of the plating cylinder; multiple first spray holes are provided, and multiple first spray holes are arranged at intervals on the outer spray rod; multiple second spray holes are provided, and multiple second spray holes are arranged at intervals on the inner spray rod.
3. The electroless plating apparatus according to claim 2, wherein The external flow distribution base is arc-shaped or annular, and multiple external jet rods are provided, with the multiple external jet rods arranged at intervals along the circumference of the external flow distribution base; and / or, The inner diversion base is arc-shaped or ring-shaped, and multiple inner jet rods are provided, which are arranged at intervals along the circumference of the inner diversion base.
4. The electroless plating apparatus according to claim 3, wherein The outer diversion base and the inner diversion base are arranged at the same center.
5. The electroless plating apparatus according to claim 2, wherein The top surface of the external diversion base is provided with a first docking channel, and the external jet rod is screwed or plugged into the first docking channel; and / or, The top surface of the inner diversion base is provided with a second docking channel, and the inner jet rod is screwed or plugged into the second docking channel.
6. The electroless plating apparatus according to claim 2, wherein The chemical plating apparatus includes a connecting pipe, one end of which is connected to the external diversion base and the other end of which is connected to the internal diversion base.
7. The electroless plating apparatus according to any one of claims 2 to 6, wherein The length of the outer jet rod is less than or equal to the depth of the plating barrel; and / or, the length of the inner jet rod is less than or equal to the depth of the plating barrel.
8. The electroless plating apparatus according to claim 1, wherein The plating solution circulation assembly includes a flow meter, a filter, and a delivery pump connected in sequence via pipelines. The flow meter is connected to the inlet pipe, and the delivery pump is connected to the outlet pipe.
9. The electroless plating apparatus according to claim 8, wherein The delivery pump includes any one of centrifugal pumps, reciprocating pumps, jet pumps, and rotary pumps.
10. A glass via processing apparatus, characterized by, Includes the electroless plating apparatus as described in any one of claims 1 to 9.