一种用于镀金线路板加工的电镀装置
By designing a rotating motor and a second lead screw system in the electroplating device, electroplating of the circuit board was achieved without moving it, solving the problem of electroplating layer breakage and improving the electroplating effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HONGJIN TECHNOLOGY CO LTD
- Filing Date
- 2025-07-23
- Publication Date
- 2026-07-17
AI Technical Summary
In the current circuit board electroplating process, rapid movement may cause the electroplating layer to be weak and prone to breakage, affecting the electroplating effect.
An electroplating device was designed, which combines a first motor, an operating table, a rotating disk, and clamping blocks to perform different electroplating processes on the circuit board without moving it during the electroplating process. The rotating motor and the second lead screw drive the clamping blocks to move and fix the circuit board, avoiding the breakage of the electroplated layer caused by rapid movement.
This ensures the integrity of the electroplated layer on the circuit board, reduces the possibility of plating layer breakage, and improves the electroplating effect.
Smart Images
Figure CN224513672U_ABST
Abstract
Claims
1. A plating device for gold-plated circuit board processing, comprising a housing (1), characterized in that: An operation panel (17) is fixedly connected to one side of the outer shell (1), a second motor (7) is fixedly connected to the top of the outer shell (1), a rotating groove (9) is opened on the other side of the outer shell (1), a first lead screw (8) is rotatably connected to the inner side of the rotating groove (9), a moving plate (10) is slidably connected to the inner side of the rotating groove (9), a clamping block (15) is provided on one side of the outer shell (1), an operating table (2) is provided on one side of the outer shell (1), a support leg (3) is fixedly connected to the bottom end of the operating table (2), a first motor (5) is fixedly connected to the bottom end of the operating table (2), a rotating disk (4) is in contact with the top end of the operating table (2), an electroplating tank (6) is fixedly connected to the top end of the rotating disk (4), and a collection tank (18) is fixedly connected to the top end of the rotating disk (4).
2. The electroplating device for gold-plated circuit board processing according to claim 1, characterized in that: One end of the first motor (5) is fixedly connected to the bottom end of the operating table (2), the output shaft of the first motor (5) is rotatably connected to the operating table (2), and one end of the output shaft of the first motor (5) is fixedly connected to the bottom end of the rotating disk (4).
3. The electroplating device for gold-plated circuit board processing according to claim 1, characterized in that: The second motor (7) is fixedly connected to the top of the outer casing (1), the output shaft of the second motor (7) is rotatably connected to the outer casing (1), and one end of the output shaft of the second motor (7) is fixedly connected to one end of the first lead screw (8).
4. The electroplating device for gold-plated circuit board processing according to claim 1, characterized in that: The first lead screw (8) is screwed to the moving plate (10). A connecting rod (11) is fixedly connected to the top of the moving plate (10). A fixed plate (12) is fixedly connected to the top of the connecting rod (11). A rotating motor (13) is fixedly connected to the top of the fixed plate (12).
5. The electroplating device for gold-plated circuit board processing according to claim 1, characterized in that: The number of clamping blocks (15) is two sets, and each set of clamping blocks (15) has two clamping blocks (15). The top of one set of clamping blocks (15) is fixedly connected to the bottom of the movable plate (10), and the side of the other set of clamping blocks (15) is fixedly connected to a movable sleeve (16).
6. The electroplating device for gold-plated circuit board processing according to claim 5, characterized in that: There are two movable sleeves (16). The movable sleeves (16) are slidably connected to the fixed plate (12) and are helically connected to the second lead screw (14).
7. The electroplating device for gold-plated circuit board processing according to claim 4, characterized in that: There are two rotary motors (13). The output shaft of the rotary motor (13) is rotatably connected to the fixed plate (12). One end of the output shaft of the rotary motor (13) is fixedly connected to the top end of the second lead screw (14).