一种晶圆电镀用挂具
By combining the kit with the adjustment mechanism and locking mechanism, along with the rolling support and drainage tank, the problem of poor adjustability of existing wafer electroplating racks is solved, achieving efficient and uniform electroplating results and improving production efficiency and electroplating quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NOBO HIGH CORE (SHANGHAI) TECHNOLOGY DEVELOPMENT CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-07-17
AI Technical Summary
Existing wafer plating fixtures have poor adjustability and cannot adapt to wafers of different diameters or thicknesses. Furthermore, the fixed clamping method leads to uneven plating results, affecting the plating quality.
The design combines a kit with an adjustment mechanism, integrating a locking mechanism and a rolling support mechanism. It achieves rapid adjustment and point contact support through adjustment holes and rolling supports, adapting to wafers of different sizes. The 'V'-shaped structure and arc-shaped drainage channel ensure smooth discharge of the electroplating solution.
It enables rapid adjustment and high adaptability of the plating fixtures, improves the uniformity and consistency of electroplating, and ensures the stability of electroplating quality and production efficiency.
Smart Images
Figure CN224513673U_ABST
Abstract
Claims
1. A wafer electroplating fixture, characterized in that, include: The kit (1) is provided with a locking mechanism; An adjusting component (2) is inserted into the inner side of the kit (1), and several sets of adjusting holes (21) are equidistantly opened in the adjusting component (2) along its own length extension direction. Two sets of electroplating hangers (3) are fixedly connected to the kit (1) and the adjusting member (2) respectively, and the electroplating hangers (3) are provided with a rolling support mechanism; A vertical connecting rod (4) is fixedly connected to the top of the kit (1), and an external loading hole (41) is provided through the upper end of the vertical connecting rod (4). The locking mechanism is adapted to lock the kit (1) and the adjusting member (2) together, and the rolling support mechanism is adapted to roll support wafer workpieces of different diameters and lengths.
2. The wafer electroplating hanger according to claim 1, wherein The height and width of the adjusting member (2) are adapted to the height and width of the inner cavity of the kit (1).
3. The wafer electroplating hanger according to claim 1, wherein The locking mechanism includes: A perforation (11) is made through the end of the kit (1) away from the electroplating fixture (3); The locking rod (12) is inserted into the through hole (11) and the adjusting hole (21) with clearance fit; The end (13) is fixedly connected to one end of the locking rod (12); A spring (14) is fixedly connected between the end (13) and the kit (1).
4. The wafer electroplating hanger of claim 1, wherein The electroplating fixture (3) has a "V" shaped structure, and a drain groove (33) is provided at the bottom of the inner side of the electroplating fixture (3). Both sides of the drain groove (33) are connected to the outer side of the electroplating fixture (3), and the depth of the drain groove (33) increases from the middle to both sides in an arc shape.
5. The wafer electroplating hanger of claim 1, wherein The rolling support mechanism includes: Several sets of ball grooves (31) are opened through the height extension direction on both sides of the electroplating fixture (3); Several sets of support balls (32) are movably connected in several sets of ball grooves (31); The diameter of the supporting ball (32) is greater than the opening width on both sides of the ball groove (31), and the diameter of the supporting ball (32) is greater than the thickness of the electroplating fixture (3).