一种硅片边缘抛光布的裁剪装置
By designing support and positioning mechanisms, combined with fabric cutting guides and utility blades, efficient and precise cutting of polishing cloth at the edge of silicon wafers was achieved, solving the problems of low cutting efficiency and difficulty in controlling dimensional accuracy in existing technologies, and improving production efficiency and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MCL ELECTRONICS MATERIALS
- Filing Date
- 2025-08-19
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, the cutting efficiency of silicon wafer edge polishing cloth is low, the dimensional accuracy is difficult to control, and the consumption is difficult to predict, resulting in unstable production.
A silicon wafer edge polishing cloth cutting device was designed, comprising a support mechanism, a positioning mechanism, and a cutting mechanism. By adjusting the positioning mechanism and using a utility knife to make precise cuts along the cutting guide, the polishing cloth is ensured to be stably positioned on the support mechanism and cut as needed.
It enables efficient and precise cutting of large-sized polishing cloth into smaller sizes, reducing costs and improving production efficiency, avoiding dimensional errors, and stabilizing production.
Smart Images
Figure CN224513904U_ABST
Abstract
Claims
1. A cutting device for silicon wafer edge polishing cloth, characterized in that, This includes support mechanisms, positioning mechanisms, and fabric cutting mechanisms; The support mechanism includes two parallel support plates, which are connected by multiple connecting rods (121). Each support plate includes an integrally connected gripping part (111) and an extension part (118). A first base plate (131) is fixedly connected between the two gripping parts (111), and a second base plate (134) is fixedly provided on both extension parts (118). The positioning mechanism includes a clamping bolt (137) set on the first base plate (131) and two cloth-carrying tables (211) slidably set on the second base plate (134). The cloth-carrying tables (211) are fixedly connected to a cloth gauge (214), and the two cloth gauges (214) are parallel to each other, forming a receiving space for accommodating the polishing cloth between the two cloth gauges (214). The fabric cutting mechanism includes a fabric cutting guide rail (314) fixedly connected to the two grips (111), and a knife holder is slidably arranged on the fabric cutting guide rail (314), and a utility knife blade (323) is detachably connected to the knife holder.
2. The cutting apparatus of the polishing cloth for silicon wafer edge according to claim 1, wherein The first base plate (131) has a groove (132) parallel to the support plate. A positioning nut (136) is slidably disposed in the groove (132). The clamping bolt (137) cooperates with the positioning nut (136) so that the head of the clamping bolt (137) can press the polishing cloth onto the first base plate (131). The portion of the first base plate (131) located on both sides of the groove (132) is provided with scale lines (133).
3. The cutting apparatus of the silicon wafer edge polishing cloth according to claim 1, wherein Two fabric slider blocks (219) are fixedly installed on the second base plate (134). The fabric slider blocks (219) are slidably connected to fabric slider rails (220). Both fabric slider rails (220) are parallel to the fabric cutting guide rail (314). The fabric carrying table (211) is correspondingly connected to the fabric slider rails (220). The sliding direction of the fabric ruler (214) and the fabric slider rails (220) is perpendicular to each other.
4. The cutting apparatus of the polishing cloth for silicon wafer edge according to claim 3, wherein The second base plate (134) has a mounting hole (135) in the middle, and a gear (225) is rotatably installed in the mounting hole (135). The gear (225) protrudes upward from the second base plate (134). The cloth carrier (211) is fixedly connected to a rack (224) that meshes with the gear (225). The two racks (224) are parallel to each other and are located on both sides of the gear (225).
5. The cutting apparatus of a polishing cloth for silicon wafer edge according to claim 4, wherein The first side of the fabric carrier (211) is fixedly connected to the fabric slide rail (220). The second side of the fabric carrier (211) is fixedly provided with a connecting strip (212) and a limiting plate (213). The rack (224) is fixedly provided on the connecting strip (212). The limiting plate (213) is used to cooperate with the fabric slider (219) to limit the position of the fabric slide rail (220) during the sliding process of the fabric carrier (211).
6. The cutting apparatus of the polishing cloth for silicon wafer edge according to claim 1, wherein A crossbeam (311) is fixedly connected between the two gripping parts (111). The fabric cutting guide rail (314) is fixedly mounted on the crossbeam (311). A fabric cutting slider (320) is fitted on the fabric cutting guide rail (314). The blade holder includes a connecting plate (321) and a blade fixing plate (322) that are fixedly connected. The connecting plate (321) is fixedly mounted on the fabric cutting slider (320). The blade fixing plate (322) extends downward to the side of the fabric cutting slider (320). The utility knife blade (323) is detachably connected to the blade fixing plate (322).
7. The cutting apparatus of the polishing cloth for silicon wafer edge according to claim 6, wherein The fabric cutting slider (320) is fixedly connected to an upwardly extending handle (317), and the connecting plate (321) is located between the handle (317) and the fabric cutting slider (320). The handle (317) is provided with a plurality of recesses (319).
8. The cutting device for silicon wafer edge polishing cloth as described in claim 1, characterized in that, The support mechanism includes a guide plate (142) fixedly connected to the first base plate (131). The guide plate (142) has a guide groove (143) parallel to the fabric cutting guide rail (314). The utility knife (323) passes through the guide groove (143).
9. The cutting apparatus of the silicon wafer edge polishing cloth according to claim 8, wherein The guide plate (142) is rectangular, and the two ends of the guide plate (142) are bent to form two connecting parts (141). The two connecting parts (141) are stuck on the first base plate (131), and there is a distance between the guide plate (142) and the first base plate (131).
10. The cutting apparatus of the polishing cloth for wafer edge of claim 1, wherein, The gripping part (111) is integrally connected with the raised part (112), and the gripping part (111) and the raised part (112) are provided with a gripping hole (113).