A ring-shaped device for rapid and uniform bonding of antenna components

Abstract

This utility model relates to a ring-shaped device for rapid and uniform bonding of antenna components, belonging to the field of machining tooling fixtures. A ring-shaped bonding device is designed for high-quality and reliable bonding of millimeter-wave sensor antenna components, including: an upper ring (1), a lower ring (2), and a pressing platform (3). The antenna component to be bonded is placed between the upper and lower rings and clamped for subsequent heating and bonding. This device can meet the bonding requirements of antenna components, ensuring accurate positioning during primary and secondary mirror alignment, uniform force on the bonding surface, quantitative pressure control, and prevention of adhesive dripping.

Description

Technical Field

[0001] This utility model belongs to the field of machining tooling fixtures, and specifically relates to a ring device for rapid and uniform bonding of antenna components. Background Technology

[0002] Terminally guided munitions, as a new type of smart munition, have advantages such as high cost-effectiveness and fire-and-forget capability. In battlefield applications, they are primarily used to precisely strike weak points in enemy tank formations and other armored vehicles. To meet the demands of accurate detection, terminally guided munitions typically incorporate multi-mode composite detection components. Among these, the millimeter-wave sensor performs millimeter-wave radiation differential detection, and the antenna assembly is a key component. In practical applications, the antenna assembly is subjected to significant separation impacts, with maximum impact forces reaching tens to hundreds of times its own weight. Therefore, high-strength and high-reliability assembly is required for the antenna assembly.

[0003] Antenna assembly structure as follows Figure 1 As shown, the antenna assembly consists of a primary mirror and a secondary mirror, both made of polysulfone plastic. The primary and secondary mirrors are bonded together in pre-reserved bonding areas using hot melt adhesive strips. Both the primary and secondary mirror bonding areas have positioning holes to ensure precise positioning during bonding. A qualified antenna assembly requires uniform and dense molten adhesive in the bonding area, with no obvious adhesive gaps and no significant surface contamination. Traditional bonding methods typically use long-tail clips to clamp and press the bonding surfaces of the primary and secondary mirrors one by one. However, the individual clamping forces of the long-tail clips vary, making pressure difficult to control quantitatively, and their dispersed arrangement leads to uneven stress on the bonding surface. These factors can cause localized adhesive gaps during hot melt adhesive bonding, and excess adhesive dripping can also contaminate the antenna assembly underneath. Therefore, a dedicated antenna bonding device needs to be designed that simultaneously meets the following conditions: 1. Precise positioning of the antenna to be bonded; 2. Uniform pressure applied to the entire bonding surface; 3. Quantitatively controllable pressure; 4. Anti-adhesive dripping function. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] The technical problem to be solved by this utility model is to provide a ring device for rapid and uniform bonding of antenna components, which solves the problems of uneven force on the bonding surface, local lack of glue, and glue overflow during the bonding process of antenna components.

[0006] (II) Technical Solution

[0007] To solve the above-mentioned technical problems, this utility model provides a ring device for rapid and uniform bonding of antenna components, including: an upper ring 1 of the bonding device, a lower ring 2 of the bonding device, and a pressing platform 3;

[0008] The upper ring 1 and lower ring 2 of the bonding device are configured as circular ring structures with the same inner diameter. The pressing platform 3 is a circular concave platform structure and is set on the lower ring 2 of the bonding device. A protrusion structure is provided below the upper ring 1 of the bonding device, and the protrusion platform surface matches the concave platform surface.

[0009] Multiple screw holes are opened at the same position on the upper ring 1 and the lower ring 2 of the bonding device. A clamping screw 4 is provided in the screw hole, and the upper ring 1 and the lower ring 2 of the bonding device are fastened by the clamping screw 4.

[0010] The lower ring 2 of the bonding device is provided with two positioning pins 5 at the position of the antenna assembly positioning hole, and the outer edge of the concave platform 3 is provided as an anti-drip adhesive sidewall 6.

[0011] Wherein, the inner diameter of the upper ring 1 and the lower ring 2 of the bonding device is equal to the inner diameter of the antenna bonding surface.

[0012] The upper ring 1 and the lower ring 2 of the bonding device are fixed by four M4 clamping screws 4, each clamping screw 4 having a fixing torque of 1.5 N·M.

[0013] The diameter of the positioning pin 5 matches the size of the positioning hole of the antenna assembly. The positioning pin 5 passes through the primary mirror and secondary mirror to be bonded in sequence to complete the positioning. After the positioning is completed, the antenna assembly does not shake or rotate and misalign.

[0014] The anti-drip adhesive sidewall 6 is positioned so that it extends 2mm outward from the outer edge of the antenna assembly bonding surface, and its height is set to 5mm.

[0015] (III) Beneficial Effects

[0016] Compared with existing technologies, this utility model has the following advantages: it significantly improves the reliability and pass rate of antenna bonding, making the antenna assembly bonding process more reasonable and controllable. At the same time, it simplifies the complex traditional bonding method, reducing the labor intensity of employees; it also reduces the scrap rate and lowers production costs. Attached Figure Description

[0017] Figure 1 Diagram of antenna assembly;

[0018] Figure 2 This is a diagram showing the components of the novel bonding device;

[0019] Figure 3 Diagram of the bonding device pressing process;

[0020] Figure 4 This is a structural diagram of the pressing platform. Detailed Implementation

[0021] To make the objectives, contents, and advantages of this utility model clearer, the specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings and examples.

[0022] Example 1

[0023] This embodiment provides a ring device for rapid and uniform bonding of antenna components, including: an upper ring 1 of the bonding device, a lower ring 2 of the bonding device, and a pressing platform 3;

[0024] The upper ring 1 and lower ring 2 of the bonding device are configured as circular ring structures with the same inner diameter. The pressing platform 3 is a circular concave platform structure and is set on the lower ring 2 of the bonding device. A protrusion structure is provided below the upper ring 1 of the bonding device, and the protrusion platform surface matches the concave platform surface.

[0025] Multiple screw holes are opened at the same position on the upper ring 1 and the lower ring 2 of the bonding device. A clamping screw 4 is provided in the screw hole, and the upper ring 1 and the lower ring 2 of the bonding device are fastened by the clamping screw 4.

[0026] The lower ring 2 of the bonding device is provided with two positioning pins 5 at the position of the antenna assembly positioning hole, and the outer edge of the concave platform 3 is provided as an anti-drip adhesive sidewall 6.

[0027] Wherein, the inner diameter of the upper ring 1 and the lower ring 2 of the bonding device is equal to the inner diameter of the antenna bonding surface.

[0028] The upper ring 1 and the lower ring 2 of the bonding device are fixed by four M4 clamping screws 4, each clamping screw 4 having a fixing torque of 1.5 N·M.

[0029] The diameter of the positioning pin 5 matches the size of the positioning hole of the antenna assembly. The positioning pin 5 passes through the primary mirror and secondary mirror to be bonded in sequence to complete the positioning. After the positioning is completed, the antenna assembly does not shake or rotate and misalign.

[0030] The anti-drip adhesive sidewall 6 is positioned so that it extends 2mm outward from the outer edge of the antenna assembly bonding surface, and its height is set to 5mm.

[0031] Example 2

[0032] The bonding device shown consists of two parts, upper and lower, made of stainless steel. A corresponding pressing platform is positioned between the two parts for pressing the bonding surfaces of the antenna assembly together. Both the upper and lower parts of the device are made into annular structures, with the inner diameter of the ring equal to the inner diameter of the antenna bonding surface. During bonding and pressing, the arc-shaped protrusions of the primary and secondary mirrors can pass through the upper and lower rings of the bonding device, with the bonding surfaces placed on the pressing platform. Figure 3The bonding device shown is secured with four M4 screws during the upper and lower ring pressing process. Each screw is tightened using a torque screwdriver to a torque of 1.5 N·m. This pressing method ensures uniform and consistent stress across the entire bonding surface, minimizing adhesive overflow and incomplete bonding caused by uneven stress. The use of a torque screwdriver further ensures consistent pressing force, making the entire bonding process more rigorous and quantifiable. Figure 4 The lower ring of the bonding device has two positioning pins corresponding to the positioning holes of the antenna assembly. The pins are the same size as the positioning holes. The positioning pins pass through the primary and secondary mirrors to be bonded in sequence to complete the positioning. After positioning, the antenna assembly does not wobble or rotate. A 5mm high anti-drip protrusion is provided on the outer edge of the lower ring of the bonding device. The protrusion extends 2mm outward from the outer edge of the bonding surface of the antenna assembly. When the antenna assembly is heated and bonded, even if a small amount of hot melt adhesive overflows, it will not drip downwards, avoiding the situation where excess adhesive from the upper layer drips and contaminates the lower antenna layer when placed in a multi-layer oven for heating.

[0033] The working process of this utility model is as follows:

[0034] 1. Attach the arc-shaped hot melt adhesive strip corresponding to the antenna assembly bonding surface to the primary mirror bonding surface, with the adhesive strip centered;

[0035] 2. Align and glue the primary and secondary antenna mirrors together, while ensuring that the positioning holes roughly correspond to each other;

[0036] 3. Place the antenna assembly to be bonded on the lower ring of the bonding device, and pass the two positioning pins through the corresponding positioning holes of the antenna assembly.

[0037] 4. The upper ring of the bonding device is pressed on top of the antenna assembly, and the upper and lower pressing platforms correspond to each other;

[0038] 5. Secure the upper and lower rings with four M4 screws, using a torque screwdriver to control the torque at 1.5 N·m;

[0039] 6. Place the fixed antenna assembly into an oven for heating to complete the antenna bonding.

[0040] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A ring device for quick and uniform bonding of antenna assemblies, characterized in that Includes: an upper ring (1) of the bonding device, a lower ring (2) of the bonding device, and a pressing platform (3); The upper ring (1) and lower ring (2) of the bonding device are set as circular ring structures with the same inner diameter. The pressing platform (3) is a circular concave platform structure and is set on the lower ring (2) of the bonding device. A boss structure is provided below the upper ring (1) of the bonding device, and the boss platform surface matches the concave platform surface. Multiple screw holes are opened at the same position on the upper ring (1) and lower ring (2) of the bonding device. A clamping screw (4) is provided in the screw hole. The upper ring (1) and lower ring (2) of the bonding device are fastened by the clamping screw (4). The lower ring (2) of the bonding device is provided with two positioning pins (5) at the position of the antenna assembly positioning hole, and the outer edge of the concave platform (3) of the pressing platform is provided as an anti-drip adhesive sidewall (6).

2. The ring-shaped device for rapid and uniform bonding of antenna components as described in claim 1, characterized in that, The inner diameter of the upper ring (1) and the lower ring (2) of the bonding device is equal to the inner diameter of the antenna bonding surface.

3. The ring assembly for quick and uniform bonding of antenna assemblies as claimed in claim 1, wherein The upper ring (1) and lower ring (2) of the bonding device are fixed by four M4 clamping screws (4), and the clamping torque of each clamping screw (4) is 1.5 N·M.

4. The ring assembly for quick and uniform bonding of antenna assemblies as claimed in claim 1, wherein The diameter of the positioning pin (5) matches the size of the positioning hole of the antenna assembly. The positioning pin (5) passes through the primary mirror and secondary mirror to be bonded in sequence to complete the positioning. After the positioning is completed, the antenna assembly does not shake or rotate and is misaligned.

5. The ring assembly for quick and uniform bonding of antenna assemblies as claimed in claim 1, wherein The anti-drip adhesive sidewall (6) is positioned to extend 2mm outward from the outer edge of the antenna assembly bonding surface, and its height is set to 5mm.

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