一种散热器
By using a T-shaped heat sink, combined with die-cast aluminum alloy and various heat dissipation components, the compatibility and heat diffusion issues of automotive headlight heat sinks have been resolved, improving heat dissipation efficiency, extending the life of LED chips, and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG DISHI TECH CO LTD
- Filing Date
- 2025-08-11
- Publication Date
- 2026-07-17
AI Technical Summary
Existing automotive headlight heat sinks suffer from poor compatibility, slow heat dissipation, inefficient space utilization, and high cost, especially affecting the lifespan and optical stability of LED chips in high-power LED headlights.
The heat sink adopts a T-shaped structure, including a first heat dissipation unit and a second heat dissipation unit. The first heat dissipation unit is thicker and used to store heat, while the second heat dissipation unit is thinner and used to dissipate heat. Combined with die-cast aluminum alloy, heat dissipation fins, a fan, and heat exchange pipes, it achieves effective heat transfer and diffusion.
It improves heat dissipation efficiency, increases heat dissipation area, enables compatible installation of different circuit boards, reduces temperature, extends LED lifespan, optimizes space utilization, and reduces costs.
Smart Images
Figure CN224516581U_ABST
Abstract
Claims
1. A heat spreader characterized by: It includes a first heat dissipation unit (1) and a second heat dissipation unit (2). The first heat dissipation unit (1) is located on a first plane, and the second heat dissipation unit (2) is located on a second plane. The first plane and the second plane form a certain angle. The middle area of the first heat dissipation unit (1) and the second heat dissipation unit (2) are connected to form a T-shaped structure. The circuit board is set in the first heat dissipation unit (1) so that heat is transferred from the first heat dissipation unit (1) to the middle area of the second heat dissipation unit (2) and then diffuses to both ends.
2. The heat spreader of claim 1, wherein: The thickness of the first heat dissipation unit (1) is greater than the thickness of the second heat dissipation unit (2).
3. The heat spreader of claim 1, wherein: The first heat dissipation unit (1) is provided with a circuit board mounting slot (10).
4. The heat spreader of claim 1, wherein: The second heat dissipation unit (2) is provided with heat dissipation fins (21).
5. The heat sink of claim 4, wherein: The second heat dissipation unit (2) is provided with a heat dissipation mounting groove (22), and the heat dissipation fins (21) are disposed on the mounting plate (3). The mounting plate (3) can be installed in the heat dissipation mounting groove (22).
6. The heat sink of claim 5, wherein: The mounting plate (3) has a first protruding strip (31) and a second protruding strip (32) at both ends. When the mounting plate (3) is installed in the heat dissipation mounting groove (22), the first protruding strip (31) and the second protruding strip (32) are in contact with the two end faces of the second heat dissipation unit (2).
7. The heat sink of claim 6, wherein: The heat dissipation fins (21) are equipped with a cooling fan (4).
8. The heat sink of claim 7, wherein: The cooling fan (4) is an axial fan arranged in a second or third direction.
9. The heat sink of any one of claims 4-8, wherein: The heat dissipation fins (21) are provided with a second heat exchange conduit (25).
10. The heat spreader of claim 9, wherein: The first heat dissipation unit (1) is provided with a first heat exchange conduit (26) or a heat conduction strip (14), and the first heat exchange conduit (26) is connected to the second heat exchange conduit (25).