风干除水机构及半导体测试装置
By utilizing the dual airflow design of the dehydration plate and air knife assembly, the high cost and low efficiency of dehydration operations after semiconductor testing are solved through the air drying and dehydration mechanism, achieving a fast, uniform and efficient dehydration effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN YUANLICHUANG TECH CO LTD
- Filing Date
- 2025-08-21
- Publication Date
- 2026-07-17
AI Technical Summary
Existing technologies for dehydration after semiconductor testing suffer from high costs, low efficiency, demanding equipment requirements, and cumbersome operation, making it difficult to meet the need for rapid and uniform moisture removal.
The system employs a drying and dehydration mechanism that combines a dehydration plate and an air knife assembly with two airflows to blow water onto the bottom of the semiconductor from both vertical and horizontal directions. Through the cooperation of the first and second airflow channels, rapid and uniform dehydration is achieved.
It reduces water removal costs, improves water removal efficiency, ensures uniform and rapid water removal, and reduces water splashing and equipment space occupation.
Smart Images
Figure CN224517185U_ABST
Abstract
Claims
1. A mechanism for air drying and water removal, characterized by, The air knife assembly (130) is arranged below the water removal plate (120), and at least includes an air knife body (131) with a second air blowing channel (1311) having a second air outlet upward in the vertical direction, which is exposed to the first through hole (1201). The second air blowing channel (1311) has a first channel wall and a second channel wall, which are oppositely and spacedly arranged in a first direction, and are curvedly arranged at the second air outlet; The first direction, the vertical direction and the length direction of the air knife body (131) are angularly arranged. The air drying and water removal mechanism (100) further includes a support seat (140) surrounding a water removal cavity (1401) with a top opening (1402), the water removal plate (120) is arranged at the opening (1402), and the air knife body (131) is arranged in the water removal cavity (1401).
2. The air-drying water removal mechanism of claim 1, wherein, The air knife assembly (130) further includes a driving unit (132) and an assembly arm (133), the driving unit (132) is connected with the air knife body (131) through the assembly arm (133) at one end of the length direction of the air knife body (131), and is used for driving the air knife body (131) to reciprocate in the first direction in the water removal cavity (1401). The assembly arm (133) is provided with a first air duct communicating with the second air blowing channel (1311), and the first air duct has a first air inlet, and the first air joint (161) is arranged at the first air inlet.
3. The air-drying water removal mechanism of claim 1, wherein, The driving unit (132) is arranged at one side of the support seat (140) in a second direction and outside the water removal cavity (1401), the projection of the driving unit (132) in the second direction is located in the projection of the support seat (140) in the second direction, and the second direction is the length direction of the air knife body (131).
4. The air-drying water removal mechanism of claim 3, wherein, The support seat (140) is provided with an assembly opening (1403) for the assembly arm (133) to pass through at one of the cavity walls of the water removal cavity (1401); 5. The air-drying water removal mechanism of claim 4, wherein, The air drying and water removal mechanism (100) further includes a telescopic plate (150), both ends of the telescopic plate (150) are mounted on the assembly opening (1403), a through hole is arranged in the middle of the telescopic plate (150) for the assembly arm (133) to pass through, and the telescopic plate (150) is configured to stretch or contract in the first direction.
6. The air-drying water removal mechanism of claim 4, wherein, 7. The air-drying water removal mechanism of claim 6, wherein, 8. The air-drying water removal mechanism of claim 4, wherein, The driving unit (132) is arranged on one side of the support base (140) along a second direction and located in the water removal cavity (1401), a projection of the driving unit (132) along the second direction is located in a projection of the support base (140) along the second direction, and the second direction is a length direction of the air knife body (131).
9. The air-drying water removal mechanism of claim 1, wherein, The water removal plate (120) comprises a plate body (121) provided with the first through hole (1201) and a blowing protrusion (122) protruding at an edge of the first through hole (1201), and the first blowing channel (1202) is arranged in the blowing protrusion (122). The air drying and water removal mechanism (100) further comprises a carrier (110) arranged above the water removal plate (120), and the carrier (110) is provided with a second through hole (1101) penetrating in a vertical direction, and the blowing protrusion (122) can extend into the second through hole (1101).
10. The air-drying water removal mechanism of claim 9, wherein, The carrier (110) is provided with a plurality of second through holes (1101) arranged at intervals along a second direction, the water removal plate (120) is provided with a plurality of first through holes (1201) arranged at intervals along the second direction, the first through holes (1201) and the second through holes (1101) correspond to each other, each first through hole (1201) is provided with the first blowing channel (1202), the water removal plate (120) is provided with a second air duct (1203) communicated with each first blowing channel (1202), the second air duct (1203) has a second air inlet, and the second air inlet is provided with a second air joint (162).
11. The air-drying water removal mechanism of claim 1, wherein, The water removal plate (120) is provided with a water removal position (1001) and a material waiting position (1002), which are arranged at intervals, and the water removal position (1001) is provided with the first through hole (1201) and the first blowing channel (1202).
12. A semiconductor testing apparatus, characterized by comprising: Comprise: A test mechanism is provided with test stations and water removal stations arranged at intervals; The air drying and water removal mechanism (100) of any one of claims 1 to 11 is arranged in the water removal station; and A conveying mechanism is used for picking up the carrier (110) to flow between the water removal station and the test station.