A wafer probe card drying device

By designing a wafer probe card drying device, the hot air is evenly distributed using a drive mechanism and an air supply mechanism, solving the problem of uneven hot air distribution in traditional drying devices. This achieves efficient and uniform drying of the probe cards, improving the performance and service life of the device.

CN224517195UActive Publication Date: 2026-07-17SHENZHEN KEDAXIN TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN KEDAXIN TECH CO LTD
Filing Date
2025-10-16
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Traditional probe card drying devices suffer from uneven hot air distribution, resulting in inconsistent heating of different parts of the probe card, which affects its performance and service life.

Method used

A wafer probe card drying device was designed, including a drying chamber, a placement plate, a drying tube, an electric heating wire, a driving mechanism, an air supply mechanism, and a positioning mechanism. The driving mechanism causes the drying tube to move inside the drying chamber, and the air supply mechanism and the electric heating wire provide uniform hot air to ensure that the hot air is evenly delivered to all positions of the probe card.

Benefits of technology

This method achieves uniform drying of the probe card, improves drying quality and efficiency, and extends the service life of the probe card.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model relates to the field of probe card processing technology, specifically a wafer probe card drying device and drying chamber. The drying device includes: a placement plate movable at the bottom of the drying chamber for supporting the probe card; a drying tube disposed inside the drying chamber, with an electric heating wire at its top; and a driving mechanism disposed inside the drying chamber for driving the drying tube to move within the drying chamber. This utility model, by designing a drying device capable of uniformly drying all positions of the probe card, utilizes an air supply mechanism, an electric heating wire, and a drying tube to provide hot air. The driving mechanism causes the drying tube to move, ensuring that the hot air delivered by the drying tube is evenly distributed to all positions of the probe card. This achieves relatively uniform drying of the probe card, effectively solving the problem of uneven drying in traditional drying methods and improving drying quality and efficiency.
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Description

Technical Field

[0001] This utility model relates to the field of probe card processing technology, specifically a wafer probe card drying device. Background Technology

[0002] In the field of semiconductor manufacturing and testing, wafer probe cards are key components connecting testers and chips on wafers. The stability and reliability of their performance directly affect the accuracy and efficiency of chip testing. After use or cleaning, probe cards often need to be dried to remove residual moisture or cleaning agents, preventing problems such as electrical performance degradation, short circuits, or corrosion caused by moisture, thereby ensuring the smooth progress of subsequent testing processes.

[0003] Traditional probe cards are typically dried using hot air, but this method suffers from uneven heat distribution, resulting in inconsistent heating of different parts of the probe card. This can easily lead to localized overheating or insufficient drying, which in turn affects the overall performance and lifespan of the probe card. Utility Model Content

[0004] This invention addresses the technical problems existing in the prior art by providing a wafer probe card drying device to solve the problem of uneven hot air distribution in existing hot air drying devices, which leads to inconsistent heating of different parts of the probe card.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows:

[0006] A wafer probe card drying apparatus is provided, including a drying chamber, the drying apparatus comprising:

[0007] A placement plate movable at the bottom of the drying oven, the placement plate being used to hold probe cards;

[0008] The drying tube is installed inside the drying chamber, and an electric heating wire is installed at the top of the drying tube;

[0009] A drive mechanism is installed inside the drying chamber, which is used to drive the drying tube to move inside the drying chamber;

[0010] An air supply mechanism is installed at the top of the drying chamber, the air supply mechanism being used to supply gas to the drying pipe; and

[0011] A positioning mechanism is provided on the top of the placement plate, which is used to support and position the probe card.

[0012] Furthermore, the drive mechanism includes:

[0013] Two support seats are installed inside the drying chamber, and the two support seats are symmetrically arranged in the position of the drying chamber.

[0014] A transversely moving lead screw module is disposed on the top of the support base, and a longitudinally moving lead screw module is disposed at the moving end of the transversely moving lead screw module. The moving end of the longitudinally moving lead screw module is fixedly connected to the drying tube.

[0015] A guide frame is disposed on top of another support base, and a guide rod is disposed in the middle of the guide frame. The other end of the longitudinal moving screw module is movably connected to the guide rod.

[0016] Furthermore, the gas supply mechanism includes:

[0017] An air pump is installed at the top of the drying chamber and is used to deliver gas to the drying pipe.

[0018] A storage pipe fixedly connected to the top of the drying oven, the storage pipe extending through the top of the drying oven; and

[0019] The storage pipe is equipped with a corrugated pipe inside, and the two ends of the corrugated pipe are connected to the air pump and the drying pipe, respectively.

[0020] Furthermore, the positioning mechanism includes:

[0021] A drainage trough is provided in the middle of the placement plate;

[0022] Multiple positioning seats are disposed on the top of the placement plate, and the multiple positioning seats are used to support the probe card;

[0023] Two first electric push rods are fixedly installed on the top of the placement plate, and the two first electric push rods are symmetrically arranged; and

[0024] A positioning block is disposed at the output end of the first electric push rod, and the cross-section of the positioning block is U-shaped.

[0025] Furthermore, the bottom of the drying oven is provided with a partition, the middle of the partition is provided with a bottom cover, the bottom of the bottom cover is provided with a liquid storage bottle, and the side wall of the bottom cover is provided with an exhaust groove.

[0026] Furthermore, the top of the partition is provided with two sliding rods, the bottom of the placement plate is provided with multiple sliders, the sliding rods are movably connected to the sliders, the side wall of the drying oven is provided with a through groove, and the side wall of the placement plate is fixedly connected with a baffle that matches the through groove.

[0027] Furthermore, a touch sensor is provided at the rear end of the partition, a touch block is provided on one side of the placement plate, the touch sensor is adapted to the touch block, a locking sleeve is provided on one side of the placement plate, and a second electric push rod is provided at the top of the partition, the output end of the second electric push rod is adapted to the locking sleeve.

[0028] Furthermore, multiple drainage grooves are provided on the side wall of the placement plate, with five drainage grooves arranged as a group, and the multiple groups of drainage grooves are staggered with the support base.

[0029] The beneficial effects of this utility model are:

[0030] This invention designs a drying device that can uniformly dry all parts of a probe card. The probe card is supported by a placement plate, and a positioning mechanism ensures its stable position. A gas supply mechanism, an electric heating wire, and a drying tube work together to provide hot air. A driving mechanism moves the drying tube, so that the hot air delivered by the drying tube is evenly distributed to all parts of the probe card. This achieves relatively uniform drying of the probe card, effectively solving the problem of uneven drying in traditional drying methods and improving drying quality and efficiency. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0032] Figure 2 This is an exploded view of the overall structure of this utility model;

[0033] Figure 3 This is a schematic diagram of the drive mechanism in this utility model;

[0034] Figure 4 This is a schematic diagram of the positioning mechanism in this utility model;

[0035] Figure 5 This is a schematic diagram of the gas supply mechanism in this utility model;

[0036] Figure 6 This is a schematic diagram of the drying tube and electric heating wire in this utility model;

[0037] Figure 7 This is a schematic diagram of the structure of the bottom cover, liquid storage bottle and exhaust channel of this utility model;

[0038] The attached diagram lists the components represented by each number as follows:

[0039] 1. Drying oven; 2. Placement plate; 3. Drying tube; 4. Electric heating wire;

[0040] 5. Drive mechanism; 51. Support base; 52. Lateral movement screw module; 53. Longitudinal movement screw module; 54. Guide frame; 55. Guide rod;

[0041] 6. Gas supply mechanism; 61. Gas pump; 62. Storage pipe; 63. Corrugated pipe;

[0042] 7. Positioning mechanism; 71. Drainage tank; 72. Positioning seat; 73. First electric push rod; 74. Positioning block;

[0043] 8. Partition; 9. Bottom cover; 10. Liquid storage bottle; 11. Vent trough; 12. Sliding rod; 13. Sliding block; 14. Through groove; 15. Baffle; 16. Touch sensor; 17. Touch block; 18. Locking sleeve; 19. Second electric push rod; 20. Leakage tank. Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model. Furthermore, it should be understood that the specific embodiments described herein are merely for explaining this utility model and are not intended to limit this utility model.

[0045] In the description of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0047] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows for communication; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0048] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0049] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0050] The present invention provides the following preferred embodiments:

[0051] Example 1: Reference Figure 1 , 2 and Figure 6 As shown, a wafer probe card drying device includes a drying chamber 1. The drying device includes:

[0052] The placement plate 2 is located at the bottom of the drying oven 1 and is used to hold the probe card;

[0053] The drying tube 3 is installed inside the drying oven 1, and an electric heating wire 4 is installed at the top of the drying tube 3;

[0054] The drive mechanism 5 is installed inside the drying chamber 1 and is used to drive the drying tube 3 to move inside the drying chamber 1.

[0055] An air supply mechanism 6 is installed at the top of the drying chamber 1, which is used to supply gas to the drying pipe 3; and

[0056] The positioning mechanism 7 is located on the top of the placement plate 2 and is used to support and position the probe card.

[0057] In use, the wafer probe card to be dried is placed on the placement plate 2. The positioning mechanism 7 supports and positions the probe card to ensure its stability. The gas supply mechanism 6 is activated to supply gas to the drying tube 3. At the same time, the electric heating wire 4 at the top of the drying tube 3 works to heat the gas, turning it into hot air. The drive mechanism 5 drives the drying tube 3 to move inside the drying chamber 1, so that the drying tube 3 moves above the probe card. The hot air is blown out from the drying tube 3 and acts evenly on the probe card on the placement plate 2, so that the hot air is evenly delivered to all positions of the probe card, realizing the drying operation. In this way, the placement plate 2 supports the probe card, the positioning mechanism 7 ensures its stability, the gas supply mechanism 6, the electric heating wire 4 and the drying tube 3 work together to provide hot air, and the drive mechanism 5 moves the drying tube 3, so that the hot air delivered by the drying tube 3 is evenly delivered to all positions of the probe card, which can achieve more uniform drying of the probe card, effectively solving the problem of uneven drying in traditional drying methods, and improving drying quality and efficiency.

[0058] Example 2: Reference Figure 5 As shown, the drive mechanism 5 includes:

[0059] Two support bases 51 are installed inside the drying chamber 1, and the two support bases 51 are symmetrically arranged in the position of the drying chamber 1.

[0060] A transversely moving screw module 52 is disposed on the top of a support base 51. A longitudinally moving screw module 53 is disposed at the moving end of the transversely moving screw module 52. The moving end of the longitudinally moving screw module 53 is fixedly connected to the drying tube 3.

[0061] A guide frame 54 is mounted on top of another support base 51. A guide rod 55 is provided in the middle of the guide frame 54. The other end of the longitudinal moving screw module 53 is movably connected to the guide rod 55.

[0062] In use, by setting two symmetrical support seats 51 and a transverse moving screw module 52 and a longitudinal moving screw module 53, the drying tube 3 can move precisely in the transverse and longitudinal directions within the drying chamber. The transverse moving screw module 52 drives the longitudinal moving screw module 53, thereby pushing the drying tube 3 to complete multi-directional movement. The guide rod 55 on the guide frame 54 ensures the smooth operation of the drying tube 3, avoids tilting and jamming during the movement of the drying tube 3, and ensures that it moves evenly within the drying chamber 1. Thus, through the drive mechanism 5, the drying tube 3 is driven to move in the transverse and longitudinal directions, so that the drying tube 3 moves to various positions above the probe card.

[0063] Example 3: Reference Figure 5 and Figure 6 As shown, the gas supply mechanism 6 includes:

[0064] The air pump 61, located at the top of the drying chamber 1, is used to supply gas to the drying tube 3.

[0065] A storage pipe 62 is fixedly connected to the top of the drying chamber 1, and the storage pipe 62 penetrates the top of the drying chamber 1; and

[0066] The storage pipe 62 is equipped with a corrugated pipe 63, and the two ends of the corrugated pipe 63 are connected to the air pump 61 and the drying pipe 3, respectively.

[0067] When in use, the gas supply mechanism 6 operates, and the gas pump 61 starts, drawing in external gas and delivering it to the drying pipe 3 through the corrugated pipe 63. The storage pipe 62 is used to accommodate and protect the corrugated pipe 63. The corrugated pipe 63 has a certain degree of elasticity and can freely expand and contract with the movement of the drying pipe 3, ensuring the continuity and stability of gas delivery. This allows hot air to be continuously delivered to the drying pipe 3. Thus, through the cooperation of the gas pump 61, the storage pipe 62, and the corrugated pipe 63, the gas supply mechanism 6 can flexibly adapt to the movement of the drying pipe 3, ensuring stable and reliable gas delivery and providing a sufficient and stable gas source for the drying process. This is beneficial for improving drying efficiency and quality, while also extending the service life of the equipment.

[0068] Example 4: Reference Figure 4 As shown, the positioning mechanism 7 includes:

[0069] A drainage trough 71 is located in the middle of the placement plate 2;

[0070] Multiple positioning seats 72 are provided on the top of the placement plate 2, and the multiple positioning seats 72 are used to support the probe card;

[0071] Two first electric push rods 73 are fixedly installed on the top of the placement plate 2, and the two first electric push rods 73 are symmetrically arranged; and

[0072] The positioning block 74 is located at the output end of the first electric push rod 73, and the cross section of the positioning block 74 is U-shaped.

[0073] In use, multiple positioning seats 72 provide initial support for the probe card. Two first electric push rods 73 are activated, and their output ends drive the U-shaped positioning blocks 74 to move towards the probe card. The U-shaped positioning blocks 74 clamp the probe card from both sides, achieving precise positioning of the probe card. The drain trough 71 is used to drain the liquid dripping from the probe card, preventing liquid accumulation from affecting the drying effect. In this way, the combination of positioning seats 72 and U-shaped positioning blocks 74 can firmly fix the probe card, preventing the probe card from moving or shaking during the drying process, ensuring the stability of drying. The drain trough 71 can drain the liquid in time, avoiding damage to the probe card and drying device, and improving the practicality and reliability of the device.

[0074] Example 5: Reference Figure 3 and Figure 7 As shown, the bottom of the drying oven 1 is provided with a partition 8, the middle of the partition 8 is provided with a bottom cover 9, the bottom of the bottom cover 9 is provided with a liquid storage bottle 10, and the side wall of the bottom cover 9 is provided with an exhaust groove 11.

[0075] During use, the liquid dripping from the probe card passes through the placement plate 2 and falls onto the partition 8. It is then collected by the bottom cover 9 and flows into the storage bottle 10. The exhaust duct 11 is used to expel moisture from the drying chamber 1, maintaining air circulation within the drying chamber 1. This facilitates the continuous drying of the probe card by hot air, improving drying efficiency. Thus, the combination of the partition 8, bottom cover 9, and storage bottle 10 effectively collects and stores the liquid generated during the drying process, preventing the liquid from flowing around inside the drying chamber 1 and causing contamination and damage. The exhaust duct 11 ensures air circulation within the drying chamber 1, accelerating moisture evaporation and further improving the drying effect.

[0076] Example 6: Reference Figure 2 and Figure 4 As shown, the top of the partition 8 is provided with two sliding rods 12, and the bottom of the placement plate 2 is provided with multiple sliders 13. The sliding rods 12 and the sliders 13 are movably connected. The side wall of the drying oven 1 is provided with a through groove 14, and the side wall of the placement plate 2 is fixedly connected with a baffle 15 that matches the through groove 14.

[0077] In use, the placement plate 2 is movably connected to the slide bar 12 at the top of the partition 8 via the slider 13 at the bottom, allowing the placement plate 2 to slide smoothly on the slide bar 12. When it is necessary to pull the placement plate 2 out of the drying chamber 1 to place or remove the probe card, the operator pulls the baffle 15 on the side wall of the placement plate 2. The baffle 15 drives the placement plate 2 to move outward along the slide bar 12. The through groove 14 provides space for the movement of the placement plate 2. Conversely, pushing the baffle 15 can push the placement plate 2 into the drying chamber 1. In this way, the movement of the placement plate 2 is more stable and smooth through the cooperation of the slide bar 12 and the slider 13, which facilitates the operator's placement and removal of the probe card. The baffle 15 and the through groove 14 reduce the heat loss in the drying chamber 1 and improve the energy efficiency and practicality of the device.

[0078] Example 7: Reference Figure 2 As shown, a touch sensor 16 is provided at the rear end of the partition 8, a touch block 17 is provided on one side of the placement plate 2, the touch sensor 16 is adapted to the touch block 17, a locking sleeve 18 is provided on one side of the placement plate 2, and a second electric push rod 19 is provided at the top of the partition 8, the output end of the second electric push rod 19 is adapted to the locking sleeve 18.

[0079] In use, when the placement plate 2 moves to the designated position inside the drying chamber 1, the contact block 17 on the placement plate 2 contacts the contact sensor 16 at the rear end of the partition 8. The contact sensor 16 transmits a signal to the control system, which then controls the second electric push rod 19 to start. The output end of the second electric push rod 19 extends into the locking sleeve 18 on one side of the placement plate 2, locking the placement plate 2 in its current position and preventing it from moving during the drying process. Thus, the combination of the contact sensor 16, the contact block 17, the second electric push rod 19, and the locking sleeve 18 achieves the automatic locking function of the placement plate 2. After the placement plate 2 reaches the correct position, it can automatically lock, ensuring the stability of the placement plate 2 during the drying process, improving the safety and reliability of the drying process, and reducing the tediousness and errors of manual operation.

[0080] Example 8: Reference Figure 4 As shown, multiple leakage grooves 20 are provided on the side wall of the placement plate 2. Five leakage grooves 20 are arranged as a group, and the multiple groups of leakage grooves 20 and the support base 51 are staggered.

[0081] During use, in the drying process, the liquid dripping from the probe card flows out through the drain groove 20 on the side wall of the placement plate 2. Multiple sets of drain grooves 20 are arranged in groups of five and staggered with the support base 51 to avoid the support base 51 blocking the drain groove 20 and ensure that the liquid can be discharged smoothly from the drain groove 20.

[0082] Working Principle: In use, the wafer probe card to be dried is first placed on the placement plate 2. Multiple positioning seats 72 provide initial support for the probe card. Two first electric push rods 73 are activated, their output ends driving U-shaped positioning blocks 74 to move towards the probe card. The U-shaped positioning blocks 74 clamp the probe card from both sides, achieving precise positioning. Next, the placement plate 2 is pushed into the drying chamber 1. The contact block 17 on the placement plate 2 contacts the contact sensor 16 at the rear end of the partition 8. The contact sensor 16 transmits a signal to the control system, which then activates the second electric push rod 19. The output end of the second electric push rod 19 extends into the locking sleeve 18 on one side of the placement plate 2, locking the placement plate 2 in its current position to prevent movement during drying. The air pump 61 is activated, drawing in external gas and delivering it to the drying tube through the corrugated pipe 63. 3. The storage tube 62 is used to accommodate and protect the corrugated tube 63. The corrugated tube 63 has a certain degree of elasticity and can freely expand and contract with the movement of the drying tube 3. At the same time, the electric heating wire 4 at the top of the drying tube 3 works to heat the gas and turn it into hot air. The two symmetrical support seats 51 and the transverse moving screw module 52 and the longitudinal moving screw module 53 enable the drying tube 3 to move precisely in the transverse and longitudinal directions within the drying chamber. This allows the drying tube 3 to move above the probe card. Hot air is blown out from the drying tube 3 and acts evenly on the probe card on the placement plate 2, so that the hot air is evenly delivered to all positions of the probe card to achieve the drying operation.

[0083] The beneficial effects of this utility model are specifically reflected in the fact that the above description is only a preferred embodiment of this utility model and is not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer probe card drying device, comprising a drying chamber (1), characterized in that, The drying device includes: A placement plate (2) is located at the bottom of the drying oven (1), and the placement plate (2) is used to carry the probe card; The drying tube (3) is installed inside the drying box (1), and an electric heating wire (4) is installed on the top of the drying tube (3). The drive mechanism (5) is installed inside the drying box (1) and is used to drive the drying tube (3) to move inside the drying box (1); An air supply mechanism (6) is provided at the top of the drying chamber (1), which is used to supply gas to the drying pipe (3); and The positioning mechanism (7) is located on the top of the placement plate (2) and is used to support and position the probe card.

2. The wafer probe card drying apparatus according to claim 1, characterized in that, The drive mechanism (5) includes: Two support seats (51) are provided inside the drying box (1), and the two support seats (51) are symmetrically arranged in the drying box (1); A transverse moving screw module (52) is provided on the top of the support base (51), and a longitudinal moving screw module (53) is provided at the moving end of the transverse moving screw module (52). The moving end of the longitudinal moving screw module (53) is fixedly connected to the drying tube (3); and A guide frame (54) is provided on the top of another support base (51), and a guide rod (55) is provided in the middle of the guide frame (54). The other end of the longitudinal moving screw module (53) is movably connected to the guide rod (55).

3. The wafer probe card drying apparatus according to claim 1, characterized in that, The gas supply mechanism (6) includes: An air pump (61) is installed at the top of the drying chamber (1) and is used to supply gas to the drying tube (3); A storage pipe (62) is fixedly connected to the top of the drying oven (1), and the storage pipe (62) penetrates the top of the drying oven (1); and The storage pipe (62) is equipped with a corrugated pipe (63) inside, and the two ends of the corrugated pipe (63) are connected to the air pump (61) and the drying pipe (3) respectively.

4. The wafer probe card drying apparatus according to claim 1, characterized in that, The positioning mechanism (7) includes: A drain trough (71) is provided in the middle of the placement plate (2); Multiple positioning seats (72) are disposed on the top of the placement plate (2), and the multiple positioning seats (72) are used to support the probe card; Two first electric push rods (73) are fixedly installed on the top of the placement plate (2), and the two first electric push rods (73) are symmetrically arranged; and A positioning block (74) is provided at the output end of the first electric push rod (73), and the cross section of the positioning block (74) is U-shaped.

5. The wafer probe card drying apparatus according to claim 1, characterized in that, The bottom of the drying oven (1) is provided with a partition (8), the middle of the partition (8) is provided with a bottom cover (9), the bottom of the bottom cover (9) is provided with a liquid storage bottle (10), and an exhaust groove (11) is provided on the side wall of the bottom cover (9).

6. The wafer probe card drying apparatus according to claim 5, characterized in that, The top of the partition (8) is provided with two sliding rods (12), and the bottom of the placement plate (2) is provided with multiple sliders (13). The sliding rods (12) and the sliders (13) are movably connected. The side wall of the drying box (1) is provided with a through groove (14), and the side wall of the placement plate (2) is fixedly connected with a baffle (15) that is compatible with the through groove (14).

7. The wafer probe card drying apparatus according to claim 5, characterized in that, A touch sensor (16) is provided at the rear end of the partition (8), a touch block (17) is provided on one side of the placement plate (2), the touch sensor (16) is adapted to the touch block (17), a lock sleeve (18) is provided on one side of the placement plate (2), and a second electric push rod (19) is provided at the top of the partition (8), the output end of the second electric push rod (19) is adapted to the lock sleeve (18).

8. The wafer probe card drying apparatus according to claim 2, characterized in that, Multiple leakage grooves (20) are provided on the side wall of the placement plate (2). Five leakage grooves (20) are arranged as a group, and multiple groups of leakage grooves (20) are staggered with the support base (51).