一种焊带拍扁厚度测量工具
By designing a tool to measure the thickness of flattened solder strips, the problem of measuring the thickness and length of flattened solder strips was solved, enabling rapid measurement and accurate identification of defective locations, thereby improving production efficiency and saving labor costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHINT NEW ENERGY TECH CO LTD
- Filing Date
- 2025-06-25
- Publication Date
- 2026-07-17
AI Technical Summary
The measurement and testing of the thickness and length of the flattened solder strip involves a large amount of data, difficult testing methods, and long testing time, which affects the production efficiency of the production line and makes it impossible to quickly identify the defective location of the solder strip.
A tool for measuring the thickness of flattened solder strips was designed, comprising an upper part of the tester, a lower part of the tester, and a solder strip adsorption sticker. The length is measured using a test block, and the thickness is measured using a metal panel and a measuring instrument. Real-time data is displayed through a parallel micrometer and a sensor.
It enables rapid measurement of solder strip thickness and length, accurate identification of defect locations, reduced testing time, and savings in labor costs.
Smart Images
Figure CN224517605U_ABST
Abstract
Claims
1. A ribbon flattening thickness measurement tool characterized by, Include: The tester upper part (1), tester lower part (2), solder strip adsorption stickers (3); Wherein, the tester upper part (1) includes a fixed frame (11) and a test block (12) arranged in the middle of the fixed frame (11), one side of the solder strip adsorption stickers (3) is pasted on the fixed frame (11) and the other side adsorbs and fixes the solder strip, and the test block (12) measures the length of the solder strip; The tester lower part (2) includes a metal panel (21) and a measuring instrument (22) arranged in the middle of the metal panel (21), the tester lower part (2) is pressed on the tester upper part (1) to compress the solder strip, and the measuring instrument (22) measures the thickness of the solder strip.
2. A solder strip flattening thickness measurement tool according to claim 1, wherein, The middle of the metal panel (21) is provided with a plurality of slot type openings (211), the slot type openings (211) are arranged in parallel, the bottom of the slot type opening (211) is provided with a control button, and the measuring instrument (22) is a parallel micrometer, and the parallel micrometer is respectively placed on the control button to measure the thickness of the solder strip.
3. A solder strip flattening thickness measurement tool according to claim 2, wherein, The control button is provided with a sensor inside, the tester lower part (2) further includes an operation panel (23) electrically connected to the control button and a display screen (24) electrically connected to the sensor.
4. A solder strip flattening thickness measurement tool according to claim 1, wherein, The side of the fixed frame (11) pasting the solder strip adsorption stickers (3) is the identification scale side (121) of the test block (12) to measure the length of the solder strip, and the other side is the display scale side (122) of the test block (12), the display scale side (122) is recessed corresponding to the scale position of the identification scale side (121) to enlarge the display scale.
5. A solder ribbon flattening thickness measurement tool according to claim 1, wherein, The fixed frame (11) is respectively provided with a handle (111) at both ends to operate the fixed frame (11).