Sensor bracket and sensor

Abstract

This application provides a sensor bracket and a sensor for fixing a sensing chip onto a smart follower bracket. The smart follower bracket includes a first mounting portion for mounting and fixing a display. The sensor bracket includes a first bracket body with at least one chip mounting portion and at least one first connecting portion. The first connecting portion is used to connect to the first mounting portion. The chip mounting portion is used to assemble the sensing chip. The first bracket body is designed to deform under pressure applied to the display to transmit the pressure to the sensing chip. This provides physical protection for the sensor chip, improves its reliability, and extends its lifespan.

Description

Technical Field

[0001] This application belongs to the field of sensor technology, specifically relating to a sensor bracket and a sensor. Background Technology

[0002] Currently, sensors are used in the monitor stand industry due to various functional requirements. Existing sensor mounting brackets typically expose the sensor chip outside the bracket, which may lead to bracket damage or displacement, resulting in reduced sensitivity or even failure. Utility Model Content

[0003] This application provides a sensor bracket and a sensor, which aims to provide physical protection for the sensor chip, improve the reliability of the sensor chip, and extend the chip life.

[0004] In a first aspect, this application provides a sensor bracket for fixing a sensing chip onto a smart follower bracket. The smart follower bracket includes a first mounting portion for mounting and fixing a display. The sensor bracket includes a first bracket body, on which at least one chip mounting portion and at least one first connecting portion are provided.

[0005] The first connecting part is used to connect with the first mounting part;

[0006] The chip mounting section is used to assemble the sensing chip;

[0007] The first bracket body is used to deform under pressure when pressure is applied to the display in order to transmit the pressure to the sensing chip.

[0008] In conjunction with the first aspect, in one possible embodiment, a functional region is formed from a first end of the first support body toward a second end of the first support body by a thinning process, the functional region including the at least one chip mounting portion; the thickness of the functional region in the direction parallel to the first end and the second end of the first support body is less than that of at least one of the first end and the second end.

[0009] In conjunction with the first aspect, in one possible embodiment, the chip mounting portion has a first thinning region.

[0010] In conjunction with the first aspect, in one possible embodiment, the intelligent follow-up support includes a second support body;

[0011] The first support body is also provided with at least one second connecting part; the at least one second connecting part is used to connect with the second support body.

[0012] In conjunction with the first aspect, in one possible embodiment, the intelligent follow-up support further includes a control module; the first support body also has a control module receiving cavity, which is used to receive the control module.

[0013] In conjunction with the first aspect, in one possible embodiment, the control module receiving cavity is provided with a first threading hole.

[0014] In conjunction with the first aspect, in one possible embodiment, the chip mounting portion is provided with a second through hole.

[0015] In conjunction with the first aspect, in one possible embodiment, at least one second thinning region is provided on the first support body, the at least one second thinning region being distributed between the chip mounting portion and the first connecting portion, and / or between the chip mounting portion and the second connecting portion.

[0016] In conjunction with the first aspect, in one possible embodiment, the at least one second thinning region includes a third thinning region disposed between the chip mounting portion and the first connecting portion.

[0017] In conjunction with the first aspect, in one possible embodiment, the at least one second thinning region includes a fourth thinning region disposed between the chip mounting portion and the second connection portion.

[0018] Secondly, this application provides a sensor, including a sensing chip and the sensor bracket described in the first aspect.

[0019] As can be seen, the sensor bracket in this application is used to fix the sensing chip on an intelligent follower bracket. The intelligent follower bracket includes a first mounting part for mounting and fixing a display. The sensor bracket includes a first bracket body, on which at least one chip mounting part and at least one first connecting part are provided. The first connecting part is used to connect with the first mounting part. The chip mounting part is used to assemble the sensing chip. The first bracket body is used to deform under pressure applied to the display to transmit the pressure to the sensing chip. This provides physical protection for the sensor chip, improves its reliability, and extends its lifespan. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic block diagram of the structure of an intelligent follow-up support provided in an embodiment of this application;

[0022] Figure 2 This is a schematic block diagram of a sensor bracket provided in an embodiment of this application;

[0023] Figure 3 This is a schematic diagram of the structure of the first type of sensor bracket provided in the embodiments of this application;

[0024] Figure 4 This is a schematic diagram of the structure of the second type of sensor bracket provided in the embodiments of this application;

[0025] Figure 5 This is a schematic diagram of the structure of the third type of sensor bracket provided in the embodiments of this application;

[0026] Figure 6 This is a schematic diagram of the structure of the fourth type of sensor bracket provided in the embodiments of this application. Detailed Implementation

[0027] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0028] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, systems, products, or apparatuses.

[0029] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0030] Currently, existing sensor mounting brackets typically expose the sensor chip outside the bracket, which may cause damage or displacement of the bracket, leading to reduced sensitivity or even failure.

[0031] To address the aforementioned issues, this application provides a sensor bracket. This sensor bracket can be applied to scenarios requiring sensor chip protection. The sensor bracket in this application is used to fix a sensing chip onto a smart follow-up bracket. The smart follow-up bracket includes a first mounting portion for mounting and fixing a display 20. The sensor bracket includes a first bracket body, on which at least one chip mounting portion and at least one first connecting portion are provided. The first connecting portion is used to connect to the first mounting portion. The chip mounting portion is used to assemble the sensing chip. The first bracket body is used to deform under pressure applied to the display 20 to transmit the pressure to the sensing chip. This provides physical protection for the sensor chip, improves its reliability, and extends its lifespan. This solution is applicable to various scenarios, including but not limited to the applications mentioned above.

[0032] The specific structure of the sensor bracket in this application will be described in detail below.

[0033] Please see Figures 1 to 6 This application provides a sensor bracket for fixing a sensing chip 1312 onto a smart follower bracket 10. The smart follower bracket 10 includes a first mounting portion 12 for mounting and fixing a display 20. The sensor bracket includes a first bracket body 131, on which at least one chip mounting portion 1311 and at least one first connecting portion 1313 are provided. The first connecting portion 1313 is used to connect to the first mounting portion 12. The chip mounting portion 1311 is used to assemble the sensing chip 1312. The first bracket body 131 is used to deform under pressure when pressure is applied to the display 20 to transmit the pressure to the sensing chip 1312.

[0034] In practice, after the sensing chip 1312 is assembled on the sensor bracket, a complete sensor 13 is obtained. This sensor 13 is applied to the intelligent follow-up bracket 10 to obtain the force parameters applied to the display 20.

[0035] For details, please refer to Figure 1 The intelligent follow-up bracket 10 is used to mount the display 20. The intelligent follow-up bracket 10 includes a second bracket body 11, a first mounting part 12, at least one sensor 13, a control module 14, and a drive mechanism 15. The first mounting part 12 is mounted on the second bracket body 11 for mounting the display 20. The control module 14 is connected to the at least one sensor 13 and the drive mechanism 15, and the drive mechanism 15 is connected to the second bracket body 11. The sensor 13 is used to acquire the force parameters applied to the display 20 and output the force parameters to the control module 14. The control module 14 is used to determine the position adjustment parameters according to the force parameters and output a corresponding control signal to the drive mechanism 15 according to the position adjustment parameters. The drive mechanism 15 is used to drive the second bracket body 11 to adjust the position of the first mounting part 12 according to the control signal.

[0036] Please refer to Figures 2 to 6 The sensor 13 includes a sensor bracket and a sensing chip 1312. The sensing chip 1312 is a force-sensitive chip that uses a stress-strain detection method. The sensor bracket is made of an alloy material with high strength, high elasticity, good machinability, fatigue resistance, and stable mechanical properties. The sensor bracket includes a first bracket body 131, which has at least one chip mounting portion 1311 and at least one first connecting portion 1313. The sensing chip 1312 is assembled to the chip mounting portion 1311 by means of pasting, welding, or screw fixing, so that the sensing chip 1312 can detect the minute strain (deformation) generated on the first bracket body 131. The sensing chip 1312 converts the minute strain into an extremely small change in resistance for measurement, thereby identifying the user's operating intention on the display 20. It is understood that the sensing chip 1312 can also be assembled to the chip mounting portion 1311 in other ways, as long as the sensing chip 1312 can be fixed to the chip mounting portion 1311, it falls within the scope of the embodiments of this application.

[0037] The first bracket body 131 is connected to the first mounting portion 12 of the intelligent follow-up bracket 10 via the first connecting portion 1313. This allows the sensor bracket and the display 20 to be simultaneously fixed to the first mounting portion 12. Therefore, the force applied to the display 20 is transmitted to the first mounting portion 12, and then the first mounting portion 12 transmits the force to the sensor bracket via the first connecting portion 1313. Optionally, the specific structure of the first connecting portion 1313 may include, but is not limited to, screw holes, grooves, protrusions, snap-fits, or other connecting structures, as long as it can fix the first bracket body 131 to the chip mounting portion 1311, it falls within the scope of this application's embodiments. When the first connecting portion 1313 is a screw hole, the first mounting portion 12 can be a mounting bracket with corresponding mounting holes. Screws are passed through the mounting holes and screw holes in sequence to achieve the connection and fixation between the first bracket body 131 and the first mounting portion 12. It is understood that the first mounting portion 12 can also have other structures, and this is not a limitation.

[0038] Specifically, users can directly express their control intentions within the bezel area of ​​the display 20. For example, lifting, pulling up, and swiping up indicate that the stand should rise; pressing down, pulling down, and swiping down indicate that the stand should fall; pushing left, swiping left, and pulling left indicate that the stand should move to the left; and pushing right, swiping right, and pulling right indicate that the stand should move to the right. Operations in other directions are similar and will not be listed here. The user's control intention is transmitted via the bezel of the display 20 to the first mounting part 12, then to the mounting fasteners, and finally to the sensor bracket. The sensing chip 1312 then detects the minute strain on the sensor bracket, converting the resistance change caused by the weak force signal of the control action into a corresponding electrical signal to obtain the corresponding force parameters. These force parameters are then uploaded to the control module 14 via wired or wireless means.

[0039] The control module 14 can be a microcontroller, a control circuit, or a circuit or device including a controller and peripheral circuits, or other circuits or devices with corresponding computing capabilities. The output terminal of the sensing chip 1312 is connected to the input terminal of the control module 14. The electrical signal (force parameter) generated by the sensing chip 1312 is processed by a signal conditioning circuit (including filtering and amplification modules) to remove interference noise, and after conversion by an analog-to-digital converter chip or analog-to-digital converter circuit, it enters the control module 14 for signal analysis and processing. The control module 14 has preset analysis and control algorithms. By analyzing the force signal and rate of change, it identifies and understands the user's desired control intention (direction of lifting, amplitude, stop position, etc.). Then, it generates corresponding control signals according to the preset control logic and outputs them to the drive mechanism 15. The drive mechanism 15 adjusts the height, lateral position, and other spatial positions of the second support body 11, ultimately realizing the position adjustment of the display 20 based on the user's intention perception.

[0040] As can be seen, in this embodiment, physical protection is provided for the sensor 13 chip while force transmission is provided for the sensing chip 1312, ensuring the force detection function of the sensing chip 1312 while improving the reliability of the sensor 13 chip and extending the chip life.

[0041] In one possible embodiment, a functional region is formed from a first end of the first support body 131 toward a second end of the first support body 131 by a thinning process. The functional region includes the at least one chip mounting portion 1311. The thickness of the functional region in the direction parallel to the first end and the second end of the first support body 131 is less than that of at least one of the first end and the second end.

[0042] In one possible embodiment, a first thinning region is provided in the chip mounting portion 1311.

[0043] In a specific implementation, the chip mounting section 1311 can be a region directly defined on the first bracket body 131, and the sensing chip 1312 can be mounted on that region. Although this method can also achieve force detection for multiple displays 20, due to the thickness of the first bracket body 131, when the force on the display 20 is transmitted to the first bracket body 131, the deformation of the first bracket body 131 is small, which has a certain impact on the sensing chip 1312's ability to recognize the deformation.

[0044] Based on this, in this embodiment, a thinning process is used to thin the area that is designated as the chip mounting portion 1311, resulting in a chip mounting portion 1311 with a smaller thickness. This makes it easier for the chip to deform under stress. Under the same force, the deformation amplitude is greater than before thinning, making it easier for the sensing chip 1312 to identify the deformation and improving the detection sensitivity of the sensor 13.

[0045] In one possible embodiment, the intelligent follow-up bracket 10 includes a second bracket body 11; the first bracket body 131 is further provided with at least one second connecting part 1314; the at least one second connecting part 1314 is used to connect with the second bracket body 11.

[0046] In a specific implementation, a second connecting part 1314 is provided on the first bracket body 131, so that the first bracket body 131 can be fixed on the second bracket body 11. After the first bracket body 131 and the second bracket body 11 are connected, the display 20, the first mounting part 12, the first bracket body 131 and the second bracket body 11 are connected in sequence to form a whole, thereby fixing the first bracket body 131. The second bracket body 11 provides support for the first bracket body 131. When the display 20 is subjected to force, it is easier to transmit the force to the first bracket body 131, which is beneficial for detecting the force parameters.

[0047] In one possible embodiment, the first support body 131 is further provided with a control module accommodating cavity 1315.

[0048] In a specific implementation, a control module receiving cavity 1315 is opened on the first support body 131, and the control module 14 of the intelligent follow-up support 10 is set in the control module receiving cavity 1315. This not only makes use of the extra space on the first support body 131, but also removes part of the first support body 131, which is equivalent to thinning, making the first support body 131 easier to deform, thereby improving the detection sensitivity of the sensor 13.

[0049] Furthermore, by directly placing the control module 14 in the first bracket body 131, the signal transmission distance between the control module 14 and the sensing chip 1312 becomes very small, and the transmission delay is almost negligible. This improves the overall speed of generating control signals and enhances the response speed of the intelligent follow-up bracket 10 to user intentions.

[0050] In one possible embodiment, the control module accommodating cavity 1315 has a first threading hole 1316.

[0051] In specific implementation, when wired transmission is used between the sensing chip 1312 and the control module 14, a first through-hole 1316 is provided, allowing the data line to be directly connected to the sensing chip through the first through-hole 1316 in the control module accommodating cavity 1315. This shortens the data line length, and the first through-hole 1316 also constrains the data line, effectively tidying up the wiring and preventing it from becoming cluttered.

[0052] In one possible embodiment, the chip mounting portion 1311 has a second through hole 1317.

[0053] In specific implementation, when wired transmission is used between the sensing chip 1312 and the control module 14, a second through-hole 1317 is provided, allowing the data line to be directly connected to the control module 14 through the second through-hole 1317 in the chip mounting part 1311. This shortens the data line length, and the second through-hole 1317 also constrains the data line, effectively tidying up the cable and preventing it from becoming cluttered.

[0054] In one possible embodiment, at least one second thinning region is provided on the first support body 131, and the at least one second thinning region is distributed between the chip mounting portion 1311 and the first connecting portion 1313, and / or between the chip mounting portion 1311 and the second connecting portion 1314.

[0055] In specific implementation, in addition to setting a thinning area in the chip mounting section 1311, a corresponding second thinning area can also be set in other areas of the first bracket body 131 through a thinning process. The number of the second thinning areas is not limited and can be selected according to the size, shape and product requirements of the first bracket body 131. There is no unique limitation here.

[0056] Optionally, the at least one second thinning region includes a third thinning region 1318, which is disposed between the chip mounting portion 1311 and the first connecting portion 1313.

[0057] In this embodiment, since the pressure applied to the display 20 is transmitted from the first connecting portion 1313 to the chip mounting portion 1311, a third thinning region 1318 is provided between the chip mounting portion 1311 and the first connecting portion 1313. This makes the force transmission path between the first connecting portion 1313 and the chip mounting portion 1311 very thin or very thin, thus making the area between the first connecting portion 1313 and the chip mounting portion 1311 more easily deformable. This allows the sensing chip 1312 to more easily detect the deformation and identify the force parameters, improving the response speed of the sensor 13.

[0058] Optionally, the at least one second thinning region includes a fourth thinning region 1319, which is disposed between the chip mounting portion 1311 and the second connecting portion 1314.

[0059] In this embodiment, since the first support body 131 is connected to the second support body 11 via the second connecting portion 1314, a fourth thinning region 1319 is provided in the area between the second connecting portion 1314 and the chip mounting base, which can further increase the magnitude of the sensor support's deformation under stress. This makes it easier for the sensing chip 1312 to detect the deformation and thus identify the stress parameters, thereby improving the response speed of the sensor 13.

[0060] The sensor bracket in this application will be described below with a specific example.

[0061] In one possible embodiment, an isolation wall 132 is provided between the at least one chip mounting portion 1311, and at least one sensing chip 1312 is attached to the isolation wall 132; at least one second through hole 1317 is provided on the isolation wall 132.

[0062] In practice, when multiple chip mounting sections 1311 are provided, isolation between the chip mounting sections 1311 is required. If isolation is not performed, mutual interference may occur between the sensing chips 1312.

[0063] Specifically, an isolation wall 132 is provided between different chip mounting portions 1311. This isolation wall 132 can be in the form of a semi-enclosed enclosure or only include isolation in one or two directions to separate adjacent chip mounting portions 1311. The specific separation form can be selected according to the actual situation and is not limited to a single form. At the same time, a second wiring hole 1317 is opened on the isolation wall 132 to gather the wires connected to multiple sensing chips 1312 and guide these wires to the control module 14.

[0064] In this way, the separation between different sensing chips 1312 is achieved, avoiding mutual interference between different sensing chips 1312, while the cable management function is realized through the second wire hole 1317.

[0065] Example 1

[0066] Please see Figure 3This embodiment provides a sensor bracket, including a first bracket body 131, which may be a substrate. At least one chip mounting portion 1311 is provided on the third end face 1310 of the substrate, and each chip mounting portion 1311 is used to accommodate a sensing chip 1312. Optionally, the chip mounting portion 1311 may be a groove extending from the third end face 1310 in a direction away from the third end face 1310, or a groove recessed inwards towards the third end face 1310. Any other structure of the chip mounting portion 1311 can be obtained, and its uniqueness is not limited here. At least one chip mounting portion 1311 is provided with an isolation wall 132, which separates adjacent chip mounting portions 1311 in a semi-enclosed manner.

[0067] The chip mounting portion 1311 is provided with a first connecting portion 1313 for connecting with the first mounting portion 12. Optionally, the first connecting portion 1313 can be a first through hole, and a corresponding second through hole is provided on the first mounting portion 12. Then, the substrate is fixed to the first mounting portion 12 by screws passing through the first and second through holes. It is understood that the first connecting portion 1313 can also be other structures, such as grooves, protrusions, bayonets, etc., which can be selected as needed, and no unique limitation is made here.

[0068] Furthermore, at least one second connecting portion 1314 is provided on the substrate, through which it can be connected to the second support body 11 of the intelligent follower bracket 10. Specifically, taking four second connecting portions 1314 as an example, the four second connecting portions 1314 are distributed at the four corners of the substrate, and the substrate is fixed to the second support body 11 through the second connecting portions 1314 at the four corners. Optionally, the second connecting portion 1314 can be a third through hole, and a corresponding fourth through hole is provided on the second support body 11. Then, the substrate is fixed to the second support body 11 by screws passing through the third through hole and the fourth through hole. It is understood that the second connecting portion 1314 can also be other structures, such as grooves, protrusions, bayonets, etc., which can be selected as needed, and are not limited to a single type here.

[0069] At least one sensor 13 accommodating cavity includes a sensor 13 accommodating cavity, so that only one sensing chip 1312 is mounted on the sensor bracket to collect force parameters.

[0070] In another example, at least one sensor 13 accommodating cavity may also include multiple sensor 13 accommodating cavities, such as two or four, etc., so that the force parameters collected by multiple sensing chips 1312 can be mutually verified to improve the accuracy of user intent recognition.

[0071] The first bracket body 131 is also provided with at least one mating part, the shape of which is adapted to the shape of the mounting area of ​​the second bracket body 11. When the first bracket body 131 is mounted on the second bracket body 11, the first bracket body 131 and the second bracket body 11 can fit tightly together, increasing the stability of the sensor bracket mounted on the second bracket body 11.

[0072] Example 2

[0073] Please see Figure 4 This embodiment provides a sensor bracket, including a first bracket body 131, which can be a cuboid. A first connecting portion 1313 is provided at each of the two ends of the cuboid, and the two ends are respectively connected to a first mounting portion 12 through the corresponding first connecting portion 1313. Thus, both ends of the first bracket body 131 can transmit force, transferring the deformation to the sensing chip 1312. The specific shape of the first connecting portion 1313 is the same as in the above-described solution and will not be repeated here.

[0074] Chip mounting portions 1311 are provided at both ends of the first bracket body 131, so two sensing chips 1312 can be assembled. This results in a force parameter acquisition point being formed at each end of the first bracket body 131. As a result, the force parameters collected by multiple sensing chips 1312 can be mutually verified on a single sensor bracket, thereby improving the accuracy of user intent recognition.

[0075] In addition, a control module receiving cavity 1315 is provided in the middle of the first support body 131, through which the control module receiving cavity 1315 is used to place the control module 14 of the intelligent follow-up support 10.

[0076] Furthermore, a first wire hole 1316 is opened in the control module accommodating cavity 1315, so that the data line of the control module 14 can be transmitted from the first wire hole 1316 and then connected to the sensing chip 1312.

[0077] Furthermore, by providing at least one second connecting portion 1314 between each chip mounting portion 1311 and the control module accommodating cavity 1315, second connecting portions 1314 at both ends for connecting the second bracket body 11 can be obtained. The first bracket body 131 and the second bracket body 11 are connected and fixed through the second connecting portions 1314 at both ends.

[0078] Specifically, a second thinning region is provided at each end of the first support body 131. The second thinning region is made by a thinning process, such as cutting with a lathe or drilling with a drilling device, etc., and is not limited to a single type.

[0079] Example 3

[0080] Please see Figure 5 and Figure 6 This embodiment provides a sensor bracket, including a first bracket body 131, which can be S-shaped, and the S-shape is obtained by thinning a cuboid.

[0081] Specifically, at least one chip mounting portion 1311 is provided at the center of the first support body 131 of the cuboid. At least one groove is formed by a thinning process on the chip mounting portion 1311, and a sensing chip 1312 is assembled in the groove. It is understood that the shape formed after thinning the chip mounting portion 1311 may not be a groove, but a plane or other shapes, and no unique limitation is made here.

[0082] A first connecting portion 1313 is provided at one end of the cuboid, and a second connecting portion 1314 is provided at the other end of the cuboid. Then, a cutout (equivalent to a thinning process) is made between the first connecting portion 1313 and the chip mounting base to form the lower half of the S-shape. Finally, a cutout is made between the second connecting portion 1314 and the chip mounting portion 1311 to form the upper half of the S-shape, ultimately obtaining the S-shaped first support body 131.

[0083] This makes it easier for the sensing chip 1312 to detect the deformation and thus identify the force parameters, thereby improving the response speed of the sensor 13.

[0084] Furthermore, a second wire hole 1317 is opened in the chip mounting part 1311, and the wires connected to the sensing chip 1312 are passed through the second wire hole 1317 and connected to the control module 14.

[0085] Furthermore, an isolation wall 132 is provided between the at least one chip mounting portion 1311, and at least one sensing chip 1312 is mounted on the isolation wall 132; the isolation wall 132 has at least one second wiring hole 1317. Taking two chip mounting portions 1311 as an example, a first chip mounting portion and a second chip mounting portion are respectively formed on the first end face 133 and the second end face 134 of the functional area, and an isolation wall 132 is formed between the first mounting portion and the second mounting portion in the functional area to separate the first chip mounting portion and the second chip mounting portion. Optionally, a second wiring hole 1317 can be formed on the chip mounting portion 1311 to collect the wires connected to the first chip mounting portion and the second chip mounting portion, and guide them to the control module 14 through the second wiring hole 1317. In this way, the separation between different sensing chips 1312 is achieved, avoiding mutual interference between different sensing chips 1312, and the wiring function is realized through the second wiring hole 1317.

[0086] This application provides a sensor, including a sensing chip 1312 and the sensor bracket in the above embodiment.

[0087] In a specific implementation, the sensing chip 1312 is mounted on a sensor bracket, which is used to fix the sensing chip 1312 to the intelligent follow-up bracket 10. The intelligent follow-up bracket 10 includes a first mounting part 12 for mounting and fixing the display 20. The sensor bracket includes a first bracket body 131, on which at least one chip mounting part 1311 and at least one first connecting part 1313 are provided. The first connecting part 1313 is used to connect with the first mounting part 12. The chip mounting part 1311 is used to mount the sensing chip 1312. When pressure is applied to the display 20, the first bracket body 131 is deformed by the pressure to transmit the pressure to the sensing chip 1312. This provides physical protection for the sensor chip, improves the reliability of the sensor chip, and extends the chip's lifespan.

[0088] While this application discloses the above information, it is not limited thereto. Any person skilled in the art can easily conceive of variations or substitutions without departing from the spirit and scope of this application, and can make various alterations and modifications, including combinations of the different functions and implementation steps described above, as well as software and hardware implementation methods, all of which are within the protection scope of this application.

Claims

1. A sensor holder, characterized in that The sensor bracket is used to fix a sensor chip onto a smart follow-up bracket. The smart follow-up bracket includes a first mounting portion for mounting and fixing a display. The sensor bracket includes a first bracket body, on which at least one chip mounting portion and at least one first connecting portion are provided. The first connecting part is used to connect with the first mounting part; The chip mounting section is used to assemble the sensing chip; The first bracket body is used to deform under pressure when pressure is applied to the display in order to transmit the pressure to the sensing chip.

2. The sensor support of claim 1, wherein, A functional area is formed from the first end of the first support body toward the second end of the first support body through a thinning process. The functional area includes at least one chip mounting portion. The thickness of the functional area in the direction parallel to the first end and the second end of the first support body is less than that of at least one of the first end and the second end.

3. The sensor support of claim 1, wherein, The chip mounting section has a first thinning area.

4. The sensor support of claim 1, wherein, The intelligent follow-up support includes a second support body; The first support body is also provided with at least one second connecting part; the at least one second connecting part is used to connect with the second support body.

5. The sensor support of claim 1, wherein, The intelligent follow-up support also includes a control module; the first support body is also provided with a control module receiving cavity, which is used to receive the control module.

6. The sensor support of claim 5, wherein, The control module housing cavity has a first threading hole.

7. The sensor support of claim 1, wherein, The chip mounting section has a second wire hole.

8. The sensor support of claim 1, wherein, The first support body has at least one second thinning region, which is distributed between the chip mounting portion and the first connecting portion, and / or between the chip mounting portion and the second connecting portion.

9. The sensor support of claim 7, wherein, An isolation wall is provided between the at least one chip mounting part, and at least one sensing chip is attached to the isolation wall; at least one second through hole is provided on the isolation wall.

10. A sensor, characterized by It includes a sensing chip and a sensor bracket as described in any one of claims 1-9.

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