一种IC封装基板层间对准度检测平台
By designing an interlayer alignment detection platform for IC packaging substrates and employing a CCD microscope and guide rail clamping mechanism, the problems of low detection efficiency and low accuracy in existing technologies have been solved, achieving efficient and accurate interlayer alignment detection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI MEADVILLE SCI & TECH
- Filing Date
- 2025-07-21
- Publication Date
- 2026-07-17
AI Technical Summary
Existing technologies for IC packaging substrate interlayer alignment detection are inefficient, inaccurate, and costly, making it difficult to meet the needs of small and medium-sized enterprises.
An IC packaging substrate interlayer alignment detection platform was designed, comprising a platform body, a support assembly, a base plate, a clamping mechanism, a first guide rail, and a second guide rail. The platform uses a CCD microscope for observation and achieves non-destructive testing through the clamping mechanism and guide rails, thereby improving the accuracy and efficiency of the testing.
It achieves efficient and accurate interlayer alignment detection, avoids blind sampling, reduces detection costs, and improves detection efficiency and accuracy.
Smart Images
Figure CN224517716U_ABST
Abstract
Claims
1. An IC package substrate inter-layer alignment accuracy detection platform, characterized in that, include: The platform body includes a horizontally set platform and multiple legs supporting the platform. The platform has a hollowed-out portion, which forms a concave structure from one side of the platform. A support assembly is disposed at the edge of the hollow portion and located below the hollow portion; The base plate is mounted on the support assembly and is parallel to the table surface; A clamping mechanism is disposed on the base plate and located below the platform; A first guide rail is disposed between the base plate and the support assembly to move the base plate in a first direction; A second guide rail is disposed between the clamping mechanism and the base plate to move the clamping mechanism in a second direction. The first direction and the second direction are two intersecting directions parallel to the table surface.
2. The IC package substrate inter-layer alignment accuracy detection platform of claim 1, wherein, The clamping mechanism includes: Two clamping plates are located on the base plate and are perpendicular to the table surface; Multiple U-shaped grooves, each of the two clamping plates passing through along the first direction; A positioning plate is detachably disposed in the U-shaped groove along the first direction and passes through the two clamping plates.
3. The IC package substrate overlay detection platform of claim 1, wherein Also includes: A cover plate is detachably mounted on the tabletop, and when mounted on the tabletop, the cover plate covers the cutout portion.
4. The IC package substrate overlay detection platform of claim 1, wherein The clamping mechanism further includes a buffer plate disposed on the side opposite to each of the clamping plates.
5. The IC package substrate overlay detection platform of claim 1, wherein The clamping mechanism further includes at least two handle assemblies, each of which extends through the two clamping plates along the first direction to adjust the distance between the two clamping plates.
6. The IC packaging substrate interlayer alignment detection platform according to claim 1, characterized in that, The support leg includes a base, which is disposed at the bottom of the support leg.
7. The IC package substrate overlay detection platform of claim 1, wherein Also includes: A CCD microscope is placed on the stage to observe the IC package substrate under test located between the two clamping plates.