一种用于晶片研磨砂的定量称重机构

Abstract

本实用新型涉及半导体制造设备技术领域，尤其涉及一种用于晶片研磨砂的定量称重机构，包括称重机，所述称重机中部转动连接有称重盘，所述称重机中部固定连接有称重器，所述称重器位于称重盘下方，所述称重机右部固定连接有安装座，所述安装座上方固定连接有储料盒，所述安装座上方固定连接有支撑架。通过进料管B使研磨砂进入到定量块上，当定量块装满后，电机B带动转动盘转动，转动盘转动时接触到间歇块，随后转动盘带动间歇块开始间歇转动，间歇块带动定量块一起间歇转动，当定量块转动到下料板上开设的下料口时便可通过下料口使研磨砂落入到称重盘上，从而起到了自动化间歇定量下料的作用，达到适配生产线节奏的效果。

Claims

1. A dosing mechanism for wafer lapping grit, characterized by: The weighing system includes a weighing machine (1), a weighing pan (2) rotatably connected to the middle of the weighing machine (1), a weighing device (3) fixedly connected to the middle of the weighing machine (1), the weighing device (3) being located below the weighing pan (2), a mounting base (4) fixedly connected to the right side of the weighing machine (1), a storage box (5) fixedly connected above the mounting base (4), a support frame (6) fixedly connected above the mounting base (4), a feed tank (7) fixedly connected above the support frame (6), and a feed pipe A (8) fixedly connected between the feed tank (7) and the storage box (5). One end of the feed pipe A (8) is fixedly connected to the right side of the feed tank (7), and the other end is fixedly connected to the top of the storage box (5). A motor A (9) is fixedly connected to the top of the feed tank (7). A screw rod (10) is fixedly connected to the output shaft of the motor A (9). The screw rod (10) generates a stirring force by rotating inside the feed tank (7) to break up the agglomerated grinding sand. The feeding component for quantitative feeding of wafers is installed on the mounting base (4). The bottom of the storage box (5) is connected to the feeding component. The grinding sand is quantitatively conveyed to the weighing pan (2) through the feeding component.

2. A dosing mechanism for lapping compound for wafers according to claim 1, characterized in that: The feeding assembly includes a feeding hopper (11), which is fixedly connected to the mounting base (4). A feeding pipe B (12) is fixedly connected between the feeding hopper (11) and the feeding tank (7). One end of the feeding pipe B (12) is fixedly connected to the rear side of the feeding hopper (11), and the other end of the feeding pipe B (12) is fixedly connected to the bottom of the feeding tank (7). A motor B (13) is fixedly connected inside the feeding hopper (11), and a rotating disk (14) is fixedly connected to the output shaft of the motor B (13). An intermittent block (15) is rotatably connected inside the feeding hopper (11), and a metering block (16) is fixedly connected to the bottom of the intermittent block (15). When the shaft rotates, the quantitative block (16) is rotatably connected inside the feeding hopper (11) through the intermittent block (15). The bottom of the feeding hopper (11) is fixedly connected to the feeding plate (17), and the feeding plate (17) has a feeding port. When the output shaft of the motor B (13) drives the rotating disk (14) to rotate, the rotating disk (14) will contact the intermittent block (15), thereby driving the intermittent block (15) to rotate. When the intermittent block (15) rotates, it drives the quantitative block (16) to rotate. When the quantitative block (16) rotates to the feeding port opened on the feeding plate (17), it can be fed through the feeding port, thereby enabling the quantitative block (16) to periodically align with the feeding port to achieve quantitative feeding.

3. A metering mechanism for lapping compound for wafers according to claim 2, characterized in that: It also includes a sealing gasket (18), which is fixedly connected to the feed plate (17) to prevent grinding sand from seeping into the gap between the metering block (16) and the feed plate (17).

4. A metering mechanism for lapping compound for wafers according to claim 3, characterized in that: It also includes a cleaning block (19), which is fixedly connected inside the hopper (11). The cleaning block (19) is in contact with the upper surface of the metering block (16) and is used to remove splashed abrasive.

5. A metering mechanism for lapping compound for wafers according to claim 4, characterized in that: Also include filter screen (20), the feed tank (7) bottom fixedly connected with filter screen (20), for intercepting not to scatter the lump grinding sand.

6. A metering mechanism for lapping compound for wafers according to claim 5, characterized in that: Also include observation window (21), the front side of the storage box (5) is fixedly connected with observation window (21), for observing the remaining material amount.

Images