一种陶瓷压力传感器模组

Abstract

一种陶瓷压力传感器模组，包括有一用以将压力信号转换为电信号或数字信号的信号调理电路板，还包括有内部设置有安装腔的卡座、用来检测压力信号的芯体，其中芯体包括有丝印有惠斯通电桥的陶瓷膜片、设置有应变空腔的陶瓷基座以及密封玻璃，本技术方案，通过搭配利用塑胶卡座承压，降低因装配过程中的应力导致陶瓷片受到外力影响产生微变形，能够避免零点漂移、灵敏度下降甚至传感器失效等问题的出现。

Claims

1. A ceramic pressure sensor module comprising a signal conditioning circuit board for converting a pressure signal into an electrical or digital signal, characterized in that, It also includes: The card holder has an internal mounting cavity that extends through its thickness, and the mounting cavity has a first mounting position and a second mounting position at both ends, and the signal conditioning circuit board is assembled at the first mounting position; A core, used for detecting pressure signals, is mounted in the second mounting position and is connected to the signal conditioning circuit board via several pins. The core includes... A ceramic diaphragm, on which a Wheatstone bridge composed of strain gauges is screen-printed, and A ceramic base, which is bonded to the ceramic diaphragm, has a strain cavity formed on the ceramic base corresponding to and housing the Wheatstone bridge, and a mounting hole formed on the ceramic base for the PIN pin to pass through. The ceramic base also includes... A sealing glass is disposed between the ceramic diaphragm and the ceramic base, which is used to bond the ceramic diaphragm and the ceramic base together after high-temperature sintering, and the sealing glass is provided with an air gap for housing the Wheatstone bridge.

2. The ceramic pressure sensor module according to claim 1, wherein The second mounting position is provided with a plurality of equally spaced second mounting steps formed on the inner wall of the mounting cavity to support the base, and ribs are formed on at least two opposite inner walls of the second mounting position. Each rib includes a rib body that protrudes toward the interior of the second mounting position. The upper end of the rib body is provided with a guide slope that is inclined toward the exterior of the second mounting position.

3. The ceramic pressure sensor module of claim 2, wherein, An elastic groove penetrating the side wall of the second mounting position is provided at the corner position of the second mounting position, and an elastic wall is defined between the two elastic grooves, with the rib formed on the elastic wall.

4. The ceramic pressure sensor module of claim 3, wherein, The second mounting step is located at the corner of the second mounting position and at the bottom of the elastic groove.

5. The ceramic pressure sensor module of claim 2, wherein, The first mounting position is provided with a first mounting step formed on the inner wall of the mounting for overlapping with the signal conditioning circuit board.

6. The ceramic pressure sensor module of claim 5, wherein, The signal conditioning circuit board is further provided with a main body and lead-out pads extending outward from the main body. The main body is printed with conditioning circuitry, and the main body is also provided with pin holes for the PIN pins to pass through and be soldered onto the main body. The lead-out pads are provided with elastic connectors that are electrically connected to the conditioning circuitry. A clearance portion is also formed above the first mounting position, penetrating the side wall of the first mounting position. The lead-out pad extends along the clearance portion, so that the elastic connector is located outside the mounting cavity for contact with the common ground.

7. The ceramic pressure sensor module of claim 1, wherein, The mounting hole is filled with metal paste, which seals the mounting hole.

8. The ceramic pressure sensor module of claim 5, wherein, The signal conditioning circuit board is equipped with a signal conditioning chip, surface mount capacitors, surface mount resistors, and zero-adjustment resistors.

Images