一种用于半导体元件的应用测试模组

Abstract

本实用新型公开了一种用于半导体元件的应用测试模组，涉及半导体检测技术领域，包括测试台，所述测试台顶部设有定位座，所述定位座顶部连接有真空吸盘，所述定位座上开设有通槽，且通槽内固定连接有气泵，所述定位座上方设有检测头，所述定位座左右两侧均设有竖板，且竖板之间固定连接有固定板，所述固定板前侧滑动连接有L形的活动板，所述活动板上固定连接有气缸，本实用新型通过设置气缸推动检测头对半导体晶圆施压，同时在气缸与检测头之间设置压力传感器，对施加的压力进行精确检测，并能在触控面板上直观的显示，方便对检测头的施加压力进行精确的调节，提高检测精度，降低测试结果的误差。

Claims

1. An application test module for semiconductor components, comprising a test bench (1), characterized in that: The test bench (1) is provided with a positioning seat (2) on top. A vacuum suction cup (3) is connected to the top of the positioning seat (2). A through groove is provided on the positioning seat (2), and an air pump (16) is fixedly connected in the through groove. A detection head (4) is provided above the positioning seat (2). Vertical plates (10) are provided on both the left and right sides of the positioning seat (2), and a fixing plate (6) is fixedly connected between the vertical plates (10). An L-shaped movable plate (7) is slidably connected to the front side of the fixing plate (6). A cylinder (5) is fixedly connected to the movable plate (7), and the telescopic end of the cylinder (5) extends to the movable plate (7). Below, the cylinder (5) extension end is fixedly connected to the detection head (4) by a connecting block, and a pressure sensor is fixedly connected at the connection between the connecting block and the detection head (4). A motor (13) is fixedly connected to the bottom of the test platform (1). A connecting rod (20) is movably connected between the test platform (1) and the positioning seat (2). Two meshing bevel gears (12) are provided below the test platform (1), and the output shaft of the motor (13) and the connecting rod (20) are fixedly connected to the adjacent bevel gears (12). A touch panel (11) is fixedly connected to the top of the test platform (1).

2. The application testing module for semiconductor devices according to claim 1, characterized in that: The top of the positioning seat (2) is provided with a groove that communicates with the through slot, and the top of the positioning seat (2) is provided with a top plate (14). The top plate (14) is provided with a first sliding groove, and the vacuum suction cup (3) is slidably connected in the first sliding groove.

3. The test module of claim 2, wherein: the test module is configured to be used with a plurality of different types of semiconductor devices. 5 A partition (15) is fixedly connected inside the groove, and a spiral second groove is provided on the partition (15). The bottom of the vacuum suction cup (3) is inserted into the second groove.

4. The test module of claim 3, wherein: the test module is configured to be used with a plurality of different types of semiconductor devices.

5. The test module of claim 3, wherein: the test module is configured to be used with a plurality of different types of semiconductor devices. The vacuum suction cup (3), the first slide groove and the second slide groove are provided in fours. The four first slide grooves and the second slide groove are distributed in a ring array. The four first slide grooves are all slidably connected with the sliders (19) with I-shaped cross sections. The four vacuum suction cups (3) penetrate the adjacent sliders (19).

5. The application test module for semiconductor devices according to claim 1, characterized in that: The movable plate (7) is fixedly connected to a fixing block (22) on the rear side, and a screw (9) is threadedly connected to the fixing block (22). Both ends of the screw (9) are movably connected to the vertical plate (10), and one end of the screw (9) extends to the outside of the vertical plate (10) and is fixedly connected to a handwheel.

6. The test module of claim 5, wherein: the test module is configured to be used with a plurality of different types of semiconductor devices. Two linear guide rails (8) are fixedly connected to the fixed plate (6). The two linear guide rails (8) are distributed on the upper and lower sides of the fixed block (22). The movable plate (7) is slidably connected to the two linear guide rails (8).

7. The test module of claim 2, wherein: the test module is configured to test a plurality of semiconductor devices. The positioning seat (2) has an annular groove at the top near the edge, and a number of first tooth blocks (18) arranged in an annular array are fixedly connected in the annular groove. A number of second tooth blocks (17) arranged in an annular array are fixedly connected at the bottom of the top plate (14), and the first tooth blocks (18) and the second tooth blocks (17) mesh with each other.

8. The test module of claim 3, wherein: the test module is configured to test a plurality of semiconductor devices simultaneously. A fixed tube (21) with a closed top is fixedly connected to the partition (15), and a through hole is provided at the top of the fixed tube (21). A T-shaped connecting rod (20) is provided inside the fixed tube (21). The top of the connecting rod (20) passes through the through hole and is fixedly connected to the top plate (14). A spring is sleeved on the outside of the connecting rod (20).

Images