一种SPR传感芯片及其镀膜装置
By using BK7 glass or quartz glass as the substrate material and adding a thickness detection device to the coating device, the problems of uneven coating and poor adhesion of SPR chips are solved, the uniformity and adhesion of the coating are improved, the sensing performance is enhanced, and the equipment maintenance cost is reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- INST OF HEALTH & MEDICINE HEFEI COMPREHENSIVE NAT SCI CENT
- Filing Date
- 2025-04-11
- Publication Date
- 2026-07-17
AI Technical Summary
The existing SPR chip coating process suffers from uneven coating and poor adhesion, which leads to a decrease in sensing performance. In addition, the traditional evaporation target has a short service life, which increases the cost of equipment maintenance and replacement.
Using BK7 glass or quartz glass as the substrate material, and incorporating a thickness detection device into the coating apparatus, combined with a plastic bracket and UV adhesive connection, the coating process is optimized to improve coating uniformity and adhesion.
This improved the uniformity and adhesion of the coating, enhanced the sensitivity and performance of the SPR sensor chip, and reduced equipment maintenance costs.
Smart Images
Figure CN224518538U_ABST
Abstract
Claims
1. An SPR sensor chip, characterized by, The chip includes: a support, a housing, and a chip, wherein the chip includes an adhesive layer, a substrate layer, and a gold plating layer; wherein: The base layer is a glass substrate, and the material of the glass substrate is selected from the following group: BK7 glass or quartz glass; The adhesive layer is used to connect the substrate layer and the gold plating layer, and the material is chromium; the thickness of the gold plating layer is 40-60 nm. The bracket is a plastic bracket with a rectangular opening in the middle to accommodate the chip; and an opening is provided on one side of the plastic bracket; the material of the plastic bracket is polystyrene plastic. The housing is used to accommodate the bracket, making it conform to the requirements of the SPR instrument.
2. The SPR sensor chip according to claim 1, characterized in that, The plastic bracket and the chip are connected by an adhesive layer, which is a UV adhesive.
3. The SPR sensor chip according to claim 1, characterized in that, The thickness of the adhesive layer is 0.5-2 mm.
4. The SPR sensor chip according to claim 2, characterized in that, The adhesive layer is configured to dry quickly when exposed to ultraviolet light.
5. The SPR sensor chip according to claim 1, characterized in that, The length and width of the sensor chip are both 8-14mm.
6. A coating device for manufacturing the SPR sensor chip according to any one of claims 1 to 5, characterized in that, The coating apparatus is equipped with a coating support, a cavity, an evaporation source, and a cooling device, wherein: The coating support has multiple rectangular openings to accommodate the coated chip; the cavity is configured as a vacuum cavity, the evaporation source is located at the top of the cavity, and the cooling device is located below the coating support.
7. The coating apparatus of claim 6, wherein The rectangular opening has a length and width of 8-14mm.
8. The coating apparatus of claim 6, wherein The coating apparatus is also equipped with a thickness detection device.
9. The coating apparatus of claim 6, wherein The coating support has 20-30 rectangular openings to accommodate 20-30 chips simultaneously.