A Raman detection device
By integrating Raman detection equipment, the entire process of silicon wafer processing is automated, solving the problems of insufficient automation and low detection efficiency in existing technologies, and meeting the high-efficiency detection needs of the semiconductor industry.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUHAN ZHIHUA TECHNOLOGY CO LTD
- Filing Date
- 2025-08-05
- Publication Date
- 2026-07-17
AI Technical Summary
Existing Raman detection technology suffers from insufficient automation, low detection throughput, and inefficient integrated architecture, with errors easily introduced by manual operation, making it difficult to meet the large-scale production needs of the semiconductor industry.
Design an integrated Raman detection device, comprising a machine module, a Raman detection module, a stack module, and a robot module, to achieve fully automated operation of silicon wafers. A four-axis robotic arm and an XYZ motion module are used for sample positioning and detection, and the entire process is automated by combining operating software.
It has increased the throughput of testing, improved testing efficiency by dozens of times, ensured the consistency and reliability of test results, reduced labor costs, and simplified maintenance and upgrade work.
Smart Images
Figure CN224518549U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of Raman detection technology, and in particular to a Raman detection device. Background Technology
[0002] Raman spectroscopy is a key technology in chemical analysis, biological detection, and materials research, playing a crucial role in pharmaceutical quality control, art composition analysis, and semiconductor material testing. With the upgrading of industries towards intelligent manufacturing, the automation of Raman detection has become a key research focus for improving analytical efficiency and ensuring data reliability, as it can effectively reduce human error through end-to-end automated control. However, existing automated Raman detection solutions still suffer from significant technical bottlenecks and functional limitations.
[0003] Defects and shortcomings of existing technology:
[0004] 1. Insufficient Automation and Reliance on Manual Labor: Traditional Raman spectroscopy relies heavily on manual or semi-automated operations. Operators must manually complete the entire process, including sample preparation, placement, and setting detection parameters. From the sample processing perspective, manual operation is not only inefficient but also leads to poor consistency due to uncontrollable human factors. For example, in surface-enhanced Raman spectroscopy, manually adding the amount of enhancing reagent is difficult to achieve precisely, severely affecting the accuracy and repeatability of the detection results. For complex samples such as biological tissue samples, the manual processing procedure is cumbersome and prone to introducing impurities, interfering with subsequent detection.
[0005] 2. Low throughput and efficiency bottlenecks: Traditional testing devices, operating on a single or small-sample testing model, cannot meet the large-scale production needs of the semiconductor industry. Their testing processes suffer from low sample turnover efficiency and a lack of batch processing capabilities, resulting in long overall testing cycles. This makes it difficult to match the quality control pace of high-speed production lines, becoming a key bottleneck restricting capacity expansion.
[0006] 3. Defects and Insufficient Stability in Integrated Architecture: Traditional detection devices operate with independent modules, resulting in low integration and poor inter-module collaboration. For example, poor connection between the robot module and the detection module can easily lead to jams or positioning errors during sample transfer; insufficient coordination between the stack module and the machine module results in poor stability of sample storage and transport. These architectural defects not only increase potential points of failure but also reduce the overall reliability of the system, thereby increasing maintenance costs and downtime. Utility Model Content
[0007] To address the problem of low detection efficiency in existing technologies, this invention provides a Raman detection device with high detection efficiency.
[0008] The technical solution adopted by this utility model to solve its technical problem is:
[0009] A Raman detection device, characterized in that it comprises:
[0010] A machine tool module, wherein the machine tool module includes a support frame;
[0011] A Raman detection module, wherein the Raman detection module is used to detect silicon wafers;
[0012] A stack module, wherein the stack module is used to stack silicon wafers;
[0013] The robot module is used to transfer silicon wafers between the Raman detection module and the stack module.
[0014] Furthermore, the Raman detection module includes an X-direction moving module, on which a detection platform for supporting the silicon wafer is mounted. The Raman detection module also includes a Y-direction moving module, on which a Z-direction moving module is mounted. The end of the Z-direction moving module is provided with a bracket, on which a Raman detector is mounted.
[0015] Furthermore, the stack module includes several tray holes, and the tray holes are spaced apart along the X and Y directions.
[0016] Furthermore, the stack module includes several storage racks spaced apart in the horizontal direction, with several storage cells on each rack from top to bottom, and each storage cell corresponding to a tray hole.
[0017] Furthermore, the robot module includes a four-axis robotic arm.
[0018] Furthermore, the machine module is equipped with a tri-color light and a camera.
[0019] Beneficial effects:
[0020] (1) High throughput: The equipped silicon wafer carrier stack can meet the testing needs of multiple silicon wafers at one time. Combined with the fast and accurate operation of the robot module, the samples can be efficiently transferred and tested. Compared with traditional testing methods, the testing efficiency is increased by dozens of times, which can meet the needs of the semiconductor industry for rapid testing of silicon wafers in large-scale production and effectively shorten the production cycle.
[0021] (2) High degree of automation: The device integrates a machine module, a Raman instrument detection module, a robot module and a stack module, which can realize the full-process automated operation of silicon wafer samples from loading, positioning and detection to data processing, greatly reducing labor costs, avoiding errors caused by human operation, and improving the consistency and reliability of detection results.
[0022] (3) Easy to maintain and upgrade: The design of the device fully considers the stability and ease of use in long-term operation, making maintenance and upgrade work simpler and faster. Attached Figure Description
[0023] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1 This is a front view schematic diagram of the Raman detection device of this utility model;
[0025] Figure 2 This is a three-dimensional structural diagram of the Raman detection device of this utility model;
[0026] Figure 3 The detection process of the Raman detection device of this utility model Figure 1 ;
[0027] Figure 4 The detection process of the Raman detection device of this utility model Figure 2 ;
[0028] Figure 5 The detection process of the Raman detection device of this utility model Figure 3 .
[0029] 1. Machine module; 2. Raman detection module; 21. X-axis movement module; 22. Detection platform; 23. Y-axis movement module; 24. Z-axis movement module; 25. Raman detector; 3. Stack module; 31. Storage rack; 32. Storage cell; 4. Robot module; 5. Tri-color light; 6. Camera. Detailed Implementation
[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.
[0031] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0032] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it does not need to be aligned for further discussion in subsequent figures.
[0033] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.
[0034] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.
[0035] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.
[0036] like Figures 1-2 This invention discloses a Raman detection device, comprising a machine module 1, a Raman detection module 2, a stacking module 3, and a robot module 4. The machine module 1 includes a support frame. The Raman detection module 2 is used to detect silicon wafers. The stacking module 3 is used to stack silicon wafers. The robot module 4 is used to transfer silicon wafers between the Raman detection module 2 and the stacking module 3. The Raman detection module 2 includes an X-direction moving module 21, on which a detection platform 22 for supporting silicon wafers is mounted. The Raman detection module 2 also includes a Y-direction moving module 23, on which a Z-direction moving module 24 is mounted. The end of the Z-direction moving module 24 is provided with a bracket, on which a Raman detector 25 is mounted. As one embodiment, the Raman detector is a BLADE 785B OEM. The robot module 4 includes a four-axis robotic arm.
[0037] The X-direction moving module 21, Y-direction moving module 23, and Z-direction moving module 24 can be driven by motors and lead screws, but are not limited to these methods.
[0038] The stack module 3 includes several tray holes, with the tray holes spaced apart along the X and Y directions. The stack module 3 can be a single unit; however, for ease of quantity adjustment, preferably, the stack module 3 includes several horizontally spaced storage racks 31, each with several storage cells 32 arranged from top to bottom, each corresponding to one tray hole. A silicon wafer carrier is positioned at the bottom of each storage cell 32.
[0039] In addition to the support frame, the machine module 1 also includes a surrounding protective cover and a door cover. A tri-color light 5 and a camera 6 are installed inside the machine module 1.
[0040] Working principle:
[0041] The fully automated workflow is as follows:
[0042] 1. Sample loading: such as Figure 3 The four-axis robot module picks up silicon wafers from the silicon wafer carrier of the stack module.
[0043] 2. Sample positioning: such as Figure 4 The silicon wafer is placed at the designated position on the Raman detector module to complete precise positioning.
[0044] 3. Automatic detection: such as Figure 5 The Raman detector module moves along the XYZ axes via a slide rail to detect samples on the silicon wafer one by one.
[0045] 4. Sample Transfer: After the test is completed, the robot module moves the silicon wafer back to the stack module or transfers it to the next stage, realizing efficient sample transfer and completing the fully automated control of the entire process from loading and testing to data analysis and feedback.
[0046] The Raman detection device of this invention can also be equipped with operating software. The operating software can collect and analyze detection data in real time. At the same time, the user can view the detection process, equipment status and abnormal alarm information through the human-machine interface. Finally, the software organizes and analyzes the detection data and feeds it back to the user, who can then make subsequent operations or decisions based on this information.
[0047] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.
Claims
1. A Raman detection device, characterized by: include: The machine tool module (1) includes a support frame; Raman detection module (2), wherein the Raman detection module (2) is used to detect silicon wafers; Stack module (3), said stack module (3) is used for stacking silicon wafers; Robot module (4) is used to transfer silicon wafers between Raman detection module (2) and stack module (3).
2. The Raman detection device of claim 1, wherein: The Raman detection module (2) includes an X-direction moving module (21), on which a detection platform (22) for carrying silicon wafers is installed. The Raman detection module (2) also includes a Y-direction moving module (23), on which a Z-direction moving module (24) is installed. The end of the Z-direction moving module (24) is provided with a bracket, on which a Raman detector (25) is installed.
3. The Raman detection device of claim 2, wherein: The stack module (3) includes several tray holes, which are spaced apart along the X and Y directions.
4. The Raman detection device of claim 3, wherein: The stack module (3) includes several storage racks (31) spaced apart in the horizontal direction. Each storage rack (31) has several storage cells (32) from top to bottom, and each storage cell (32) corresponds to a tray hole.
5. The Raman detection device of claim 1, wherein: The robot module (4) includes a four-axis robotic arm.
6. The Raman detection device of claim 1, wherein: The machine module (1) is equipped with a tri-color light (5) and a camera (6).