A chip solder quality inspection component

Abstract

This utility model relates to a chip soldering quality inspection component, including a base, a device housing on the upper side of the base, transmission ports on the lower left and right sides of the device housing, an observation window at the center of the front side of the device housing, and Y-axis support frames on the left and right sides of the upper end of the base. Y-axis guide rails are provided at the center of the upper end of each Y-axis support frame, and X-axis brackets are slidably connected to the Y-axis guide rails. X-axis guide rails are provided at the upper end of the X-axis brackets, and a detection head is slidably connected to the X-axis guide rails. A stabilizing platform assembly is provided at the center of the upper end of the base, and a double-row belt conveyor is provided on the upper side of the base. This component effectively improves the stability of the chip soldering inspection process, ensures high accuracy of the inspection results, and avoids machine misjudgment under the influence of chip temperature.

Description

Technical Field

[0001] This utility model relates to the field of SPI solder paste testing equipment technology, and in particular to a chip solder quality testing component. Background Technology

[0002] SPI solder paste inspection equipment is a key piece of equipment in SMT (Surface Mount Technology) production lines used to inspect the quality of solder paste printing. Its core function is to perform high-precision inspection of solder paste on PCB boards through three-dimensional optical measurement technology to ensure the reliability of subsequent component placement and soldering processes. It generates a digital model of solder paste by combining a high-resolution camera with a laser or white light source and compares it with a preset standard.

[0003] Patent application number CN202322691443.7 is a Chinese utility model patent that discloses a solder paste 3D inspection device, belonging to the technical field of solder paste inspection equipment, to solve the problem of inconvenience in adjusting the height of the worktable. It includes a device housing and a worktable, with the worktable installed inside the device housing and a camera installed inside the device housing. This application utilizes a fixed plate to adjust the working table's height. Pushing the two side push rods moves the push plate inwards. During this movement, the push plate moves smoothly with the support of a slider in a groove. Simultaneously, the push plate, in conjunction with the connecting plate, compresses the second spring, causing the locking lever on the push plate to disengage from the slot. This allows the working table to move upwards. Once in the desired position, releasing the push rods causes the locking lever on the push plate to engage in the slot under the push of the second spring. This facilitates adjustment of the working table's height according to usage, enabling convenient 3D solder paste inspection. However, this device has the following problems: First, during chip inspection, unstable placement may cause image blurring or positioning misalignment, resulting in blurred imaging of the solder paste printing area. Second, the device cannot detect abnormal chip temperatures during inspection. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by using a lifting cylinder to drive a chip detection stabilization platform to lift the middle of the chip. Simultaneously, the high-density micro-bumps of the silicone material on the stabilization platform provide buffering friction, suppressing chip shaking during detection. Furthermore, the stable lifting of the chip eliminates direct interference from belt vibration on the imaging area, solving the technical problem of image blurring or positioning misalignment caused by unstable chip placement during detection. By incorporating a built-in temperature sensor on the chip detection stabilization platform, it enables real-time monitoring of chip temperature, addressing the issue of the device's inability to capture abnormal chip temperatures during detection.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A chip soldering quality inspection component includes a base, a device housing on the upper side of the base, transmission ports on the lower left and right sides of the device housing, an observation window at the center of the front side of the device housing, Y-axis support frames on the left and right sides of the upper end of the base, Y-axis guide rails at the center of the upper end of the Y-axis support frames, X-axis brackets slidably connected to the Y-axis guide rails, X-axis guide rails at the upper end of the X-axis brackets, a detection head slidably connected to the X-axis guide rails, a stabilizing platform assembly at the center of the upper end of the base, and a double-row belt conveyor on the upper side of the base.

[0007] As a preferred embodiment, the double-row belt conveyor passes through the inside of the device housing via the transmission port, and the double-row belt conveyor protrudes from the base and the left and right ends of the device housing on both sides. The lower ends of the left and right sides of the double-row belt conveyor are provided with brackets, which are fixedly connected to the left and right sides of the base.

[0008] As a preferred embodiment, the stabilizing platform assembly includes a lifting cylinder, with a telescopic rod at the center of the upper end of the lifting cylinder. The upper end of the telescopic rod is fixedly connected to a chip detection stabilizing platform, which has a temperature sensor embedded inside. The chip detection stabilizing platform is rectangular in shape and located at the upper end of the base. The chip detection stabilizing platform is smaller than the inner distance of the double-row belt conveyor.

[0009] As a preferred embodiment, the base has a square groove at its upper center, and the size of the square groove is larger than that of the chip detection stabilization stage.

[0010] As a preferred embodiment, the detection head has a detection camera at its front center and a supplementary aperture at its lower end, with a camera channel inside the supplementary aperture, and the supplementary aperture is located directly below the detection camera.

[0011] As another preferred embodiment, the chip detection platform has high-density microbumps evenly distributed on its upper side, and the high-density microbumps are made of silicone.

[0012] The beneficial effects of this utility model are:

[0013] (1) In this utility model, when the lifting cylinder drives the chip detection stabilizing platform to rise, the stabilizing platform extends out from the square groove, and the high-density silicone micro-bumps on its top directly abut against the lower surface of the center of the chip. The left and right edges of the chip will be on the upper side of the double-row belt, abutting against the upper inner wall of the double-row belt frame, so that the chip is separated from the belt vibration source and the whole remains horizontal and stable, avoiding image blurring or positioning offset problems caused by unstable placement of the chip during detection. Then, the detection head detects the chip solder paste through the operation of the X-axis guide rail and the Y-axis guide rail, which can effectively improve the stability of the chip solder detection process and ensure high accuracy of the detection results.

[0014] (2) In this utility model, by setting a temperature sensor embedded inside the chip detection platform, it is equipped with the ability to monitor the chip temperature in real time. The real-time temperature status of the chip solder paste during detection is a key factor in the detection. However, traditional SPI devices rely solely on image analysis and cannot capture whether the chip is affected by temperature during detection, thus affecting the detection effect. The chip detection platform has a built-in temperature sensor. When it is pressed against the middle of the lower side of the chip, the silicone bump will evenly press against the lower side of the chip. The silicone bump can transmit the temperature to the temperature sensor inside the chip detection platform and monitor the temperature distribution of the chip in real time. If the displayed temperature data is abnormal, the chip with the abnormality can be moved to the re-inspection area to avoid machine misjudgment due to temperature abnormality.

[0015] In summary, this device effectively improves the stability of the chip soldering inspection process, ensures high accuracy of the inspection results, and avoids machine misjudgment under the influence of chip temperature. It is especially suitable for the field of SPI solder paste inspection equipment technology. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0018] Figure 2 This is a schematic diagram of the structure of the upper part of the base, the double-row belt, the Y-axis support frame, the X-axis bracket, and the position of the detection head in this utility model.

[0019] Figure 3 This is a schematic diagram of the stabilization platform component in this utility model.

[0020] Figure 4 This is an enlarged schematic diagram of point A (high-density protrusions) in this utility model. Detailed Implementation

[0021] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings.

[0022] Example 1

[0023] like Figures 1 to 4As shown, this utility model provides a chip soldering quality inspection component, including a base 1. The base 1 is the basic structure of the entire chip soldering quality inspection component, used to support and fix all functional components. A device housing 11 is provided on the upper side of the base 1. The lower ends of the left and right sides of the device housing 11 are provided with transmission ports 111 for double-row belt cables 4 to pass through. An observation window 112 is provided at the center of the front side of the device housing 11. The observation window 112 facilitates the operator to observe the inspection process in real time. The window material is scratch-resistant glass or high-strength acrylic, supporting high-definition visibility and anti-reflective treatment. Y-axis support brackets 12 are provided on the left and right sides of the upper end of the base 1. Y-axis guide rails 121 are provided at the center of the upper end of the Y-axis support brackets 12. The Y-axis guide rails 121 are slidably connected to X-axis brackets 13. The X-axis brackets 13 move along the Y-axis direction. The Y-axis guide rails 121 are high-precision linear guide rail structures, driven by servo motors and equipped with encoder feedback systems to ensure high-precision control of the movement position and ensure that the X-axis brackets 13 move along the Y-axis. Stable movement in the axial direction: The Y-axis guide rail 121 and the X-axis bracket 13 are slidably connected, allowing the detection head 2 to reciprocate along the Y-axis direction to achieve longitudinal scanning of the chip solder area. The X-axis bracket 13 has an X-axis guide rail 131 at its upper end, which slidably connects to the detection head 2. The detection head 2 is the core detection component, including a detection camera 21, a supplementary aperture 22, an image processing module, a motion control module, etc. The X-axis guide rail 131 is used to drive the detection head 2 to move in the X-axis direction. The X-axis guide rail 131 is also a high-precision linear guide rail structure, driven by a servo motor and equipped with an encoder feedback system to ensure high-precision control of the movement position. The X-axis guide rail 131 and the Y-axis guide rail 121 cooperate to form a two-dimensional plane scanning system, allowing the detection head 2 to move freely in the XY plane and perform all-round scanning and detection of the chip solder points. A stabilizing stage assembly 3 is provided at the center of the upper end of the base 1. The position of the stabilizing stage assembly 3 is the detection area, and a double-row belt conveyor 4 is provided on the upper side of the base 1.

[0024] Furthermore, the double-row belt conveyor 4 passes through the inside of the device housing 11 via the transmission port 111, and protrudes from both sides of the base 1 and the left and right ends of the device housing 11. Each of the lower left and right sides of the double-row belt conveyor 4 is equipped with a bracket 41, which is fixedly connected to the left and right sides of the base 1. The double-row belt conveyor 4 uses two parallel belts, and a frame is provided on the outer side of each parallel belt. The frame is connected to the bracket 41 to support the entire internal device of the double-row belt conveyor 4. Synchronous operation is achieved through a synchronous belt to ensure conveying accuracy. A driving idler is provided on the front side of the interior of each parallel belt, and a driven idler is provided on the rear side. Belt shafts are provided on the left and right sides of the driving and driven idlers. The belts are all fitted onto belt shafts. A belt motor is located on the left side of the active idler. The output shaft of the belt motor is connected to the active idler via a coupling and is used to transport the chip to the detection area. The belt motor drives the output shaft to drive the active idler to transport the chip via the double-row belt line 4. The belt motor is controlled by the PLC system to transport the chip to be tested to the stabilizing platform assembly 3. The lifting cylinder 31 drives the chip detection stabilizing platform 32 to rise, lifting the middle of the chip. When the two sides of the chip are separated from the belt, the double-row belt line 4 will stop transporting. When the chip detection stabilizing platform 32 descends and the two sides of the chip fall onto the belt, the double-row belt line 4 will continue to transport the chip to the outside of the device.

[0025] Furthermore, the stabilizing platform assembly 3 includes a lifting cylinder 31, which is interlocked with a belt motor via a PLC. A telescopic rod 311 is located at the center of the upper end of the lifting cylinder 31. The upper end of the telescopic rod 311 is fixedly connected to the chip detection stabilizing platform 32. The lifting cylinder 31 is a pneumatic actuator that controls the telescopic rod 311 to move up and down, thereby driving the chip detection stabilizing platform 32 to rise and fall. A temperature sensor, specifically a thermocouple sensor, is embedded inside the chip detection stabilizing platform 32. The temperature sensor is connected to the PLC system to trigger an audible and visual alarm and record the chip ID. The temperature sensor collects the chip temperature; if the temperature is abnormal, the system will mark the chip and send it for re-inspection. The chip detection stabilizing platform 32 is rectangular in shape and located on the upper end of the base 1. The outermost layer of the chip testing platform 32 is a ceramic contact layer. A copper foil thermal conductive layer is located below the ceramic contact layer, and a circuit board is located below the copper foil thermal conductive layer. The ceramic contact layer is the outermost layer of the chip testing platform 32. The temperature sensor is fixed between the copper foil thermal conductive layer and the circuit board with conductive adhesive to reduce heat transfer errors. The pins of the temperature sensor are soldered to the signal acquisition terminal of the circuit board. The output terminal of the temperature sensor is electrically connected to an external PLC control system to realize real-time transmission of temperature data and abnormal alarm. The chip testing platform 32 is smaller than the inner distance of the double-row belt conveyor 4. The double-row belt conveyor 4 transports the chip to be tested to the top of the platform assembly 3. When the chip travels on the belt to the testing area, the chip testing platform 32 rises, lifting the chip and removing it from the belt vibration source to ensure the stability of the testing process.

[0026] Furthermore, a square groove 14 is provided at the center of the upper side of the base 1. The size of the square groove 14 is larger than that of the chip detection stabilization stage 32, and the side length of the square groove is 1-2mm larger than that of the chip detection stabilization stage. The square groove 14 is a reserved space for the lifting of the chip detection stabilization stage 32, ensuring that it can be completely embedded in the upper part of the base when not in use, thus avoiding space occupation and affecting the operation of the conveyor belt. The lifting cylinder 31 of the stabilization stage assembly 3 is located inside the base 1. A cylinder base is provided on the lower side of the interior of the base 1, and the lifting cylinder 31 is connected to the cylinder base to ensure the stability of the lifting cylinder.

[0027] Furthermore, the detection head 2 has a detection camera 21 at its front center. The detection camera 21 is a high-definition industrial camera with high resolution and high-speed image capture capabilities, capable of identifying micron-level solder defects. The detection head 2 has a supplementary aperture 22 at its lower end. The inner side of the supplementary aperture 22 is a ring-shaped LED light source with an adjustable light intensity control module inside. It can automatically adjust the brightness according to the ambient light to ensure image clarity. The supplementary aperture 22 provides constant light source conditions to prevent misjudgment due to uneven lighting. The supplementary aperture 22 has a camera channel inside. The supplementary aperture 22 is located directly below the detection camera 21. The supplementary aperture 22 and the detection camera 21 work together to ensure no shadows or reflections during image acquisition, improving the accuracy of image recognition.

[0028] Furthermore, the chip detection stabilization stage 32 features uniformly distributed high-density microbumps 321 on its upper side. These high-density microbumps 321 contact the bottom of the chip, providing support and ensuring chip stability during detection. The high-density microbumps 321 are made of silicone, possessing excellent elasticity and thermal conductivity. Each high-density microbump 321 has a uniform height. When in contact with the bottom of the chip, the high-density microbumps 321 not only provide uniform support to prevent chip tilting but also conduct chip temperature to the ceramic contact layer on the outside of the chip detection stabilization stage 32 through the thermal conductivity of the silicone. This ceramic contact layer serves as the surface layer directly in contact with the chip. The copper foil thermal conductive layer is located below the ceramic contact layer and transmits temperature to the temperature sensor for real-time temperature monitoring. If abnormal temperature data is displayed, the chip showing the abnormality can be transported to the outside of the device via a double-row conveyor belt 4 and manually placed in the re-inspection area for the next re-inspection, thus avoiding machine misjudgment due to chip temperature influence.

[0029] Working process: First, the double-row conveyor belt 4 starts, smoothly conveying the chip to be tested to the testing area inside the device housing 11. Then, the lifting cylinder 31 drives the telescopic rod 311 to lift upward, causing the chip testing platform 32 to rise from the square groove 14. The high-density silicone micro-bumps 321 on its surface tightly abut against the center of the bottom of the chip. At the same time, the two sides of the chip are locked onto the upper end of the frame of the double-row conveyor belt 4, detaching the left and right sides of the chip from the belt and locking them inside the upper side of the frame for horizontal fixation. Next, the testing head 2 moves along the Y-axis guide rail 121 and the X-axis guide rail 131 to directly above the chip. The supplementary aperture 22 activates the ring light source, and the testing camera 21 performs high-definition image scanning of the chip's solder area. Then, the image processing module of the testing camera 21 analyzes the thickness, coverage, and offset parameters of the solder paste and generates a testing report. After the testing is completed, the lifting cylinder 31 retracts, causing the platform 32 to fall back into the square groove 14, and the chip falls back onto the double-row conveyor belt 4. Finally, normal chips continue to be conveyed to the next process.

[0030] Secondly, the temperature sensor built into the chip testing platform 32 collects chip temperature data in real time via silicone micro-bumps 321. If the temperature is abnormal, the system automatically marks the chip ID and triggers an alarm. The abnormal chip can then be transported to the outside of the device via a double-row belt conveyor 4, where it is manually placed in the re-inspection area to await the next re-inspection, thus avoiding machine misjudgment due to chip temperature influences.

[0031] In the description of this utility model, it should be understood that the terms "front and back", "left and right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0032] Of course, those skilled in the art should understand that the term "a" should be understood as "at least one" or "one or more". That is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. The term "a" should not be understood as a limitation on the quantity.

[0033] The above description is merely a preferred embodiment of this utility model, but the scope of protection of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art under the technical guidance of this utility model should be included within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A chip solder quality detection assembly, characterized by: Includes a base (1), on the upper side of the base (1) is a device housing (11), on the lower left and right sides of the device housing (11) are transmission ports (111), on the center of the front side of the device housing (11) is an observation window (112), and on the upper left and right sides of the base (1) are Y-axis support frames (12), on the center of the upper end of the Y-axis support frames (12) are Y-axis guide rails (121), on the center of the upper end of the Y-axis guide rails (121) are slidably connected to X-axis brackets (13), on the upper end of the X-axis brackets (13) are X-axis guide rails (131), on the X-axis guide rails (131) are slidably connected to the detection head (2), and on the center of the upper end of the base (1) is a stabilizing platform assembly (3), and on the upper side of the base (1) are double-row belt lines (4).

2. The chip solder quality detection assembly of claim 1, wherein, The double-row belt (4) passes through the inside of the device housing (11) through the transmission port (111), and the double-row belt (4) protrudes from the base (1) and the left and right ends of the device housing (11) on both sides. The lower ends of the left and right sides of the double-row belt (4) are provided with brackets (41), and the brackets (41) are fixedly connected to the left and right sides of the base (1).

3. The chip solder quality detection assembly of claim 1, wherein, The stabilizing platform assembly (3) includes a lifting cylinder (31), and a telescopic rod (311) is provided at the center of the upper end of the lifting cylinder (31). The upper end of the telescopic rod (311) is fixedly connected to the chip detection stabilizing platform (32). The chip detection stabilizing platform (32) has a temperature sensor embedded inside. The chip detection stabilizing platform (32) is rectangular in shape. The chip detection stabilizing platform (32) is located at the upper end of the base (1), and the chip detection stabilizing platform (32) is smaller than the inner distance of the double-row belt line (4).

4. The chip solder quality detection assembly of claim 1, wherein, The base (1) has a square groove (14) at the center of its upper side. The size of the square groove (14) is larger than that of the chip detection stabilization stage (32).

5. The chip soldering quality inspection component according to claim 1, characterized in that, The detection head (2) has a detection camera (21) at the center of its front end and a supplementary aperture (22) at the lower end. The supplementary aperture (22) has a camera channel inside and is located directly below the detection camera (21).

6. The chip solder quality detection assembly of claim 3, wherein, The chip detection stabilization stage (32) has high-density microbumps (321) evenly distributed on its upper side, and the high-density microbumps (321) are made of silicone.

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