A device for detecting cracks in the morphology of silicon wafers in the semiconductor field.
By designing an automated vision and surface inspection mechanism and employing a high-precision line scan camera and a color laser coaxial displacement meter, efficient and accurate detection of wafer morphology and cracks has been achieved, solving the problems of low efficiency and high cost in existing technologies and improving production efficiency and safety.
CN224518601UActive Publication Date: 2026-07-17DALIAN NAISHI TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DALIAN NAISHI TECH CO LTD
- Filing Date
- 2025-06-19
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
The lack of integrated equipment for detecting wafer morphology and cracks in existing technologies leads to low production efficiency, high costs, and significant safety hazards.
Method used
A device comprising a vision inspection mechanism and a surface shape inspection mechanism was designed. It employs a high-precision line scan camera and a color laser coaxial displacement meter, combined with a PLC control unit and a host computer control unit, to achieve automated and high-precision morphology and crack detection.
Benefits of technology
It improves the efficiency and accuracy of silicon wafer inspection, reduces labor costs and safety hazards, has a compact structure, operates efficiently, is easy to deploy, has low maintenance costs, and high production efficiency.
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Smart Images
Figure CN224518601U_ABST
Abstract
This utility model relates to the field of optical inspection technology in the semiconductor industry, and provides a device for detecting cracks in the morphology of silicon wafers in the semiconductor field. The device includes a base plate and a silicon wafer robot, a loading table, a vision inspection mechanism, and a surface shape inspection mechanism mounted on the base plate. The vision inspection mechanism includes a vision inspection mechanism moving module, a line scan camera, a bar light source, and a vision inspection mechanism base. The vision inspection mechanism base and the vision inspection mechanism moving module are respectively positioned above the base plate. A line scan camera is mounted on the moving end of the vision inspection mechanism moving module. Bar light sources are respectively positioned below both sides of the line scan camera. The surface shape inspection mechanism includes a color laser coaxial displacement meter, a surface shape inspection mechanism moving module, and a surface shape inspection mechanism rotating base. This utility model improves the efficiency and accuracy of silicon wafer morphology and crack detection, while reducing labor costs and safety hazards.
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