A current sensor, a power module, and an inverter

Abstract

This utility model discloses a current sensor, a power module, and an inverter. The current sensor includes: a housing comprising a cavity with an opening; and a main body for detecting the phase current of an output copper busbar. The main body includes a connector. The main body is disposed within the cavity and spaced apart from the cavity wall. The main body and the cavity wall are connected by a potting compound. The potting compound cures to form an encapsulation portion, which includes a top surface and a connecting surface. The connecting surface is fitted to the cavity wall. One end of the connector passes through the top surface and extends out of the opening for connection to a first circuit board. This utility model eliminates the need for multiple injection molding processes, simplifies the manufacturing process, and reduces costs.

Description

Technical Field

[0001] This utility model relates to the field of current detection technology, and in particular to a current sensor, a power module, and an inverter. Background Technology

[0002] A coreless current sensor is a new type of current measuring device based on magnetic field detection technology. It measures current by directly sensing the magnetic field generated by the current, without the need for a traditional magnetic core structure, and has advantages such as small size and high precision.

[0003] In existing technologies, current sensors are formed through multiple insert injection molding processes. For example, the connection pins need to be pre-molded to obtain a connector, then the connector and the current detection part are connected, and a second injection molding is performed to obtain the housing. Finally, the finished product is electrically connected to the inverter's circuit board through a pressing process. Since pressing can only achieve an electrical connection between the current sensor and the circuit board, its connection stability is poor. Usually, additional fixing structures are required on the housing, such as grooves on the housing and additional protrusions on the inverter's output copper busbars. The protrusions and grooves cooperate to achieve a fixed connection between the current sensor and the inverter's circuit board.

[0004] On the one hand, the above-mentioned solution requires additional press-fitting processes and equipment, increasing manufacturing costs. It also requires additional fixing structures to be designed on the copper busbar and the housing, increasing the complexity and cost of the design. On the other hand, the molding process of the current sensor is complex, requiring multiple insert injection molding processes, which are complex and costly. Furthermore, the secondary injection molding of the housing requires the use of thermosetting plastics, further increasing the cost. Utility Model Content

[0005] The purpose of this invention is to solve the problems of complex manufacturing processes and high costs associated with current sensors. This invention provides a current sensor that eliminates the need for multiple injection molding processes, simplifies the manufacturing process, and reduces costs.

[0006] To solve the above-mentioned technical problems, an embodiment of this utility model discloses a current sensor, comprising:

[0007] The housing includes a cavity with an opening;

[0008] The main body is used to detect the phase current of the output copper busbar. The main body includes a connector. The main body is disposed in the cavity and spaced apart from the cavity wall. The main body and the cavity wall are connected by potting compound. The potting compound is cured to form an encapsulation part. The encapsulation part includes a top surface and a connecting surface. The connecting surface is fitted to the cavity wall. One end of the connector passes through the top surface and extends out of the opening for connection with the first circuit board.

[0009] Using the above technical solution, the main body and the cavity wall are connected by potting compound. The potting compound cures to form the encapsulated part. By using potting compound for one-time molding instead of the traditional multi-injection molding process, the need for developing multiple molds and performing multiple injection molding processes is eliminated, reducing production steps (e.g., eliminating the need for staged injection molding of different parts). The production process is simpler, reducing costs. Furthermore, the thermal conductivity and insulation properties of the potting compound material (e.g., epoxy resin) are superior to traditional injection molding materials, improving the performance of the current sensor. In addition, after curing, the potting compound adheres tightly to the cavity wall, forming an integral sealed structure, which enhances dustproof, waterproof, and vibration-resistant performance, reducing subsequent protective treatment costs.

[0010] According to another specific embodiment of the present invention, an embodiment of the present invention discloses a current sensor, including a first positioning connection part and a second positioning connection part. The first positioning connection part and the second positioning connection part are spaced apart on the top wall of the housing, and the top wall is arranged around the opening. The first positioning connection part and the second positioning connection part both extend along a first direction and are used to connect with the first circuit board.

[0011] By adopting the above technical solution, since the first positioning connection part and the second positioning connection part are spaced apart on the top wall of the housing, and both the first positioning connection part and the second positioning connection part extend along the first direction, both are used to connect with the first circuit board. This assists in positioning and strengthens the connection stability. For example, when the current sensor is connected to the first circuit board, directly connecting the first positioning connection part and the second positioning connection part to the first circuit board determines the connection position of the current sensor on the first circuit board, improving installation efficiency.

[0012] According to another specific embodiment of the present invention, an embodiment of the present invention discloses a current sensor, wherein along the first direction, the housing includes a first part and a second part, the cavity is disposed in the first part and the second part, and the opening is disposed on the side of the first part facing away from the second part.

[0013] The main body includes a second circuit board and a detection unit. The second circuit board is disposed in the first part and the second part. In the first part, the other end of the connector is connected to the second circuit board. In the second part, the detection unit is disposed in the second circuit board.

[0014] Using the above technical solution, along the first direction, the housing includes a first part and a second part. The second circuit board of the main body, the detection part, and the connector are distributed in the first part and the second part. For example, in the first part, the other end of the connector is connected to the second circuit board, and in the second part, the detection part is disposed on the second circuit board. In this way, both the main body and the housing are distributed in the first direction, which allows the current sensor to extend along the first direction (e.g., a vertical direction perpendicular to the ground), thus saving space occupied in the horizontal direction.

[0015] According to another specific embodiment of the present invention, an embodiment of the present invention discloses a current sensor, the main body of which includes a connecting base, the connecting base including at least a set of spaced connecting holes, each set of connecting holes including a first connecting hole and a second connecting hole, the first connecting hole being disposed on the top surface of the connecting base, one end of the connector being disposed on the first connecting hole, the second connecting hole being disposed on the side surface of the connecting base, the other end of the connector being disposed on the second connecting hole, and the first connecting hole and the second connecting hole communicating with each other.

[0016] Using the above technical solution, one end of the connector is located in the first connecting hole, passes through the top surface, and extends out of the opening for connection with the first circuit board. The other end of the connector is located in the second connecting hole and is connected to the second circuit board. In this way, a single connector can be connected to both the first and second circuit boards simultaneously, eliminating the need for additional connection structures, simplifying the design, and saving space.

[0017] According to another specific embodiment of the present invention, an embodiment of the present invention discloses a current sensor, wherein the top surface includes a first surface and a second surface, and along the first direction, the height of the second surface is less than or equal to the height of the first surface.

[0018] Using the above technical solution, the top surface includes a first surface and a second surface. Along the first direction, the height of the second surface is less than or equal to the height of the first surface. Thus, when the current sensor includes multiple connectors, the multiple connectors can be evenly distributed on the first surface and the second surface, making it easier to make full use of the space on the top surface to arrange more connectors and improve space utilization.

[0019] According to another specific embodiment of the present invention, an embodiment of the present invention discloses a current sensor, wherein the housing is made of thermoplastic plastic.

[0020] By adopting the above technical solution, compared with the existing technology of using thermosetting plastics for secondary injection molding to form the shell, the use of thermoplastic plastics to make the shell can further reduce costs.

[0021] This utility model also discloses a power module, comprising:

[0022] A current sensor includes a housing and a body. The housing includes a cavity with an opening, and the body is disposed in the cavity. The body includes a connector, one end of which extends out of the opening.

[0023] A first circuit board is provided, covering the opening, and the first circuit board is soldered to one end of the connector.

[0024] Using the above technical solution, the first circuit board is welded to one end of the connector. Since other components on the first circuit board need to be connected by welding, the welding of one end of the connector can be done together with the welding of other components on the first circuit board without adding any additional processes. Furthermore, electrical connection and fixed connection can be achieved by welding once, without the need to set additional fixing structures on the housing. For example, there is no need to open grooves on the housing for fixed connection with the output copper busbar of the power module, which simplifies the design, saves space and reduces development costs.

[0025] According to another specific embodiment of the present invention, a power module is disclosed, wherein the main body and the cavity wall are spaced apart, the main body and the cavity wall are connected by potting compound, the potting compound is cured to form an encapsulation part, the encapsulation part includes a top surface and a connecting surface, the connecting surface is fitted to the cavity wall, and one end of the connector passes through the top surface and extends out of the opening.

[0026] Using the above technical solution, the main body and the cavity wall are connected by potting compound. The potting compound cures to form the encapsulated part. By using potting compound for one-time molding instead of the traditional multi-injection molding process, the need for developing multiple molds and performing multiple injection molding processes is eliminated, reducing production steps (e.g., eliminating the need for staged injection molding of different parts). The production process is simpler, reducing costs. Furthermore, the thermal conductivity and insulation properties of potting compound materials (e.g., epoxy resin) are superior to traditional injection molding materials, improving the performance of the current sensor. In addition, after curing, the potting compound adheres tightly to the cavity wall, forming an integral sealed structure, which enhances dustproof, waterproof, and vibration-resistant performance, reducing subsequent protective treatment costs.

[0027] According to another specific embodiment of the present invention, a power module is disclosed, including an output copper busbar. Along a first direction, the output copper busbar and a first circuit board are spaced apart. A current sensor is disposed between the output copper busbar and the first circuit board. The output copper busbar includes a sensing hole. One end of a housing away from the first circuit board passes through the sensing hole and is spaced apart from the output copper busbar. The housing is not connected to the output copper busbar.

[0028] By adopting the above technical solution, on the one hand, along the first direction, the current sensor is located between the output copper busbar and the first circuit board, and the end of the housing away from the first circuit board (e.g., the second part) passes through the sensing hole. Therefore, the space of the power module in the first direction (e.g., the vertical direction) can be fully utilized, avoiding the occupation of space in the horizontal direction. On the other hand, the housing is not connected to the output copper busbar, eliminating the need to create grooves on the housing or set additional protrusions on the output copper busbar, which simplifies the design, saves space, and reduces development costs.

[0029] The present invention also discloses an inverter, which includes at least the power module described in any of the above embodiments. Attached Figure Description

[0030] Figure 1 Schematic diagrams of the current sensor and inverter connection are shown in some embodiments.

[0031] Figure 2 A partial perspective view of the power module of the inverter provided in an embodiment of this application is shown.

[0032] Figure 3 A partial exploded perspective view of the power module provided in an embodiment of this application is shown.

[0033] Figure 3a The embodiments provided in this application are shown. Figure 3 A color-coded exploded 3D view of a medium-power module.

[0034] Figure 4 A partial half-sectional view of the power module provided in an embodiment of this application is shown.

[0035] Figure 4a The embodiments provided in this application are shown. Figure 4 Color partial half-section view of the medium power module.

[0036] Figure 5 A three-dimensional schematic diagram of the main body of the current sensor provided in an embodiment of this application is shown.

[0037] Figure 5a The embodiments provided in this application are shown. Figure 5 A color 3D schematic diagram of the main body of the medium current sensor.

[0038] Figure 6 This paper shows a perspective view of the current sensor provided in an embodiment of the present application, in which the main body is not encapsulated in a housing.

[0039] Figure 6a The embodiments provided in this application are shown. Figure 6 A color 3D schematic diagram of the main body of the medium current sensor, which is not encapsulated in a housing.

[0040] Figure 7 A three-dimensional schematic diagram of the main body of the current sensor provided in the embodiment of this application is shown.

[0041] Figure 7a The embodiments provided in this application are shown. Figure 7 A color 3D schematic diagram of the main body of the medium current sensor encapsulated in the housing.

[0042] Figure 8 An exploded view of the current sensor provided in an embodiment of this application is shown.

[0043] Figure 8a The embodiments provided in this application are shown. Figure 8 A color exploded view of the current sensor in the image.

[0044] Figure 9 An exploded view of the connector and the second circuit board of the current sensor provided in an embodiment of this application is shown.

[0045] Figure 10 A schematic diagram of the assembly process of the current sensor provided in an embodiment of this application is shown.

[0046] Figure 10a The embodiments provided in this application are shown. Figure 10 A color-coded schematic diagram of the assembly process of a medium current sensor. Detailed Implementation

[0047] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Although the description of this utility model will be presented in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this embodiment. On the contrary, the purpose of describing the utility model in conjunction with the embodiments is to cover other options or modifications that may be derived based on the claims of this utility model. To provide a deep understanding of this utility model, many specific details will be included in the following description. This utility model may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this utility model, some specific details will be omitted in the description. It should be noted that, without conflict, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0048] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0049] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0050] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0051] In the description of this embodiment, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0052] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0053] In some embodiments, see Figure 1 The current sensor includes a housing 10 and a connection pin 11. The connection pin 11 and the inverter circuit board 13 are electrically connected by a crimping process. The housing 10 has a groove 101 and an additional protrusion structure 141 on the output copper busbar 14 of the inverter. The protrusion structure 141 and the groove 101 cooperate with each other to achieve a fixed connection between the current sensor and the inverter circuit board 13.

[0054] The above solution requires additional press-fitting processes and equipment, which increases manufacturing costs. It also requires additional fixing structures (such as protrusions 141 and grooves 101) to be designed on the output copper busbar 14 and the housing 10, which increases the complexity and cost of the design.

[0055] Based on this, see Figure 2 , Figure 3 , Figure 3aThis application provides an inverter, including a power module, for converting direct current (DC) output from a power battery into three-phase alternating current (AC) to drive a motor. In some embodiments, the power module includes a current sensor 20, a first circuit board 30, and an output copper busbar 40. The output copper busbar 40 and the first circuit board 30 are spaced apart along a first direction Z. The current sensor 20 is located between the output copper busbar 40 and the first circuit board 30. The output copper busbar 40 includes a sensing hole 41, and one end of the current sensor 20 can pass through the sensing hole 41 to detect the phase current of the output copper busbar 40.

[0056] For example, the power module includes three output copper busbars 40, which are spaced apart along a second direction X for outputting three-phase alternating current. Correspondingly, a current sensor 20 is provided between each output copper busbar 40 and the first circuit board 30 to detect the current of each phase. It is understood that this application embodiment does not limit the number or location of the current sensors 20. For example, the current sensor 20 can also be used to measure the current of the DC input copper busbar (not shown in the figure). In this case, typically only one current sensor 20 is needed, located between the DC input copper busbar and the first circuit board 30.

[0057] In some embodiments, see Figure 4 ( Figure 4a ), Figure 5 ( Figure 5a ), Figure 6 ( Figure 6a ) and combined Figure 3 The current sensor 20 includes a housing 21 and a main body 22. The housing 21 includes a cavity 212 with an opening 211. The main body 22 is disposed in the cavity 212 and includes a connector 221, one end of which extends out of the opening 211. A first circuit board 30 covers the opening 211 and is welded to one end of the connector 221. Exemplarily, the housing 21 is made of thermoplastic. This application does not limit this; for example, the housing 21 may be made of epoxy resin, polyurethane, or other materials.

[0058] For example, the first circuit board 30 is a control circuit board for the power module, which can be used to adjust the switching sequence of components such as electronic switching tubes according to key parameters such as the amplitude and phase of the current fed back by the sensor, so as to optimize motor efficiency and dynamic response. The connector 221 includes connecting pins. The number of connectors 221 is not limited in this embodiment, for example, it can be 1, 2, 3, 4, 5, 6, 7, 8, etc.

[0059] Using the above technical solution, the first circuit board 30 is welded to one end of the connector 221. Since other components on the first circuit board 30 need to be connected by welding, one end of the connector 221 can be welded together with the other components on the first circuit board 30 without adding any additional steps. Furthermore, electrical connection and fixed connection can be achieved through a single welding process. There is no need to set additional fixing structures on the housing 21. For example, there is no need to open grooves on the housing 21 for connection with the additional protrusions designed on the output copper busbar 40. This simplifies the design, saves space, and reduces development costs.

[0060] In some embodiments, see Figure 4 ( Figure 4a ), Figure 5 ( Figure 5a ), Figure 6 ( Figure 6a ) and combined Figure 3 The main body 22 is used to detect the phase current of the output copper busbar 40. The end of the housing 21 away from the first circuit board 30 passes through the sensing hole 41 and is spaced apart from the output copper busbar 40. The housing 21 is not connected to the output copper busbar 40. In this way, since the housing 21 is spaced apart from the output copper busbar 40 and is not connected to the output copper busbar 40, there is no need to make a groove on the housing 21 or to make an additional protrusion structure on the output copper busbar 40, which simplifies the design, saves space and reduces development costs.

[0061] In some embodiments, the current sensor 20 provided in this application includes an encapsulation portion 23. The main body 22 and the cavity wall 2121 of the cavity 212 are spaced apart. The main body 22 and the cavity wall 2121 are connected by potting compound. The potting compound is cured to form the encapsulation portion 23. The encapsulation portion 23 includes a top surface 231 and a connecting surface 232. The connecting surface 232 is fitted to the cavity wall 2121. One end of the connector 221 passes through the top surface 231 and extends out of the opening 211.

[0062] Using the above technical solution, the main body 22 and the cavity wall 2121 are connected by potting compound. The potting compound cures to form the encapsulation part 23. By using potting compound for one-time molding instead of the traditional multiple injection molding process, the development of multiple molds and multiple injection molding processes are eliminated, reducing production steps (e.g., eliminating the need for staged injection molding of different parts). The production process is simple and can reduce costs. Furthermore, the thermal conductivity and insulation properties of the potting compound material (e.g., epoxy resin) are superior to those of traditional injection molding materials, which can improve the performance of the current sensor 20. In addition, after the potting compound cures, it adheres tightly to the cavity wall 2121 to form an integral sealed structure, which can enhance dustproof, waterproof and vibration-resistant performance and reduce the cost of subsequent protective treatment.

[0063] In some embodiments, see Figure 5 ( Figure 5a ), Figure 6 ( Figure 6a ), Figure 7 ( Figure 7a ) and combined Figure 4 The current sensor 20 includes a first positioning connection portion 24 and a second positioning connection portion 25. The first positioning connection portion 24 and the second positioning connection portion 25 are spaced apart on the top wall 213 of the housing 21, and the top wall 213 surrounds the opening 211. Both the first positioning connection portion 24 and the second positioning connection portion 25 extend along a first direction Z and are connected to the first circuit board 30. Exemplarily, both the first positioning connection portion 24 and the second positioning connection portion 25 are cylindrical, but this embodiment is not limited to this, and they can also be rectangular or other shapes.

[0064] In some embodiments, see Figure 5 ( Figure 5a ), Figure 6 ( Figure 6a ), Figure 7 ( Figure 7a ) and combined Figure 4 The first circuit board 30 includes a first insertion hole 31, a second insertion hole 32 and a third insertion hole 33 arranged at intervals. One end of the connector 221 passes through the first insertion hole 31. The first positioning connection part 24 and the second positioning connection part 25 of the current sensor 20 are respectively inserted into the second insertion hole 32 and the third insertion hole 33.

[0065] During installation, after inserting the first positioning connector 24 and the second positioning connector 25 into the second insertion hole 32 and the third insertion hole 33 respectively, the connection position of the current sensor 20 on the first circuit board 30 can be determined, thus achieving the positioning of the current sensor 20's installation position. One end of the connector 221 is naturally inserted into the first insertion hole 31. For example, the diameters of the second insertion hole 32 and the third insertion hole 33 are both larger than the diameter of the first insertion hole 31, facilitating that the first positioning connector 24 can be directly inserted into the second insertion hole 32 and the second positioning connector 25 can be directly inserted into the third insertion hole 33.

[0066] It is understood that the number of the first positioning connection part 24 and the second positioning connection part 25 in this application embodiment is not limited, and the number can be 2, 3, 4, etc.

[0067] In some embodiments, see Figure 5 ( Figure 5a ), Figure 6 ( Figure 6a ), Figure 7 ( Figure 7a ) and combined Figure 3Along the first direction Z, the housing 21 includes a first portion 214 and a second portion 215. A cavity 212 is disposed in the first portion 214 and the second portion 215, and an opening 211 is disposed on the side of the first portion 214 facing away from the second portion 215. Exemplarily, the main body 22 includes a second circuit board 222 and a detection unit 223. The second circuit board 222 is disposed in the first portion 214 and the second portion 215. In the first portion 214, the other end of the connector 221 is connected to the second circuit board 222. In the second portion 215, the detection unit 223 is disposed on the second circuit board 222. Exemplarily, the second portion 215 is disposed through a sensing hole 41, and the wall of the sensing hole 41 surrounds the detection unit 223.

[0068] For example, the detection unit 223 includes a magnetic sensor (e.g., a Hall element) for detecting the magnetic field strength and converting it into an electrical signal. When current flows through a conductor (e.g., the output copper busbar 40), a magnetic field proportional to the current is generated around it according to Ampere's circuital law. The detection unit 223 can detect the magnetic field strength and convert it into an electrical signal, which is then provided to the second circuit board 222. The second circuit board 222 can amplify and process the original signal before transmitting the electrical signal to the first circuit board 30 via the connector 221.

[0069] In some embodiments, see Figure 7 ( Figure 7a ), Figure 8 ( Figure 8a ), Figure 9 and combined Figure 3 The main body 22 includes a connecting seat 224, which includes at least one set of spaced connecting holes. Each set of connecting holes includes a first connecting hole 2241 and a second connecting hole 2242. The first connecting hole 2241 is located on the top surface 2243 of the connecting seat 224. One end of the connector 221 is located in the first connecting hole 2241, and the second connecting hole 2242 is located on the side of the connecting seat 224. The other end of the connector 221 is located in the second connecting hole 2242. The first connecting hole 2241 and the second connecting hole 2242 communicate with each other. For example, an installation channel is formed between the first connecting hole 2241 and the second connecting hole 2242. The connector 221 is located in the installation channel and includes a first end 2211 (one end of the aforementioned connector) and a second end 2212 (the other end of the aforementioned connector). The first end 2211 extends out of the first connecting hole 2241, and the second end 2212 extends out of the second connecting hole 2242. Understandably, the number of connecting holes is not limited in the embodiments of this application. It can be determined according to the number of connectors 221. For example, there can be 6 sets of connecting holes, corresponding to 6 connectors 221.

[0070] In some embodiments, the top surface 2243 includes a first surface 22431 and a second surface 22432. Along the first direction Z, the height of the second surface 22432 may be equal to the height of the first surface 22431, and the first surface 22431 and the second surface 22432 are flush in the second direction X.

[0071] For example, along the first direction Z, the height of the second surface 22432 is less than the height of the first surface 22431, and the first surface 22431 and the second surface 22432 are not flush in the second direction X. For example, the connector 224 is arranged in an "L" shape, and when the current sensor 20 includes multiple connectors 221, the multiple connectors 221 can be evenly distributed on the first surface 22431 and the second surface 22432.

[0072] Understandably, compared to the case where the first surface 22431 and the second surface 22432 are flush in the second direction X, that is, the height of the second surface 22432 is equal to the height of the first surface 22431, the above technical solution can reduce the material of the connecting seat 224 and achieve a lightweight design.

[0073] Figure 10 , Figure 10a This illustration shows an assembly diagram of the current sensor provided in an embodiment of this application. For ease of understanding, it is combined with... Figures 5 to 7a , Figure 9 The assembly process of the current sensor provided in the embodiments of this application is further explained below:

[0074] First, the connector 221 is inserted into the connector 224. The first end 2211 of the connector 221 extends out of the first connecting hole 2241, and the second end 2212 extends out of the second connecting hole 2242. The second end 2212 is then soldered to the second circuit board 222. Simultaneously, the detection unit 223 is soldered to the second circuit board 222. At this point, the connector 221, connector 224, detection unit 223, and second circuit board 222 together form the main body 22 (e.g., ...). Figure 5 (As shown).

[0075] Then, the main body 22 is placed into the cavity 212 of the housing 21, at which point the main body 22 and the cavity wall 2121 of the cavity 212 are spaced apart (e.g., Figure 6 (As shown). Finally, the main body 22 and the cavity wall 2121 are connected by potting compound, and the main body is encapsulated in the housing 21. The potting compound cures to form the encapsulation part 23 (as shown). Figure 7 (As shown). It is understood that the components such as the housing 21 in the embodiments of this application can be mass-produced standard parts, and there are no restrictions on the materials (for example, they can be inexpensive thermoplastic plastics). In this way, by using potting compound for one-time molding instead of the traditional multiple injection molding process, the process of developing multiple sets of molds and multiple injection molding is eliminated, and the production steps can be reduced (for example, there is no need to inject different parts in stages).

[0076] Although the present invention has been illustrated and described with reference to certain preferred embodiments, those skilled in the art should understand that the above description is a further detailed explanation of the present invention in conjunction with specific embodiments, and should not be construed as limiting the specific implementation of the present invention to these descriptions. Those skilled in the art can make various changes in form and detail, including some simple deductions or substitutions, without departing from the spirit and scope of the present invention.

Claims

1. A current sensor, characterized by include: The housing includes a cavity with an opening; The main body is used to detect the phase current of the output copper busbar. The main body includes a connector. The main body is disposed in the cavity and spaced apart from the cavity wall. The main body and the cavity wall are connected by potting compound. The potting compound is cured to form an encapsulation part. The encapsulation part includes a top surface and a connecting surface. The connecting surface is fitted to the cavity wall. One end of the connector passes through the top surface and extends out of the opening for connection with the first circuit board.

2. The current sensor of claim 1, wherein, It includes a first positioning connection part and a second positioning connection part, which are spaced apart on the top wall of the housing. The top wall surrounds the opening. Both the first positioning connection part and the second positioning connection part extend along a first direction for connection with the first circuit board.

3. The current sensor of claim 2, wherein, Along the first direction, the housing includes a first part and a second part, the cavity is disposed in the first part and the second part, and the opening is disposed on the side of the first part opposite to the second part; The main body includes a second circuit board and a detection unit. The second circuit board is disposed in the first part and the second part. In the first part, the other end of the connector is connected to the second circuit board. In the second part, the detection unit is disposed in the second circuit board.

4. The current sensor of claim 3, wherein, The main body includes a connecting seat, the connecting seat includes at least one set of spaced connecting holes, each set of connecting holes includes a first connecting hole and a second connecting hole, the first connecting hole is located on the top surface of the connecting seat, one end of the connector is located in the first connecting hole, the second connecting hole is located on the side of the connecting seat, the other end of the connector is located in the second connecting hole, and the first connecting hole and the second connecting hole are in communication.

5. The current sensor of claim 4, wherein, The top surface includes a first surface and a second surface, and along the first direction, the height of the second surface is less than or equal to the height of the first surface.

6. The current sensor of claim 1, wherein, The shell is made of thermoplastic.

7. A power module, characterized by include: A current sensor includes a housing and a body. The housing includes a cavity with an opening, and the body is disposed in the cavity. The body includes a connector, one end of which extends out of the opening. A first circuit board is provided, covering the opening, and the first circuit board is soldered to one end of the connector.

8. The power module of claim 7, wherein, The main body and the cavity wall are spaced apart. The main body and the cavity wall are connected by potting compound. The potting compound is cured to form an encapsulation part. The encapsulation part includes a top surface and a connecting surface. The connecting surface is fitted to the cavity wall. One end of the connector passes through the top surface and extends out of the opening.

9. The power module of claim 7 or 8, characterized in that The device includes an output copper busbar, which is spaced apart from the first circuit board along a first direction. A current sensor is disposed between the output copper busbar and the first circuit board. The output copper busbar includes a sensing hole. One end of the housing away from the first circuit board passes through the sensing hole and is spaced apart from the output copper busbar. The housing is not connected to the output copper busbar.

10. An inverter, characterized by comprising: Includes the power module as described in any one of claims 7-9.

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