一种用于调试功率模块共e电感的装置
By designing a sliding rail or sliding adjustment device for the common-e inductor on the power module, the problems of high experimental cost and low efficiency in traditional methods are solved. This enables the electrical performance debugging of different common-e inductors to be completed on a single device, and optimizes the balance between switching losses and overvoltage.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG GULAN ELECTRONICS TECH CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-17
AI Technical Summary
In dynamic testing, the traditional non-Kelvin gate bonding method requires the creation of experimental modules with different common-e inductors multiple times, resulting in high experimental costs and low efficiency. It is also impossible to effectively adjust the common-e inductor of the power module to optimize the balance between switching losses and overvoltage.
Design a debugging device to adjust the common-e inductance on a device by means of a slide rail or sliding, including a combination of a metal slider or magnetic block and a slide groove, to achieve flexible adjustment of the common-e inductance, reduce experimental costs and improve efficiency.
By completing the electrical performance debugging of different common-e inductances on a single device, experimental costs are significantly reduced, experimental efficiency is improved, and the balance between switching losses and overvoltage is optimized.
Smart Images
Figure CN224518859U_ABST
Abstract
Claims
1. An apparatus for debugging the common inductance of a power module, comprising a DBC (1), an insulated gate bipolar transistor (IGBT) (2), a signal pin and a debugging device, characterized in that: The metal layer in the DBC (1) consists of a first metal layer (3) and a second metal layer (4) of the same height and independent of each other. An insulated gate bipolar transistor (IGBT) (2) and a first signal pin (6) with a signal pin base and a diode (7) are respectively disposed on the first metal layer (3). The diode (7) is connected to the second metal layer (4) through a bonding wire (8). A gate signal pin (9) with a signal pin base (5) and a second signal pin (10) are respectively disposed on the second metal layer (4). The gate signal pin (9) is fixed on the second metal layer (4) through the signal pin base and is connected to the insulated gate bipolar transistor (IGBT) (2) through a bonding wire. The second signal pin (10) is connected to the second metal layer (4) and the insulated gate bipolar transistor (IGBT) (2) through an adjustment device. When the first signal pin (6) and the gate signal pin (9) are respectively connected to the drive circuit, the common-e inductance is adjusted through the adjustment device.
2. The apparatus for debugging power module common e-inductance according to claim 1, characterized in that: The insulated gate bipolar transistor (IGBT) has at least three e-metal layers (11) and at least one gate metal layer (12) respectively. Adjacent e-metal layers (11) are connected by multiple bonding wires, and the gate metal layer (12) is connected to the gate signal pin (9) by bonding wires.
3. The apparatus for debugging power module common e-inductance according to claim 1 or 2, characterized in that: The debugging device consists of a bonding wire, a metal slider (13), and a long strip metal slide rail (14). One end of the bonding wire is mounted on the e-polar metal layer (11) of the insulated gate bipolar transistor (IGBT) (2), and the other end is provided with a metal slider (13). The long strip metal slide rail (14) is fixedly or detachably mounted on the upper surface of the second metal layer (4). A second signal pin (10) is embedded at the end of the long strip metal slide rail (14) away from the e-polar metal layer (11). The long strip metal slide rail (14) is provided with a groove (15) for horizontal sliding of the slider. The metal slider of the bonding wire is placed in the groove (15). The common e inductance is adjusted by sliding the metal slider (13) to adjust the distance.
4. The apparatus for debugging the common-e inductor of a power module according to claim 1 or 2, characterized in that: The debugging device consists of a bonding wire, a magnetic block (16), and a long strip metal strip (17). One end of the bonding wire is installed on the e-polar metal layer (11) of the insulated gate bipolar transistor (IGBT) (2), and the other end is provided with a magnetic block (16). The long strip metal strip (17) is fixed on the upper surface of the second metal layer (4). A second signal pin (10) is installed at the end of the long strip metal strip (17) away from the e-polar metal layer (11). By moving the magnetic block (16) and changing the distance between the magnetic block (16) and the second signal pin (10), the magnetic block (16) is then attracted to the long strip metal strip (17), thereby adjusting the common e-inductance.
5. The apparatus for debugging power module common e-inductance according to claim 3, characterized in that: The longitudinal section of the groove (15) is an inverted T-shaped structure with a smaller top and a larger bottom, which is used to ensure that the metal slider slides into the groove (15) and does not slide out from above the groove (15).