双面晶圆测试台及双面晶圆测试设备
By designing a double-sided wafer test stage and utilizing a combination of adjustment components and probes, precise probe movement and pressure sensing are achieved, solving the problems of low efficiency and poor reliability of traditional test stages, improving testing efficiency and reliability, and protecting wafers.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHENGDU YUNYI ZHICHUANG TECH CO LTD
- Filing Date
- 2025-07-16
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional double-sided wafer testing stations have low testing efficiency and poor reliability, and are prone to damaging the wafers being tested.
Design a double-sided wafer test stage, including a support stage, a support frame, and a test mechanism. By adjusting the combination of components and probes, precise movement and pressure sensing of the probes can be achieved, ensuring effective contact and protection between the probes and the wafer PAD points.
It improves testing efficiency and reliability, reduces wafer damage, ensures effective contact between probes and PAD points, and prevents damage caused by excessive contact.
Smart Images
Figure CN224518894U_ABST
Abstract
Claims
1. A dual-sided wafer test station, comprising: include: A support platform, comprising two support plates, with a test station disposed between the two support plates; A support frame for carrying the double-sided wafer and transporting it to the testing station; The testing mechanism is provided on both of the support plates. Each testing mechanism includes a needle holder and a testing module. The needle holder is disposed on the support platform. The testing module includes an adjustment component and a probe. The adjustment component is installed on the side of the needle holder facing the testing station. The adjustment component is connected to the probe and is used to drive the probe to move relative to the needle holder to adjust the position of the probe. The probe holder is used to drive the test module to move relative to the support platform so that the probe contacts and tests the PAD point of the double-sided wafer located at the test station. The test module also includes a pressure sensor, which is used to detect the pressure value of the probe contacting the PAD point, and the pressure sensor is connected between the adjustment component and the probe.
2. The double-sided wafer testing stage as described in claim 1, characterized in that, The needle holder includes a first driving component, a second driving component, and a third driving component connected in sequence. The first driving component is used to drive the second driving component and the third driving component to move relative to the support platform along a first horizontal direction. The second driving component is used to drive the third driving component to move relative to the support platform along a second horizontal direction. The first horizontal direction is perpendicular to the second horizontal direction. The adjustment component is mounted on the third drive component, which is used to drive the test module to move vertically up and down relative to the support platform, so as to drive the probe to make vertical contact with the PAD point.
3. The dual-sided wafer test station of claim 2, wherein, The third driving component is provided with a connecting plate and a mounting plate connected to each other on the side facing the test station. The mounting plate extends along the first horizontal direction. The adjustment component is disposed on the mounting plate. The pressure sensor is disposed on the side of the mounting plate away from the needle seat. The adjustment component is used to drive the pressure sensor and the probe to move along the first horizontal direction.
4. The dual-sided wafer test station of claim 3, wherein, The connecting plate includes a first connecting segment and a second connecting segment that are connected to each other. The two ends of the second connecting segment are respectively connected to the first connecting segment and the mounting plate. The first connecting segment is arranged vertically, and the second connecting segment is inclined towards the probe from one end connected to the first connecting segment to the other end connected to the mounting plate.
5. The double-sided wafer testing stage as described in claim 3, characterized in that, The bottom of the mounting plate has an upwardly recessed groove. The adjustment assembly includes an adjustment rod extending vertically and a mounting rod extending in the first horizontal direction. The adjustment rod is located at the top of the mounting plate and its bottom end extends into the groove. The mounting rod is located on the side of the mounting plate away from the connecting plate. The two ends of the mounting rod in the first horizontal direction are a first end and a second end, respectively. The first end extends into the groove, and the pressure sensor is connected to the second end. The bottom end of the adjusting rod is threaded into the first end so that when the adjusting rod is rotated, the mounting rod moves along the first horizontal direction, thereby driving the pressure sensor and the probe to move along the first horizontal direction.
6. The double-sided wafer testing stage as described in claim 5, characterized in that, The pressure sensor is connected to a mounting block on the side away from the mounting plate. The mounting block has a stepped surface facing upwards. The probe has a connector, which is fastened to the mounting step by bolts and covers the stepped surface.
7. The double-sided wafer testing stage as described in any one of claims 1 to 6, characterized in that, The two support plates are a first support plate and a second support plate located below the first support plate. The first support plate has a clearance hole at the position corresponding to the test station. The test mechanism located on the first support plate is a first test mechanism, and the test mechanism located on the second support plate is a second test mechanism. The needle seat of the first test mechanism is located on the top of the first support plate and close to the clearance hole.
8. The dual-sided wafer test station of claim 7, wherein, The support frame includes support legs, a chuck disposed on the top of the support legs, and a motion mechanism disposed below the second support plate. The second support plate has an opening, and the bottom of the support legs passes through the opening and connects to the motion mechanism. The chuck is used to carry the double-sided wafer, and the chuck has a through hole that exposes the PAD point on the bottom of the double-sided wafer. The motion mechanism is used to drive the support legs and the chuck to move, so as to transport the double-sided wafer carried on the chuck to the test station.
9. The double-sided wafer testing stage as described in claim 7, characterized in that, The first support plate is provided with a plurality of first test mechanisms, which are arranged at intervals around the clearance hole; And / or, the second support plate is provided with a plurality of second testing mechanisms, which are arranged at intervals around the testing station.
10. A double-sided wafer testing apparatus, characterized by, The double-sided wafer testing equipment uses a double-sided wafer testing station as described in any one of claims 1 to 9.