一种碳化硅芯片激光焊接测试实验装置
By designing a laser welding test device for silicon carbide chips, stable and continuous welding and testing were achieved, solving the problems of inconvenient welding alignment and unstable positioning, improving sampling efficiency and result consistency, and reducing mass production risks.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JINAN LUJING SEMICON CO LTD
- Filing Date
- 2025-08-08
- Publication Date
- 2026-07-17
AI Technical Summary
The existing silicon carbide chip welding process suffers from problems such as inconvenient welding alignment, unstable positioning, and easy loosening of test connections. Furthermore, it lacks a structure that allows welding and testing to be completed continuously at the same station, affecting the consistency and efficiency of sampling tests.
An experimental device was designed, comprising a main base, a test group, a laser welding group, and a chip and lead positioning mechanism. The device uses a three-point positioning system consisting of a chip solder tray and a lead support. The laser welding machine is positioned above the crossbar and aligned with the central area of the chip. The test instruments and test claws are pre-wired, enabling continuous completion of welding and testing.
It improves the stability and consistency of silicon carbide chip welding, increases sampling efficiency, and reduces the risks and costs of mass production material input.
Smart Images
Figure CN224518907U_ABST
Abstract
Claims
1. A silicon carbide chip laser welding test experimental device, comprising a main base (1), a test group, a laser welding group, and a chip and lead wire positioning mechanism, characterized in that: The test set includes a test instrument (2) set on one side of the main base (1), a test claw left bracket (3) and a test claw right bracket (5) set on the left and right sides of the main base (1), and a left test claw (4) and a right test claw (6) respectively installed on the test claw left bracket (3) and the test claw right bracket (5); the test instrument (2) is electrically connected to the left test claw (4) and the right test claw (6) via wires so that the test lead can be clamped by the test claw to achieve electrical connection; The laser welding assembly includes a laser welding assembly crossbar (7) supported by the left support (3) and the right support (5) of the test claw, a laser welding machine (8) mounted on the crossbar (7), and a downward-working laser welding head (9) connected to the laser welding machine (8). The chip and lead positioning mechanism includes a chip solder tray support (12) set on the main body base (1) and a chip solder tray (13) set on the chip solder tray support (12). The chip solder tray (13) is used to center the chip under test and position the solder sheets on both sides of the chip. The left and right sides of the chip solder tray support (12) are respectively provided with a left lead support (10) and a right lead support (11) to support and guide the test leads on both sides. The laser welding head (9) is located above the chip solder tray (13) and aligned with the central area of the chip so as to melt the solder sheets on both sides under the action of the laser, so that the test leads on both sides are welded to the positive and negative electrodes of the chip respectively to complete the welding and subsequent testing.
2. The silicon carbide chip laser welding testing apparatus according to claim 1, characterized in that: The chip solder tray (13) has a central positioning groove for the chip and solder sheet limiting structures located on the left and right sides of the chip, which are either sidewalls or limiting grooves.
3. The silicon carbide chip laser welding testing apparatus according to claim 1, characterized in that: The chip tin holder (13) is made of ceramic, high-temperature resistant metal or high-temperature resistant composite material.
4. The silicon carbide chip laser welding testing apparatus according to claim 1, characterized in that: The laser welding machine (8) can move along the length of the laser welding assembly crossbar (7) and has a focusing mechanism to align the solder joints on the chip solder tray (13).
5. The silicon carbide chip laser welding testing apparatus according to claim 1, characterized in that: The wire between the test instrument (2) and the test claw is a high-temperature resistant, bend-resistant test cable with an insulation layer, and is detachably connected to the test claw.