一种高精度和高密度光纤阵列装置

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By stacking primary and auxiliary positioning substrates and combining them with microlens array substrates, the problems of low fiber array density and insufficient precision are solved, realizing a high-precision, high-density, and low-cost fiber array device.

CN224518994UActive Publication Date: 2026-07-17NINGBO XINLIAN OPTOELECTRONICS CO LTD

Patent Information

Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner: NINGBO XINLIAN OPTOELECTRONICS CO LTD
Filing Date: 2025-09-29
Publication Date: 2026-07-17

AI Technical Summary

Technical Problem

Existing fiber optic arrays have low density and insufficient precision, which cannot meet the needs of high-density and high-bandwidth optical communication.

Method used

The main positioning substrate and the auxiliary positioning substrate are stacked. The through holes on the main positioning substrate are small in diameter and have high precision, while the through holes on the auxiliary positioning substrate are large in diameter and have low cost. The optical fiber is compactly housed in the through holes of the main positioning substrate and loosely housed in the through holes of the auxiliary positioning substrate through cold bonding technology. Combined with the microlens array substrate, the reliability of the optical fiber array is improved.

Benefits of technology

This technology enables high-precision and high-density fiber arrays, reducing processing costs while improving the reliability and assembly efficiency of fiber arrays.

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Abstract

本实用新型涉及高精度和高密度光纤阵列装置，包括层叠设置的主定位基片和辅助定位基片，主定位基片上设置有用于容置光纤的第一通孔阵列，辅助定位基片上设置有用于容置光纤的第二通孔阵列，其中第一通孔阵列中的各通孔与第二通孔阵列中的各通孔位置相对，第一通孔阵列中各通孔的孔径小于第二通孔阵列中各通孔的孔径。主定位基片上的各通孔孔径小，加工的精度高且加工成本高，辅助定位基片上的各通孔孔径大，加工的精度低且加工成本低；利用主定位基片保证了光纤的位置精度，利用层叠在主定位基片上的辅助定位基片来增加光纤阵列装置的厚度，由于辅助定位基片加工成本低，从而本实用新型的光纤阵列装置既有较高的精度又有较低的成本。

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Claims

1. A high-precision and high-density fiber array device, characterized by: The device includes a main positioning substrate (1) and an auxiliary positioning substrate (2) stacked together. The main positioning substrate (1) is provided with a first through-hole array (11) for accommodating an optical fiber (100), and the auxiliary positioning substrate (2) is provided with a second through-hole array (21) for accommodating an optical fiber (100). The through-holes in the first through-hole array (11) are positioned opposite to the through-holes in the second through-hole array (21), and the aperture of each through-hole in the first through-hole array (11) is smaller than the aperture of each through-hole in the second through-hole array (21).

2. The high precision and high density fiber array device of claim 1, wherein: Each through hole in the first through hole array (11) is a circular through hole with a diameter of 125-126 μm; each through hole in the second through hole array (21) is a circular through hole with a diameter of 126-200 μm.

3. The high precision and high density fiber array device of claim 1, wherein: Each through hole in the first through hole array (11) is a polygonal through hole, and the wall of each polygonal through hole is circumscribed by a circle with a diameter of 125 to 126 μm; each through hole in the second through hole array (21) is also a polygonal through hole, and the wall of each polygonal through hole is circumscribed by a circle with a diameter of 126 to 200 μm.

4. The high precision and high density fiber array device according to claim 2 or 3, characterized in that: The diameter of each through hole in the second through hole array (21) is smaller at the end near the main positioning substrate (1) than at the end away from the main positioning substrate (1).

5. The high precision and high density fiber array device of claim 4, wherein: Both the first through-hole array (11) and the first through-hole array (11) include M*N through holes for accommodating the corresponding optical fiber (100), where M and N are both positive integers greater than or equal to 2.

6. The high precision and high density fiber array device of claim 5, wherein: The spacing between two adjacent through holes in the first through hole array (11) is set to 240-260 μm.

7. The high precision and high density fiber array device of claim 1, wherein: A microlens array substrate (3) is provided on the side of the main positioning substrate (1) away from the auxiliary positioning substrate (2), and each microlens on the microlens array substrate (3) is opposite to each through hole in the first through hole array (11).

8. The high precision and high density fiber array device of claim 1, wherein: The thickness of the main positioning substrate (1) is 100-300 μm, and the thickness of the auxiliary positioning substrate (2) is 1000-3000 μm.

9. The high precision and high density fiber array device of claim 1, wherein: The main positioning substrate (1) is made of silicon, and the auxiliary positioning substrate (2) is made of quartz.