一种植入式光子芯片及脑机接口装置

Abstract

一种植入式光子芯片及脑机接口装置，包括：由多个光学测量单元集成的光学测量阵列，其中，每个光学测量单元包括光接收模块、光波导分路模块、光干涉仪模块、光探测器模块；光接收模块布置于光子芯片朝向被测量区域的一侧表面上，光学测量阵列中的多个光接收模块组成光子芯片的光接收面；光波导分路模块分别与光接收模块、光干涉仪模块的输入端和光探测器模块的输入端连接；光干涉仪模块的输出端与光探测器模块的输入端连接；光探测器模块包括输出电信号的输出端。该光子芯片解决对生物超弱发光(UPE)进行探测中，设备体积大、功耗高、精度不足、结果缺乏验证等问题。

Claims

1. An implantable photonic chip, characterized in that: An optical measurement array integrating multiple optical measurement units, wherein each optical measurement unit includes an optical receiving module, an optical waveguide splitter module, an optical interferometer module, and a photodetector module; The optical receiving module is arranged on one side surface of the photonic chip facing the area to be measured, and the multiple optical receiving modules in the optical measurement array constitute the optical receiving surface of the photonic chip; The optical waveguide splitter module is connected to the output terminal of the optical receiver module, the input terminal of the optical interferometer module, and the input terminal of the photodetector module, respectively. The output terminal of the optical interferometer module is connected to the input terminal of the photodetector module; The photodetector module includes an output terminal for outputting electrical signals.

2. The implantable photonic chip of claim 1, wherein, The optical receiving module is a grating coupler that includes an optical fiber and an optical waveguide. The optical fiber is arranged on one side surface of the photonic chip facing the area to be measured. Multiple optical fibers in the optical measurement array form the optical receiving surface of the photonic chip, and the optical receiving surface is a plane. The grating coupler is a silicon nitride (SiN) grating coupler, and the tilt angle of the grating coupler is set to 70 degrees.

3. The implantable photonic chip of claim 1, wherein, The optical receiving module is a femtosecond laser-written on-chip waveguide.

4. The implantable photonic chip of claim 1, wherein, The optical waveguide splitter module includes a splitter input waveguide, a splitter input star coupler, a splitter array waveguide, a splitter output star coupler, a first splitter waveguide, and a second splitter waveguide; wherein... The shunt input waveguide, the shunt input star coupler, the shunt array waveguide, and the shunt output star coupler are connected in sequence. The branch output star coupler is connected to the first branch waveguide and the second branch waveguide respectively; The branch output star coupler inputs light with a fixed wavelength range into the optical interferometer module through the first branch waveguide; The branch output star coupler inputs light outside the fixed wavelength range into the photodetector module through the second branch waveguide.

5. The implantable photonic chip of claim 1, wherein, The optical interferometer module is a Mach-Zehnder (MZI) interferometer, which includes a beam splitter and a phase shifter.

6. The implantable photonic chip of claim 1, wherein, The optical detector module includes an interferometer detector unit and a direct detector unit; The interferometer detector unit receives the interference pattern output by the optical interferometer module and outputs an electrical signal after photoelectric conversion; The direct detector unit receives the multi-wavelength mixed light output from the optical waveguide splitter module and outputs the photoelectric converted electrical signal. The photodetector module is a complementary metal-oxide-semiconductor (CMOS) detector.

7. The implantable photonic chip of claim 1, wherein, The photonic chip is a photonic integrated circuit (PIC) chip that integrates the optical receiving module, the optical waveguide splitter module, the optical interferometer module, the photodetector module, and the optical waveguide on a single substrate.

8. The implantable photonic chip of claim 7, wherein, The surface of the optical waveguide is provided with a scattering suppression layer.

9. The implantable photonic chip of claim 1, wherein, It also includes biocompatible packaging, which includes a PDMS flexible substrate layer and a silicon nitride passivation layer; The silicon nitride passivation layer covers the optical measurement array; The PDMS flexible substrate layer covers the silicon nitride passivation layer.

10. An implantable photonic-chip brain-machine interface device, comprising: Includes a titanium alloy fastener, a power module, a wireless transmission module, and an implantable photonic chip as described in any one of claims 1-9; The titanium alloy fixing member is arranged between the skull and the dura mater of the human body; The power module and the wireless transmission module are fixed on the surface of the titanium alloy fixing member; The surface of the photonic chip opposite to the light receiving surface is fixed on the surface of the titanium alloy fixing member facing the dura mater; The light receiving surface of the photonic chip faces the dura mater of the human body.

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