半导体结构、半导体封装结构及光计算设备
By using a pluggable load-bearing structure design and adjusting the optical path of the reflective surface, the problem of damage to fiber arrays during high-temperature reflow soldering was solved, improving the packaging yield and packaging convenience, and reducing the packaging difficulty.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI XIZHI TECH CO LTD
- Filing Date
- 2025-06-23
- Publication Date
- 2026-07-17
AI Technical Summary
In existing optoelectronic co-packaging technologies, fiber arrays and their connectors cannot withstand the high temperatures of reflow soldering, resulting in low packaging yield and high packaging difficulty.
The design employs a pluggable carrier structure. First, the optical engine and carrier structure are reflow soldered onto the packaging substrate. Then, the fiber array is positioned onto the carrier structure. The reflective surface is used to shift the light between the lens arrays in the vertical direction, raising the height of the fiber array and avoiding damage to the fiber array and pigtails due to high temperature.
It improves the packaging yield, reduces the packaging difficulty, enhances the convenience and versatility of packaging, and reduces packaging complexity.
Smart Images
Figure CN224519002U_ABST
Abstract
Claims
1. A semiconductor structure, characterized by, include: A load-bearing structure, comprising a first load-bearing plate, a second load-bearing plate, and a connector for connecting the first load-bearing plate and the second load-bearing plate, wherein a first limiting structure is provided on the upper surface of the second load-bearing plate; The light engine has its upper surface fixed to the lower surface of the first carrier plate, and a light coupling area is formed at one edge of the light engine. The lower surface of the light engine is flush with or protrudes from the lower surface of the second carrier plate. An optical fiber array, comprising multiple optical fibers and an optical fiber base for fixing the optical fibers, wherein the lower surface of the optical fiber base is provided with a second limiting structure for use in conjunction with a first limiting structure, and the first limiting structure and the second limiting structure are used to realize a pluggable connection between the optical fiber array and the carrier structure. A first lens array is fixed in the optical coupling region; The second lens array is fixed to the optical end face of the fiber optic base; A first light-reflecting surface and a second light-reflecting surface are disposed on the connector, the first light-reflecting surface and the second light-reflecting surface are disposed opposite to each other, and the first light-reflecting surface is located below the second light-reflecting surface; When the fiber array is pluggable to the carrier structure, the light emitted from the optical coupling region passes through the first lens array, the first light reflecting surface, the second light reflecting surface, and the second lens array in sequence before reaching the optical end face, and / or the light emitted from the optical end face passes through the second lens array, the second light reflecting surface, the first light reflecting surface, and the first lens array in sequence before reaching the optical coupling region.
2. The semiconductor structure of claim 1, wherein, One of the first limiting structure and the second limiting structure is a protrusion and the other is a groove. The optical fiber and the second limiting structure have overlapping portions on the lower surface of the optical fiber base.
3. The semiconductor structure of claim 2, wherein, The optical coupling region is multiple, and the multiple optical coupling regions are arranged in an array at the edge position on one side of the optical engine, and the array includes a first arrangement direction; When the fiber array is pluggable to the support structure, the dimensional error between the groove and the protrusion along the first arrangement direction is less than or equal to 10 micrometers, and / or the dimensional error between the groove and the protrusion along the second direction is less than or equal to 10 micrometers; The second direction is perpendicular to the first arrangement direction and perpendicular to the lower surface of the optical fiber base.
4. The semiconductor structure of claim 3, wherein, The first limiting structure is a cube structure; The first side of the cube structure is parallel to the first arrangement direction, and the second side of the cube structure is parallel to the second direction.
5. The semiconductor structure of any one of claims 2 to 4, wherein, The end of the protrusion is chamfered.
6. The semiconductor structure of any one of claims 2 to 4, wherein, The groove has a chamfer at the edge of the groove opening.
7. The semiconductor structure of any one of claims 1 to 4, wherein, The first light-reflecting surface and the second light-reflecting surface are arranged opposite to and parallel to each other.
8. The semiconductor structure of claim 7, wherein, include: The periscope structure disposed on the connector includes a first light-reflecting surface and a second light-reflecting surface.
9. A semiconductor package structure, comprising: include: The packaging substrate, the first electronic integrated circuit chip, and the semiconductor structure according to any one of claims 1 to 8; The first electronic integrated circuit chip and the semiconductor structure are fixed on the packaging substrate, and the first electronic integrated circuit chip and the semiconductor structure are electrically connected through wiring on the packaging substrate.
10. An optical computing device, comprising: Comprising: The semiconductor package structure of claim 9.