声光单元及光机电一体化装置

By using a mechanical bracket to fix the acousto-optic medium in the acousto-optic unit, and placing the high-frequency transducer and circuit board on the side or under the heat sink of the bracket, the problems of large area occupation and pollution of the acousto-optic unit are solved, achieving a compact structure and clean device performance, which is suitable for opto-mechatronic devices.

CN224519070UActive Publication Date: 2026-07-17DYN PHOTONICS

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DYN PHOTONICS
Filing Date
2025-06-24
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing acousto-optic unit structures occupy a large area and are easily contaminated, making them difficult to integrate and ensure device performance.

Method used

The acousto-optic medium is fixed by a mechanical bracket, and the high-frequency transducer and transition circuit board are set on the side wall of the mechanical bracket. The components are fixed by bonding or welding processes. The transition circuit board and impedance matching circuit board are set on the side or bottom of the heat sink of the mechanical bracket, which is suitable for surface mount technology.

Benefits of technology

The size of the acousto-optic unit has been reduced, ensuring device quality and cleanliness, increasing service life and improving long-term stability, making it suitable for integration into opto-mechatronic devices.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224519070U_ABST
    Figure CN224519070U_ABST
Patent Text Reader

Abstract

本实用新型提供一种声光单元及光机电一体化装置,包括:机械支架,用于固定声光介质,兼顾散热器作用;高频换能器,附着于声光介质侧壁上;过渡电路板,附着于散热件侧壁上,包括电接触区和第一电插头;高频换能器的电极与电接触区电连接;第一电插头延伸并凸出于机械支架的下表面,与安装平台上的第一电插座匹配。本实用新型将过渡电路板和阻抗匹配电路板设置在机械支架的侧面,或者将阻抗匹配电路板设置在底部散热件下方,该光机电一体化的声光单元的电接触,热接触和机械固定同时完成,适合于表面贴装技术,体积小,占用面积小、结构紧凑;还采用键合或焊接工艺固定部件,有利于实现光学空间清洁和无污染,增加使用寿命,同时确保长期稳定性。
Need to check novelty before this filing date? Find Prior Art

Claims

1. An acousto-optic cell, characterized by, The acousto-optic unit includes at least: Mechanical support, acoustic and optical media, high-frequency transducer and transition circuit board; The mechanical support is used to fix the acousto-optic medium and also serves as a heat dissipation component; The high-frequency transducer is attached to the sidewall of the acousto-optic medium, and the transition circuit board is attached to the sidewall of the mechanical support. The transition circuit board is provided with at least two electrical contact areas and a first electrical plug corresponding to each contact area; the electrodes of the high-frequency transducer are electrically connected to the electrical contact areas; the first electrical plug extends downward along the surface of the transition circuit board and protrudes from the lower surface of the mechanical support; wherein the first electrical plug matches the first electrical socket on the mounting platform of the acoustic-optical unit.

2. The acousto-optic unit according to claim 1, characterized in that: One end of the transition circuit board is attached to the side wall of the mechanical support below the acoustic-optical medium, and the other end protrudes from the lower surface of the mechanical support; the transition circuit board is also provided with an impedance matching circuit, which is electrically connected between the electrical contact area and the first electrical plug.

3. The acousto-optic cell of claim 2, wherein: The transition circuit board is also provided with a high-frequency connector, the input interface of which is matched with the first electrical socket on the mounting platform in the form of the first electrical plug.

4. The acousto-optic cell of claim 1, wherein: The acoustic-optical unit also includes an impedance matching circuit board, which is fixed inside the mounting platform and electrically connected to the first electrical plug via the first electrical socket.

5. The acousto-optic cell of claim 4, wherein: The impedance matching circuit board also includes a high-frequency connector, the output end of which is electrically connected to the impedance matching circuit on the impedance matching circuit board, and the second electrical plug serves as an input interface that matches the second electrical socket on the mounting platform for electrical connection with external devices.

6. The acousto-optic cell of claim 4, wherein: The first electrical socket and the components on the impedance matching circuit board are located on opposite sides of the impedance matching circuit board; or, the first electrical socket and the components on the impedance matching circuit board are located on the same side of the impedance matching circuit board.

7. The acousto-optic cell of claim 1, wherein: The high-frequency transducer is bonded or welded to the acousto-optic medium, the transition circuit board is bonded or welded to the mechanical support, and the acousto-optic medium is bonded or welded to the mechanical support.

8. The acousto-optic cell of any of claims 1-7, wherein: The mechanical support includes a top heat sink and a bottom heat sink fixed together, with a receiving groove formed between the top heat sink and the bottom heat sink, and the acousto-optic medium is bonded or welded into the receiving groove between the top heat sink and the bottom heat sink.

9. The acousto-optic cell of claim 8, wherein: The cross-section of the receiving groove on a plane perpendicular to the light propagation path is a U-shaped groove structure or a square-shaped structure.

10. The acousto-optic unit according to claim 8, characterized in that: The top heat sink and the bottom heat sink are fixed together by bonding, welding or gluing.

11. The acousto-optic cell of claim 8, wherein: The top heat sink and the bottom heat sink are provided with through fixing holes, and the size of the fixing hole on the top heat sink is larger than the size on the bottom heat sink.

12. The acousto-optic cell of claim 8, wherein: When an impedance matching circuit board is provided, there is also a receiving cavity below the bottom heat sink; the transition circuit board is provided on the side wall of the top or bottom heat sink; at this time, the impedance matching circuit board is moved into the receiving cavity, and a high-frequency connector is also provided on the impedance matching circuit board. The first electrical plug is moved and serves as the input interface of the high-frequency connector. The impedance matching circuit board is electrically connected to the transition circuit board, and the impedance matching circuit board realizes the electrical connection between the acoustic-optical unit and external devices through the high-frequency connector.

13. The acousto-optic cell of claim 12, wherein: The impedance matching circuit board and the transition circuit board are electrically connected via metal leads; or the impedance matching circuit board and the transition circuit board are respectively provided with a third electrical plug and a third electrical socket, and the third electrical plug and the third electrical socket are matched to realize the electrical connection between the impedance matching circuit board and the transition circuit board.

14. An opto-mechatronics device, characterized in that, The opto-mechatronics device includes at least the acousto-optic unit as described in any one of claims 1-13.