Sealing structure, display device and electronic equipment

Abstract

This application discloses a sealing structure, a display device, and an electronic device. The sealing structure includes a first substrate, a second substrate, a frame adhesive, and an edge sealing adhesive. The first substrate and the second substrate are disposed opposite to each other, with the orthographic projection of the first substrate onto the second substrate located within the second substrate, and the edge of the orthographic projection of the first substrate onto the second substrate not coinciding with the edge of the second substrate. The frame adhesive is disposed between and connects the first substrate and the second substrate, and the edge sealing adhesive is connected to the second substrate and surrounds the first substrate and the frame adhesive. This sealing structure improves the sealing effect of the sealing structure by making the size of the first substrate smaller than the size of the second substrate, thereby allowing the frame adhesive to perform a first seal on the first substrate and the second substrate, and the edge sealing adhesive to perform a second seal on the first substrate, the frame adhesive, and the second substrate. This improves the display effect of the display device.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a sealing structure, display device, and electronic device. Background Technology

[0002] With the development of technology, display devices have been widely used in people's lives. For example, liquid crystal displays and electronic paper displays are used in various electronic devices.

[0003] In related technologies, display devices generally include a first substrate, a second substrate, and a bezel adhesive. The first substrate and the second substrate are disposed opposite to each other, and the bezel adhesive is disposed between the first substrate and the second substrate to form a sealing structure, thereby sealing the first substrate and the second substrate. However, due to poor sealing effect between the various layers of materials, the sealing effect of the display device is affected, resulting in poor display effect of the display device. Utility Model Content

[0004] This application proposes a sealing structure, a display device, and an electronic device to solve the technical problem that during the bonding process between the first substrate and the second substrate, some areas may have poor sealing between the layers of materials, which would affect the sealing effect of the display device and result in poor display performance.

[0005] On one hand, this application provides a sealing structure for a display device. The sealing structure includes a first substrate, a second substrate, a frame adhesive, and an edge sealing adhesive. The first substrate and the second substrate are disposed at a distance from each other. The orthographic projection of the first substrate onto the second substrate is located inside the second substrate, and the edge of the orthographic projection of the first substrate onto the second substrate does not coincide with the edge of the second substrate. The frame adhesive is disposed between the first substrate and the second substrate and is respectively connected to the first substrate and the second substrate. The edge sealing adhesive is connected to the second substrate and surrounds the first substrate and the frame adhesive.

[0006] Optionally, the first substrate includes a first substrate and a planarization layer stacked on the first substrate facing the second substrate; the border adhesive is disposed between the planarization layer and the second substrate and is respectively connected to the planarization layer and the second substrate, and the sealing adhesive is connected to the second substrate and surrounds the first substrate, the planarization layer and the border adhesive.

[0007] Optionally, the first substrate includes a first substrate and a planarization layer stacked on the side of the first substrate facing the second substrate; the frame adhesive is disposed between the first substrate and the second substrate and respectively connected to the first substrate and the second substrate, and the frame adhesive surrounds the planarization layer.

[0008] Optionally, the first substrate further includes a first electrode layer disposed between the first substrate and the planarization layer, wherein the orthographic projection of the first electrode layer on the second substrate coincides with the orthographic projection of the planarization layer on the second substrate.

[0009] Optionally, the first substrate further includes a color layer disposed between the first electrode layer and the first substrate, or the color layer disposed between the first electrode layer and the planarization layer.

[0010] Optionally, the second substrate includes a second substrate and an insulating layer, the insulating layer being stacked on the side of the second substrate facing the first substrate, and the frame adhesive and the sealing adhesive being respectively connected to the side of the insulating layer away from the second substrate.

[0011] Optionally, the second substrate includes a second substrate and an insulating layer, the insulating layer being stacked on the side of the second substrate facing the first substrate; the insulating layer includes a first insulating layer portion and a second insulating layer portion extending outward from one side of the first insulating layer portion, the orthographic projection of the first insulating layer portion on the second substrate coincides with the orthographic projection of the first substrate on the second substrate;

[0012] The edge adhesive is connected to the side of the first insulating layer that is away from the second substrate. A portion of the edge sealing adhesive is connected to the second substrate and adheres to the first substrate, the edge adhesive, and the outer wall of the first insulating layer. Another portion of the edge sealing adhesive is connected to the side of the second insulating layer that is away from the second substrate and adheres to the outer wall of the first substrate and the edge adhesive.

[0013] Optionally, the second substrate further includes a second electrode layer disposed between the second substrate and the insulating layer, or the second electrode layer is stacked on the side of the insulating layer opposite to the second substrate.

[0014] On the other hand, this application also provides a display device including the sealing structure described above, the display device having a display area and a non-display area disposed around the display area, the frame adhesive and the edge sealing adhesive being disposed in the non-display area respectively.

[0015] In another aspect, this application also provides an electronic device, including the display device described above.

[0016] As can be seen from the above technical solution, the sealing structure provided in this application allows the orthographic projection of the first substrate onto the second substrate to be located within the second substrate, and the edge of the orthographic projection of the first substrate onto the second substrate does not coincide with the edge of the second substrate, i.e., the size of the first substrate is smaller than the size of the second substrate. This results in an L-shaped step being formed between the edge of the first substrate and the second substrate. The frame adhesive is disposed between the first substrate and the second substrate to perform a first seal on the first substrate and the second substrate. The edge sealing adhesive is disposed at the L-shaped step so that the edge sealing adhesive is connected to the second substrate and surrounds the first substrate and the frame adhesive, thereby performing a second seal on the first substrate, the frame adhesive, and the second substrate (even if multiple layers of material are disposed on the first substrate, the edge sealing adhesive can seal the multiple layers of material to prevent the multiple layers of material from contacting air), thereby improving the sealing effect of the sealing structure and thus improving the display effect of the display device. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a cross-sectional view of the sealing structure in one embodiment of this application.

[0019] Figure 2 This is a cross-sectional view of the sealing structure in another embodiment of this application.

[0020] Figure 3 This is a cross-sectional view of the sealing structure in another embodiment of this application.

[0021] Figure 4 This is a cross-sectional view of the first substrate in one embodiment of this application.

[0022] Figure 5 This is a cross-sectional view of the sealing structure in another embodiment of this application.

[0023] Figure 6 This is a cross-sectional view of the sealing structure in another embodiment of this application.

[0024] Figure 7 This is a cross-sectional view of a display device according to one embodiment of this application. Detailed Implementation

[0025] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0026] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0027] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0028] like Figures 1-6As shown, this application provides a sealing structure 10 for a display device. The sealing structure 10 includes a first substrate 100, a second substrate 200, a frame adhesive 300, and an edge sealing adhesive 400. The first substrate 100 and the second substrate 200 are disposed at a distance from each other. The orthographic projection of the first substrate 100 on the second substrate 200 is inside the second substrate 200, and the edge of the orthographic projection of the first substrate 100 on the second substrate 200 does not coincide with the edge of the second substrate 200. The frame adhesive 300 is disposed between the first substrate 100 and the second substrate 200 and connects the first substrate 100 and the second substrate 200. The edge sealing adhesive 400 is connected to the second substrate 200 and surrounds the first substrate 100 and the frame adhesive 300. Compared with the prior art, the sealing structure 10 provided in this application allows the orthographic projection of the first substrate 100 onto the second substrate 200 to be located within the second substrate 200, and the edge of the orthographic projection of the first substrate 100 onto the second substrate 200 does not coincide with the edge of the second substrate 200, that is, the size of the first substrate 100 is smaller than the size of the second substrate 200, thereby forming an L-shaped step between the edge of the first substrate 100 and the second substrate 200; the frame adhesive 300 is disposed between the first substrate 100 and the second substrate 200 to secure the first substrate 100. The first substrate 100 and the second substrate 200 are sealed for the first time. The edge sealing adhesive 400 is disposed at the L-shaped step so that the edge sealing adhesive 400 is connected to the second substrate 200 and surrounds the first substrate 100 and the frame adhesive 300, thereby performing a second seal on the first substrate 100, the frame adhesive 300 and the second substrate 200 (even if the first substrate 100 is provided with multiple layers of materials, the edge sealing adhesive 400 can seal the multiple layers of materials to prevent the multiple layers of materials from contacting the air), so as to improve the sealing effect of the sealing structure and thus improve the display effect of the display device.

[0029] One of the first substrate 100 and the second substrate 200 is a driving substrate, and the other of the first substrate 100 and the second substrate 200 is a conductive substrate. Both the first substrate 100 and the second substrate 200 have a display area and a non-display area surrounding the display area. The size of the display area on the first substrate 100 is the same as the size of the display area on the second substrate 200 and they are arranged opposite to each other. Since the size of the first substrate 100 is smaller than the size of the second substrate 200, the width of the non-display area on the first substrate 100 is smaller than the width of the non-display area on the second substrate 200. For example, the width of the non-display area on the first substrate 100 is greater than or equal to 50% of the width of the non-display area on the second substrate 200 and less than or equal to 90% of the width of the non-display area on the second substrate 200. The relationship between the widths of the non-display areas on the first substrate 100 and the second substrate 200 can be adjusted according to the actual design requirements of the product, and is not specifically limited here.

[0030] The frame adhesive 300 is disposed in the non-display area on the first substrate 100 and in a portion of the non-display area on the second substrate 200, and the edge sealing adhesive 400 is disposed in the non-display area on the second substrate 200 and surrounds the non-display area on the first substrate 100.

[0031] The following example uses the first substrate 100 as a conductive substrate. Figures 1 to 4 As shown, the first substrate 100 includes a first substrate 110, a planarization layer 120, and an electrode layer 130. The orthographic projections of the first substrate 110, the planarization layer 120, and the electrode layer 130 on the second substrate 200 are all within the second substrate 200, and the edges of the orthographic projections of the first substrate 110, the planarization layer 120, and the electrode layer 130 on the second substrate 200 do not coincide with the edges of the second substrate 200. That is, the overall size of the first substrate 100 is smaller than the size of the second substrate 200.

[0032] Optionally, the first substrate 110 is made of a light-transmitting rigid material, such as glass or acrylic, thereby giving the first substrate 110 a certain degree of rigidity and flatness. It should be noted that in other embodiments, the first substrate 110 can also be made of a light-transmitting flexible material, such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate), or PI (polyimide), thereby giving the first substrate 110 a certain degree of flexibility to improve comfort and enhance user experience.

[0033] Optionally, a planarization layer 120 is stacked on the side of the first substrate 110 facing the second substrate 200. The planarization layer 120 is made of an organic insulating material. For example, the planarization layer 120 is mainly formed by patterning polymers and small molecule organic compounds (e.g., exposure using a mask followed by development, etching, etc.) and then curing. The planarization layer 120 is used to planarize the first substrate 110 to improve product yield. Furthermore, the planarization layer 120 can also increase the thickness of the first substrate 100 to improve its resistance to pressure damage.

[0034] Furthermore, such as Figure 1 and Figure 4As shown, the border adhesive 300 is disposed between the planarization layer 120 and the second substrate 200 and is connected to both the planarization layer 120 and the second substrate 200, respectively. That is, the orthographic projection of the planarization layer 120 on the second substrate 200 coincides with the orthographic projection of the first backing plate 110 on the second substrate 200. The border adhesive 300 provides a first seal between the planarization layer 120 and the second substrate 200. The sealing adhesive 400 is connected to the second substrate 200 and surrounds the first substrate 110, the planarization layer 120, and the border adhesive 300 to provide a second seal. Because the material of the planarization layer 120 is hygroscopic, when the planarization layer 120 comes into contact with air, it will gradually absorb moisture from the air, resulting in a deterioration in the sealing performance between the planarization layer 120, the first substrate 110, and the border adhesive 300, and even air leakage. However, in this embodiment, the sealing adhesive 400 can seal the first substrate 110, the planarization layer 120 and the edge adhesive 300 to prevent the planarization layer 120 from contacting the air.

[0035] It should be noted that in other embodiments, such as Figure 2 As shown, the border adhesive 300 can also be directly connected to the first substrate 110 and the second substrate 200, and the border adhesive 300 surrounds the planarization layer 120. That is, the orthographic projection of the planarization layer 120 on the first substrate 110 is within the first substrate 110, and the edge of the orthographic projection of the planarization layer 120 on the first substrate 110 does not coincide with the edge of the first substrate 110. This allows the border adhesive 300 and the sealing adhesive 400 to jointly seal the planarization layer 120, thereby further improving the sealing effect. Moreover, the direct connection of the border adhesive 300 to the first substrate 110 can enhance the adhesion between the border adhesive 300 and the first substrate 110. In this embodiment, the planarization layer 120 is located within the display area. It can be understood that the border adhesive 300 can also be spaced around the display area to prevent the border adhesive 300 from overflowing into the display area.

[0036] Optional, such as Figure 4 As shown, the first electrode layer 130 is disposed between the first substrate 110 and the planarization layer 120. The orthographic projection of the first electrode layer 130 on the second substrate 200 coincides with the orthographic projection of the planarization layer 120 on the second substrate 200, that is, the size of the first electrode layer 130 is the same as the size of the planarization layer 120. The first electrode layer 130 is made of a light-transmitting and conductive material, such as an ITO electrode layer.

[0037] Furthermore, the first substrate 100 also includes a color layer 140, which may be an RGB film. The color layer 140 is disposed between the first substrate 110 and the first electrode layer 130, enabling the display device to achieve a color display effect, thereby improving the user experience. It should be noted that in other embodiments, the first substrate 100 may not have the color layer 140; simply adding colored conductive particles to the liquid crystal material or electronic paste can also enable the display device to achieve a color display effect. Of course, if the display device only requires a black-and-white display effect, it is not necessary to provide the color layer 140 on the first substrate 100.

[0038] Furthermore, the first substrate 100 also includes a filler layer 150, which is disposed between the first electrode layer 130 and the color layer 140. The orthographic projection of the filler layer 150 on the second substrate 200 coincides with the orthographic projection of the planarization layer 120 on the second substrate 200. The filler layer 150 is used to planarize the color layer 140, thereby allowing the first electrode layer 130 to be better attached to or electroplated onto the filler layer 150. It should be noted that in other embodiments, the color layer 140 may also be disposed between the first electrode layer 130 and the planarization layer 120, and the planarization layer 120 may planarize the color layer 140, thus eliminating the need for the filler layer 150 and reducing production costs.

[0039] Furthermore, the first substrate 100 also includes a black matrix 160, which is disposed between the first electrode layer 130 and the first substrate 110 and surrounds the fill layer 150. The black matrix 160 is used to block light, improve contrast and prevent light leakage, thereby enabling the display device to have a better display effect.

[0040] Optionally, the second substrate 200 is a driving substrate, comprising a second substrate 210, an insulating layer 220, and a second electrode layer 230. The insulating layer 220 is stacked on the side of the second substrate 210 facing the first substrate 110, and the second electrode layer 230 is disposed between the second substrate 210 and the insulating layer 220. The orthographic projection of the insulating layer 220 on the second substrate 210 coincides with the orthographic projection of the second electrode layer 230 on the second substrate 210. It should be noted that in other embodiments, the second electrode layer 230 may also be stacked on the side of the insulating layer 220 facing away from the second substrate 210.

[0041] Optionally, the second substrate 210 is made of a rigid material, such as glass or acrylic, thereby giving it a certain degree of rigidity and flatness. It should be noted that in other embodiments, the second substrate 210 can also be made of a flexible material, such as PET (polyethylene terephthalate), PEN (polyethylene naphthalate), or PI (polyimide), thereby giving it a certain degree of flexibility to improve comfort and enhance user experience.

[0042] Optionally, the insulating layer 220 can be made of materials such as PET, PP, PC, and PVC, so that the insulating layer 220 has good insulation performance and temperature resistance characteristics.

[0043] Optionally, the second electrode layer 230 is made of a light-transmitting conductive material, such as an ITO electrode layer.

[0044] Optional, such as Figure 1 As shown, the edge adhesive 300 and the edge sealing adhesive 400 are respectively connected to the side of the insulating layer 220 away from the second substrate 210, that is, the orthogonal projection of the insulating layer 220 on the second substrate 210 coincides with the second substrate 210.

[0045] It should be noted that, in other embodiments, the orthographic projection of the insulating layer 220 onto the second substrate 210 may not coincide with the second substrate 210. For example, as... Figure 2 and Figure 5 As shown, Figure 2 The sectional view shown is in the same direction as Figure 5The cross-sectional view shown is perpendicular. The insulating layer 220 includes a first insulating layer portion 221 and a second insulating layer portion 222 extending outward from one side of the first insulating layer portion 221. The first insulating layer portion 221 and the second insulating layer portion 222 are respectively stacked on the side of the second substrate 210 facing the first substrate 110, and the orthographic projection of the first insulating layer portion 221 on the second substrate 210 coincides with the orthographic projection of the first substrate 110 on the second substrate 210. The frame adhesive 300 is connected to the side of the first insulating layer portion 221 away from the second substrate 210. A portion of the sealing adhesive 400 is connected to the side of the second substrate 210 facing the first substrate 110 and adheres to the first substrate 100, the frame adhesive 300, the second electrode layer 230, and the outer sidewall of the first insulating layer portion 221. Another portion of the sealing adhesive 400 is connected to the side of the second insulating layer portion 222 away from the second substrate 210 and adheres to the first substrate 100 and the outer sidewall of the frame adhesive 300. This reduces the area of ​​the insulating layer 220, lowering production costs, and allows the sealing adhesive 400 and the second insulating layer 222 to seal the first insulating layer 221, preventing cracking of the first insulating layer 221 after prolonged contact with air. Furthermore, a portion of the sealing adhesive 400 is directly connected to the side of the second substrate 210 facing the first substrate 110, enhancing the adhesion between the sealing adhesive 400 and the second substrate 210.

[0046] For example, in another implementation, such as Figure 3 and Figure 6 As shown, Figure 3 The sectional view shown is in the same direction as Figure 6 The cross-sectional view shown is perpendicular, and the orthographic projection of the first insulating layer portion 221 onto the second substrate 210 can also be within the orthographic projection of the first substrate 110 onto the second substrate 210. Furthermore, the edge of the orthographic projection of the first insulating layer portion 221 onto the second substrate 210 does not coincide with the edge of the orthographic projection of the first substrate 110 onto the second substrate 210, meaning the size of the first insulating layer portion 221 is smaller than the size of the first substrate 110. This allows a portion of the frame adhesive 300 to be connected to the side of the second substrate 210 facing the first substrate 110, the outer wall of the second electrode layer 230, and the outer wall of the first insulating layer portion 221, while another portion of the frame adhesive 300 is connected to the side of the second insulating layer portion 222 away from the second substrate 210. This further reduces the area of ​​the insulating layer 220, lowering production costs, and also allows the frame adhesive 300 and the sealing adhesive 400 to jointly seal the first insulating layer portion 221. Furthermore, a portion of the frame adhesive 300 is directly connected to the side of the second substrate 210 facing the first substrate 110, which can enhance the adhesion between the frame adhesive 300 and the second substrate 210.

[0047] Furthermore, the second substrate 200 also has a soldering area (PAD area), that is, one side of the second substrate 210 has an outwardly extending extension 260, the second electrode layer 230 has a soldering portion on the extension 260, and the second insulating layer 222 is formed by the first insulating layer 221 extending toward the extension 260 from the side near the extension 260, and the second insulating layer 222 may also be partially stacked on the extension 260.

[0048] It should be noted that, in other embodiments, the second substrate 200 may also include the planarization layer and the filler layer described above, in order to perform planarization treatment on the second substrate 200.

[0049] Border adhesive 300 and edge sealing adhesive 400 are mainly made of environmentally friendly solvent-free polyurethane or epoxy resin, which gives them the characteristics of strong adhesion, rapid curing, high temperature resistance, cold resistance and good weather resistance.

[0050] This application also provides a display device 20, such as... Figure 7 As shown, the display device 20 includes the sealing structure 10 described above. The display device 20 can be applied to an electronic paper display, and it has a display area and a non-display area surrounding the display area. The display area is filled with electronic paste. A border adhesive 300 is disposed in the non-display area and surrounds the display area to seal the electronic paste filling the display area. An edge-sealing adhesive 400 is disposed in the non-display area and surrounds the border adhesive 300 to seal the display device 20 again, thereby improving the display effect of the display device 20.

[0051] Optionally, the display device 20 further includes a grid-like barrier 500 disposed within the display area to divide the display area into multiple pixel units, thereby improving the display effect of the display device 20. The barrier 500 may be formed on the first substrate 100 or the second substrate 200.

[0052] Furthermore, the display device 20 also includes thin-film transistors disposed on the second substrate 210. The thin-film transistors are used to control the brightness and color of the pixels to ensure the normal operation and high performance of the display device 20.

[0053] The working principle of the display device 20 is as follows: by changing the electric field of the first electrode layer 130 and the second electrode layer 230, the charged particles in the electronic paste are subjected to the electric field and migrate and align, thereby displaying a preset pattern.

[0054] The manufacturing method of the display device 20 is as follows:

[0055] S100, providing a first motherboard and a second motherboard;

[0056] S200, applying electronic paste to the display area of ​​the first motherboard or the second motherboard, and applying frame adhesive to the non-display area of ​​the first motherboard or the second motherboard;

[0057] S300: The first motherboard and the second motherboard are attached together, and the first motherboard is cut along the cutting line on the first motherboard, and the first motherboard and the second motherboard are cut along the cutting line on the second motherboard to obtain multiple display panels; wherein the cutting line on the first motherboard and the cutting line on the second motherboard are both located in the non-display area, and the cutting line on the first motherboard is closer to the display area than the cutting line on the second motherboard, so that the size of the first substrate of the display panel is smaller than the size of the second substrate;

[0058] S400. Apply adhesive to each display panel to form an edge sealant, so that the edge sealant fills the L-shaped step formed by the outer side of the first substrate and the second substrate, thereby obtaining the display device 20.

[0059] It should be noted that the display device 20 can also be used in liquid crystal displays, for example, by replacing the electronic paste in the display area with liquid crystal material.

[0060] This application also provides an electronic device, which may be a mobile phone, a computer, or an electronic paper, etc., and includes the display device 20 as described above.

[0061] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A sealing structure for a display device, characterized in that, The device includes a first substrate, a second substrate, a frame adhesive, and an edge sealing adhesive. The first substrate and the second substrate are disposed at a distance from each other. The orthographic projection of the first substrate onto the second substrate is located inside the second substrate, and the edge of the orthographic projection of the first substrate onto the second substrate does not coincide with the edge of the second substrate. The frame adhesive is disposed between the first substrate and the second substrate and is respectively connected to the first substrate and the second substrate. The edge sealing adhesive is connected to the second substrate and surrounds the first substrate and the frame adhesive.

2. The sealing structure as described in claim 1, characterized in that, The first substrate includes a first substrate and a planarization layer stacked on the first substrate on the side facing the second substrate; the border adhesive is disposed between the planarization layer and the second substrate and is respectively connected to the planarization layer and the second substrate; the sealing adhesive is connected to the second substrate and surrounds the first substrate, the planarization layer and the border adhesive.

3. The sealing structure as described in claim 1, characterized in that, The first substrate includes a first substrate and a planarization layer stacked on the side of the first substrate facing the second substrate; the frame adhesive is disposed between the first substrate and the second substrate and is respectively connected to the first substrate and the second substrate, and the frame adhesive surrounds the planarization layer.

4. The sealing structure as described in claim 2 or 3, characterized in that, The first substrate further includes a first electrode layer disposed between the first substrate and the planarization layer, wherein the orthographic projection of the first electrode layer on the second substrate coincides with the orthographic projection of the planarization layer on the second substrate.

5. The sealing structure as described in claim 4, characterized in that, The first substrate further includes a color layer, which is disposed between the first electrode layer and the first substrate, or the color layer is disposed between the first electrode layer and the planarization layer.

6. The sealing structure as described in claim 1, characterized in that, The second substrate includes a second substrate and an insulating layer. The insulating layer is stacked on the side of the second substrate facing the first substrate, and the frame adhesive and the sealing adhesive are respectively connected to the side of the insulating layer away from the second substrate.

7. The sealing structure as described in claim 1, characterized in that, The second substrate includes a second substrate and an insulating layer, the insulating layer being stacked on the side of the second substrate facing the first substrate; the insulating layer includes a first insulating layer portion and a second insulating layer portion extending outward from one side of the first insulating layer portion, the orthographic projection of the first insulating layer portion on the second substrate coincides with the orthographic projection of the first substrate on the second substrate; The edge adhesive is connected to the side of the first insulating layer that is away from the second substrate. A portion of the edge sealing adhesive is connected to the second substrate and adheres to the first substrate, the edge adhesive, and the outer wall of the first insulating layer. Another portion of the edge sealing adhesive is connected to the side of the second insulating layer that is away from the second substrate and adheres to the outer wall of the first substrate and the edge adhesive.

8. The sealing structure as described in claim 6 or 7, characterized in that, The second substrate further includes a second electrode layer disposed between the second substrate and the insulating layer, or the second electrode layer is stacked on the side of the insulating layer away from the second substrate.

9. A display device, characterized in that, Including the sealing structure as described in any one of claims 1 to 8, the display device has a display area and a non-display area disposed around the display area, and the frame adhesive and the edge sealing adhesive are respectively disposed in the non-display area.

10. An electronic device, characterized in that, Includes the display device as described in claim 9.

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