一种混光高电压mini-RGBCSP背光光源

By using a three-row, three-column array layout and a series-connected light-emitting chip design, the problems of uneven light mixing and high-voltage chip detection in mini RGB backlight sources have been solved, achieving a high-brightness, low-cost backlight source effect.

CN224519088UActive Publication Date: 2026-07-17GUANGDONG MULENSEN SMART LIGHT CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGDONG MULENSEN SMART LIGHT CO LTD
Filing Date
2025-10-11
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing mini RGB backlight sources require mini-zone dimming, which places high demands on the overall brightness of the device. This results in large deviations in the position of the RGB chips, affecting the light mixing effect. Furthermore, the testing and selection of high-voltage chips are difficult.

Method used

The light-emitting chips adopt a three-row, three-column array layout, with adjacent chips distributed at equal intervals and connected in series. Combined with the RDL circuit layer and optical ball head on the substrate, the chip spacing and light mixing effect are optimized, and it is adapted to a high-voltage driving architecture.

Benefits of technology

It significantly improves light mixing uniformity and color purity, simplifies circuit layout process, reduces the driving cost of a single chip, and ensures high-voltage, wide-angle light output performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

本实用新型公开一种混光高电压mini‑RGB CSP背光光源,包括基板以及多个设于所述基板上分别映射红光、绿光、蓝光的发光芯片,所述发光芯片以三行三列阵列布局,每一行或每一列均具有三个分别映射红光、绿光、蓝光的发光芯片,相邻所述发光芯片等间距分布且相邻异色约束,映射相同颜色的所述发光芯片串联连接。通过规划发光芯片的阵列排布方案,显著提升多芯片组合后的混光均匀性,有效增强最终白光的色彩纯度与出光一致性,此外,通过同色系发光芯片串联的电气连接,可适配高电压驱动架构需求,不仅简化了背光模组的线路布设工艺,同时在保障高电压大角度出光性能的同时,通过批量化串接方式大幅降低单颗芯片的驱动成本。
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Claims

1. A mixed light high voltage mini-RGB CSP backlight, characterized in that, The system includes a substrate (1) and a plurality of light-emitting chips (11) disposed on the substrate (1) respectively mapping red light, green light and blue light. The light-emitting chips (11) are arranged in a three-row, three-column array. Each row or each column has three light-emitting chips (11) respectively mapping red light, green light and blue light. Adjacent light-emitting chips (11) are distributed at equal intervals and adjacent chips are constrained by different colors. Light-emitting chips (11) mapping the same color are connected in series.

2. A mixed light high voltage mini-RGB CSP backlight according to any one of claim 1, characterized in that, At the center of the array is a light-emitting chip (11) that maps red light.

3. The mixed light high voltage mini-RGB CSP backlight according to any one of claim 1, wherein, At the center of the array is a light-emitting chip (11) that maps green light.

4. The mixed light high voltage mini-RGB CSP backlight according to any one of claims 1, wherein, At the center of the array is a light-emitting chip (11) that maps blue light.

5. The mixed-light high-voltage mini-RGB CSP backlight source according to any one of claims 1-4, characterized in that, The side length of each substrate (1) is a, 1mm≤a≤2mm, and the spacing between adjacent light-emitting chips (11) is d, 5um≤d≤50um.

6. A mixed light high voltage mini-RGB CSP backlight according to any one of claims 1-4, characterized in that, The substrate (1) is an RDL circuit layer having two insulating layers and three metal layers for connecting all the light-emitting chips (11) of the same color in series.

7. The mixed light high voltage mini-RGB CSP backlight according to any one of claims 1-4, wherein, The light-emitting chip (11) has a baffle layer (2) for reflecting light on the side away from the substrate (1).

8. The mixed light high voltage mini-RGB CSP backlight according to any one of claims 1-4, wherein, The side of the light-emitting chip (11) away from the substrate is filled with a transparent layer (3) to facilitate subsequent processing.

9. The mixed-light high-voltage mini-RGB CSP backlight source according to any one of claims 8, characterized in that, The transparent layer (3) has a scattering layer (4) on the side away from the substrate to improve the light mixing effect.

10. The mixed light high voltage mini-RGB CSP backlight according to any one of claims 1-4, wherein, The light-emitting chip (11) has an optical ball head (5) on its outer side for improving the light emission angle of the light source.