激光加工控制器及加工系统
By integrating a multi-channel galvanometer and laser interface into a laser processing controller, combined with a beam splitter and motion platform, the problem of limited area in traditional laser processing control cards has been solved, achieving efficient large-format processing and flexible equipment adaptability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU GOLDEN ORANGE LASER TECH CO LTD
- Filing Date
- 2025-07-17
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional laser processing control cards are only equipped with one galvanometer and laser control interface, which limits the processing area, makes it difficult to meet the needs of large-format processing, and increases equipment cost and complexity.
Design a laser processing controller that integrates multiple galvanometers and laser interfaces, combines a beam splitter and motion platform to achieve parallel processing of multiple lasers, communicates with a host computer via an EtherNet interface, supports various galvanometer and laser protocols, expands digital and analog signals through the IO interface, and has a modular structure to adapt to different processing needs.
It enables large-format splicing processing without additional auxiliary systems, improving processing efficiency, reducing equipment upgrade costs and complexity, and adapting to the processing needs of different materials and processes.
Smart Images
Figure CN224519167U_ABST
Abstract
Claims
1. A laser processing controller connected between a host computer and a laser processing system, characterized by, The laser processing controller includes a laser processing control card, and the laser processing control card includes: The control module is provided with an EtherNet interface for connecting to a host computer, and also has several sets of galvanometer interfaces for connecting galvanometers, and the same number of laser interfaces for connecting lasers. The display module is electrically connected to the control module; A power interface is provided on and electrically connected to the control module; An IO interface module is disposed on the control module and electrically connected to it.
2. A laser machining controller according to claim 1, wherein, The EtherNet interface includes an EtherNet input interface for receiving data and instructions from the host computer, and an EtherNet output interface for providing feedback on the controller and system status.
3. The laser machining controller of claim 1, wherein, The display module includes three sets of LED indicator lights, one for displaying the laser controller status, one for displaying the galvanometer status, and one for displaying the laser status.
4. The laser machining controller of claim 1, wherein, The galvanometer interface is a DB15 interface that supports the XY2-100 galvanometer protocol, and the laser interface is a DB25 interface that supports fiber lasers, CO2 lasers, and YAG lasers.
5. The laser machining controller of claim 1, wherein, The I / O interface module includes a digital input interface, a digital output interface, an analog input interface, and an analog output interface.
6. A laser processing system comprising the laser processing controller according to any one of claims 1 to 5, characterized in that, The laser processing system also includes: A laser used to generate a laser beam for processing; A laser optical circuit, wherein the input end of the laser optical circuit is connected to the output end of the laser, and the laser optical circuit is used to shape the laser beam. A beam splitter, the input end of which is connected to the output end of the laser optical circuit, is used to split a single laser beam into multiple parallel laser beams. Several sets of galvanometers are electrically connected to the galvanometer interface of the laser processing controller, respectively, for receiving instructions from the control module to adjust the scanning trajectory of the corresponding laser path; Several sets of field lenses are arranged one-to-one on the light-emitting side of the galvanometer to focus the laser emitted from the galvanometer into a processing spot; The motion platform is connected to the IO interface module of the laser processing controller and is used to carry the processing object and move it along the X and Y axes.
7. The laser processing system of claim 6, wherein, The number of beam splitters in the beam splitter is the same as the number of galvanometer interfaces in the laser processing controller, and each split laser beam is connected to a set of galvanometers and a set of field mirrors.
8. The laser processing system of claim 6, wherein, The laser processing system also includes a fixture, which is fixed to the upper surface of the motion platform and is used to position and clamp the object to be processed.
9. The laser processing system of claim 6, wherein, The laser processing system also includes a baffle plate, which is disposed next to the optical path channel between the beam splitter and the galvanometer to block stray light and provide safety protection.
10. The laser processing system of claim 6, wherein, The laser processing system also includes a support assembly, which includes a base, a column, a top plate, and a horizontal plate. The column is mounted on the base, the top plate is mounted on the top of the column, the horizontal plate is mounted on the upper part of the column, the laser optical path device, the beam splitter, and the galvanometer are mounted on the horizontal plate, and the motion platform is mounted on the base.