一种高效散热型机箱
The heat sink design, which combines a heat-conducting pressure plate, heat-conducting pipe, and centrifugal fan, solves the problem of poor heat dissipation in computer miniaturization, achieves efficient heat dissipation, and optimizes the heat dissipation path and space utilization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUOGUANG ELECTRONICS INFORMATION TECH
- Filing Date
- 2025-06-13
- Publication Date
- 2026-07-17
AI Technical Summary
In current computer miniaturization designs, heat sinks are ineffective in heat dissipation within space-constrained chassis, and traditional fan structures are inefficient, making it difficult to effectively dissipate heat.
The heatsink design employs a combination of heat-conducting pressure plates, heat pipes, and centrifugal fans. The heat pipes directly conduct heat from the CPU to the side-by-side heatsink fins, while the centrifugal fan replaces the front exhaust fan, dissipating heat directly through the side channel of the chassis. The design also incorporates ventilation holes and heatsink pillars to optimize the heat dissipation path.
It improves heat dissipation efficiency, reduces heat diffusion, ensures efficient heat dissipation for the CPU and other components, saves space, and achieves better heat transfer and dissipation.
Smart Images
Figure CN224519243U_ABST