一种强迫风冷的全封闭式机箱
By employing a fully enclosed chassis design and forced air cooling technology with staggered air ducts, the problem of balancing heat dissipation with electromagnetic, humidity, and salt spray performance in a fully enclosed chassis is solved, achieving both efficient heat dissipation and airtightness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DATA COMM SCI & TECH RES INST
- Filing Date
- 2025-06-23
- Publication Date
- 2026-07-17
AI Technical Summary
Existing rugged chassis, with their fully enclosed design, struggle to meet both heat dissipation requirements and performance indicators such as electromagnetic interference, humidity, and salt spray. Conventional forced air cooling designs require ventilation holes, which leads to substandard performance.
It adopts a fully enclosed design, with an internal air-cooled heat dissipation chamber and a closed chassis chamber. It uses an external fan and staggered air ducts for forced air cooling to ensure the airtightness and efficient heat dissipation of the chassis.
It achieves efficient heat dissipation in a fully enclosed state, avoiding leakage of electromagnetic, humid heat, salt spray and other conditions, and maintaining the airtightness and electrical performance of the chassis.
Smart Images
Figure CN224519245U_ABST
Abstract
Claims
1. A forced air-cooled totally-enclosed cabinet characterized by, include: The chamber shell; the interior of the chamber shell is divided into a closed chassis chamber and a wind-cooled heat dissipation chamber; The enclosed chassis chamber is equipped with components used to achieve its electrical performance; The enclosed chassis chamber is located above the air-cooled heat dissipation chamber; the air-cooled heat dissipation chamber includes a heat sink (9) and a fan assembly (5); the fan assembly (5) is located on one side of the chamber shell, and a ventilation hole (17) is located on the other side; the heat sink (9) is located inside the chamber shell, and multiple arrayed heat sinks (16) are arranged on the heat sink (9); the heat sinks (16) divide the internal cavity of the chamber shell into multiple staggered air ducts, and the fan assembly (5) and the ventilation hole (17) are connected through the air ducts.
2. The forced air-cooled, fully-enclosed cabinet of claim 1, wherein, The heat sink (16) has a rectangular plate structure.
3. The forced air-cooled, fully-enclosed cabinet of claim 2, wherein, The air ducts are crisscrossing linear air ducts.
4. Forced air-cooled full-enclosure cabinet according to any of claims 1-3, characterized in that, The chamber shell includes: a front panel (1), a rear panel (7), a bottom plate (2), a left side panel (10), a right side panel (4), and a top cover plate (18); the bottom plate (2) and the top cover plate (18) are arranged parallel to each other; the front panel (1), the rear panel (7), the left side panel (10), and the right side panel (4) surround the bottom plate (2) and the top cover plate (18) and are arranged perpendicular to the bottom plate (2) and the top cover plate (18).
5. The forced air-cooled, fully-enclosed cabinet of claim 4, wherein, It also includes a heat transfer baffle (8); the heat transfer baffle (8) divides the internal space of the chamber shell into an upper enclosed chassis chamber and a lower air-cooled heat dissipation chamber.
6. The forced air-cooled, fully-enclosed cabinet of claim 5, wherein, The enclosed chassis chamber is formed by the upper cover (18), front panel (1), rear panel (7), left side panel (10), right side panel (4), heat transfer baffle (8) and fan cover (3) of fan assembly (5), and the joints are sealed.
7. The forced air-cooled, fully-enclosed cabinet of claim 6, wherein, The enclosed chassis cavity is equipped with a PCB board (13).
8. The forced air-cooled, fully-enclosed cabinet of claim 7, wherein, A heat dissipation substrate (14) is provided below the PCB board (13).
9. The forced air-cooled, fully-enclosed cabinet of claim 8, wherein, A thermal pad (15) is provided between the heat dissipation substrate (14) and the heat transfer partition (8).
10. The forced air-cooled, fully-enclosed cabinet of claim 9, wherein, A pressure valve is installed on the outer shell of the chamber, which is used to achieve pressure balance between the inside and outside of the chassis.