一种具有温控功能的环控托架总装系统

Abstract

本实用新型属于设备散热技术领域，具体涉及一种具有温控功能的环控托架总装系统，包括托架、设置于托架的机箱，托架上设置朝向机箱的托架进风口，托架进风口与环控系统通过管路连接；机箱包括机箱壳体，机箱壳体内设置冷板结构，冷板结构包括冷板壳体、设置于冷板壳体内的PCB板，所述PCB板上设置功能芯片，功能芯片的散热路径结构上设置金属块I，金属块I与散热路径结构导热连接，金属块I与压电陶瓷I或压力传感器I接触，压电陶瓷I或压力传感器I与温控模块电连接，温控模块与环控系统电连接。通过上述系统实时自动调节环控流量，提高散热可靠性，并可以降低调试工作量。

Claims

1. An environmental control bracket assembly system with temperature control function, comprising a bracket (1) and a chassis (3) disposed on the bracket (1), wherein the bracket (1) is provided with a bracket air inlet (2) facing the chassis (3), and the bracket air inlet (2) is connected to the environmental control system through a pipeline; the chassis (3) includes a chassis shell (4), and a cold plate structure (7) is disposed inside the chassis shell (4), the cold plate structure (7) including a cold plate shell and a PCB board (8) disposed inside the cold plate shell, characterized in that: The PCB board (8) is provided with a functional chip (10). A metal block I (171) is provided on the heat dissipation path structure of the functional chip (10). The metal block I (171) is thermally connected to the heat dissipation path structure. The metal block I (171) is in contact with the piezoelectric ceramic I (151) or the pressure sensor I. The piezoelectric ceramic I (151) or the pressure sensor I is electrically connected to the temperature control module. The temperature control module is electrically connected to the environmental control system.

2. The environmental control cradle assembly system with temperature control function according to claim 1, wherein: The heat dissipation path structure is also provided with an insulation block, which is thermally connected to the heat dissipation path structure. The insulation block is in contact with the piezoelectric ceramic II (152) or the pressure sensor II. The piezoelectric ceramic II (152) or the pressure sensor II is electrically connected to the temperature control module. The metal block I (171) and the insulation block are arranged in a group. The distance between the metal block I (171) and the insulation block in the same group on the heat dissipation path structure is close so that the metal block I (171), the insulation block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions.

3. The temperature-controlled environment cradle assembly system of claim 2, wherein: The temperature control module includes a memory, a control logic circuit, an amplifier circuit for amplifying the input signal, and a power supply.

4. The temperature-controlled environment cradle assembly system of claim 2 or 3, wherein: The heat dissipation path structure includes a functional chip (10) and a cold plate housing connected in sequence. The inner wall of the cold plate housing is provided with a metal block I (171) and an insulation block. A piezoelectric ceramic I (151) or pressure sensor I, a piezoelectric ceramic II (152) or pressure sensor II, and a temperature control module are integrated on the PCB board.

5. The temperature-controlled environment cradle assembly system of claim 4, wherein: The inner wall of the cold plate housing is provided with a heat dissipation protrusion (16), and the functional chip (10) is thermally connected to the heat dissipation protrusion (16) through a thermally conductive pad (18).

6. The temperature-controlled environment system of claim 5, wherein: The metal block I (171) and the heat insulation block are disposed on the heat dissipation boss (16).

7. The temperature-controlled environment system of claim 4, wherein: A module connector (9) is provided on the PCB board (8). The module connector (9) extends out of the cold plate housing. A backplate assembly (6) is provided inside the chassis housing (4). A backplate connector that is inserted into the module connector (9) is provided on the backplate assembly (6). A chassis connector (5) that is electrically connected to the backplate assembly (6) is provided on the chassis housing (4). The chassis connector (5) is electrically connected to the environmental control system through a cable.

8. The temperature-controlled environment system of claim 4, wherein: The chassis is an open chassis. The outer wall of the cold plate shell is provided with heat dissipation teeth (iii). The chassis shell (4) is provided with a chassis air inlet and a chassis air outlet that are connected to the bracket air inlet (2). The inner wall of the chassis shell and the cold plate structure (7) and the adjacent cold plate structures (7) form an air duct with both ends connected to the chassis air inlet and the chassis air outlet, respectively.

9. The temperature-controlled environment system of claim 4, wherein: The chassis is a closed chassis, with the cold plate shell and the chassis shell being thermally connected, and heat dissipation fins are provided on the outer wall of the chassis shell.

10. The temperature-controlled environment system of claim 2 or 3, wherein: The heat dissipation path structure includes a functional chip (10), a cold plate shell, and a chassis shell (4) connected in sequence. A temperature control device is provided on the outer wall of the chassis shell (4). The temperature control device includes a temperature control device shell (19) that is thermally connected to the chassis shell (4). A metal block I (171) and an insulation block are provided on the inner wall of the temperature control device shell (19). The metal block I (171) is thermally connected to the temperature control device shell (19), and the insulation block is thermally insulated from the temperature control device shell (19). A piezoelectric ceramic I (151) or pressure sensor I, a piezoelectric ceramic II (152) or pressure sensor II, and a temperature control module (21) are provided inside the temperature control device shell (19).

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