A chip mounting bracket

Abstract

This utility model relates to a chip mounting bracket, including a bracket base plate, positioning holes, a vertical plate, a retaining plate, a top cover plate, a retaining block, a heat sink, side insulating pads, an upper insulating pad, and mounting screw holes. Compared with the prior art, this utility model uses a vertical plate and side insulating pads to limit the position of the computer chip, and the upper insulating pad presses against the edge of the computer chip to fix it during installation by fastening with the top cover plate. Excessive force is not required during installation, avoiding deformation of the motherboard or the computer chip's cover plate due to excessive force. The removable heat sink improves the heat dissipation effect of the computer chip, and can be removed for external air cooling or water cooling. The side insulating pads and upper insulating pad limit the diffusion range of thermal grease, preventing it from seeping onto the motherboard due to excessive grease.

Description

Technical Field

[0001] This utility model relates to the field of fireworks manufacturing equipment technology, specifically a chip mounting bracket. Background Technology

[0002] When installing computer chips on the motherboard, mounting brackets are typically used for fixation. Existing mounting brackets usually use rigid hook handles to press the computer chip into the fixing component and secure it. However, because the hook handles need to be pressed into the fixing component with force, excessive force can easily cause the motherboard or computer chip to bend. At the same time, since computer chips themselves have poor heat dissipation, they require external cooling devices for heat dissipation. If too much thermal paste is applied, it can easily seep onto the motherboard. Utility Model Content

[0003] In view of the problems existing in the prior art, this utility model discloses a chip mounting bracket, including a bracket base plate, positioning holes, upright plates, clamping plates, a top cover plate, clamping blocks, a heat sink, side insulating pads, an upper insulating pad, and mounting screw holes; the bracket base plate is a rectangular plate with a rectangular notch in the center, and vertical upright plates are provided at the edges of the notch; positioning holes are provided at all four corners of the bracket base plate; protruding clamping plates are provided on the upper side of the outer side of the upright plates; the top cover plate is a rectangular frame, and clamping blocks that cooperate with the clamping plates are provided on all four sides of its lower side; mounting screw holes are provided at all four corners of the top cover plate; the heat sink frame is fixed to the top cover plate with screws, and its heat sink body extends into the center of the top cover plate; the side insulating pads are installed on the inner wall of the clamping plates; the upper insulating pads are installed on the inner side of the lower side of the top cover plate.

[0004] In a preferred embodiment of this utility model, the base plate, upright plate, and top cover plate of the bracket are all made of plastic.

[0005] In a preferred embodiment of this utility model, the heat sink frame is made of plastic and the heat sink body is made of copper.

[0006] In a preferred embodiment of this utility model, both the side insulating pad and the upper insulating pad are made of rubber.

[0007] In a preferred embodiment of this utility model, the lower side of the side insulating pad is flush with the upper side of the bracket base plate.

[0008] As a preferred embodiment of this utility model, the upper insulating pad is fitted to the inner wall of the upper cover plate during installation.

[0009] The beneficial effects of this utility model are as follows: The utility model uses a vertical plate and side insulating pads to limit the position of the computer chip, and the upper cover plate is used to fasten the computer chip by pressing it against the edge of the computer chip during installation. Excessive force is not required during installation, which avoids deformation of the motherboard or computer chip cover plate due to excessive force. The detachable heat sink improves the heat dissipation effect of the computer chip. It can be detached and connected to an external air-cooled or water-cooled heat sink. The side insulating pads limit the diffusion range of thermal grease, preventing it from seeping onto the motherboard due to excessive grease. Attached Figure Description

[0010] Figure 1 This is a three-dimensional schematic diagram of the present invention;

[0011] Figure 2 This is a cross-sectional view of the present utility model. Figure 1 ;

[0012] Figure 3 This is a cross-sectional view of the present utility model. Figure 2 ;

[0013] In the diagram: 1. Base plate of bracket; 2. Positioning hole; 3. Vertical plate; 4. Clamping plate; 5. Top cover plate; 6. Clamping block; 7. Heat sink; 8. Side insulating pad; 9. Top insulating pad; 10. Mounting screw hole. Detailed Implementation

[0014] Example 1

[0015] like Figures 1 to 3 As shown, a chip mounting bracket of this utility model includes a bracket base plate 1, positioning holes 2, upright plates 3, clamping plates 4, upper cover plate 5, clamping blocks 6, heat sink 7, side insulating pads 8, upper insulating pads 9, and mounting screw holes 10. The bracket base plate 1 is a rectangular plate with a rectangular notch in the center and vertical upright plates 3 around the edge of the notch. Positioning holes 2 are provided at all four corners of the bracket base plate 1. The upper side of the outer surface of the upright plates 3 is provided with protruding clamping plates 4. The upper cover plate 5 is a rectangular frame with clamping blocks 6 on all four sides of its lower side that cooperate with the clamping plates 4. Mounting screw holes 10 are provided at all four corners of the upper cover plate 5. The heat sink 7 is fixed to the upper cover plate 5 with screws, and its heat sink body extends into the center of the upper cover plate 5. The side insulating pads 8 are installed on the inner wall of the clamping plates 4. The upper insulating pads 9 are installed on the inner side of the lower side of the upper cover plate 5.

[0016] The silo 13 has vertical plates 14 on its sides. A screw 5 is rotatably mounted between the vertical plates 14. A partition 4 is threaded onto the screw 5 and slides between the vertical plates 14. An inclined plate 6 is fixedly connected to the lower edge of the vertical plate 14. A baffle 30 is fixedly connected to the side of the inclined plate 6, and the baffle 30 is parallel to the partition 4. A rotating plate 7 is rotatably mounted on the partition 4, and a motor is fixedly connected to the rotating plate 7. Motor support plates 15 are fixedly connected to the middle of both sides of the inclined plate 6. A discharge roller 11 is rotatably mounted between the motor support plates 15. A motor is fixedly connected to the end of the discharge roller 11, and a discharge roller 10 is fixedly connected to the middle of the discharge roller 11. The roller 10 has evenly spaced slots. The inclined plate 6 has inclined fixed cylinder support plates 31 fixedly connected to both sides below the motor support plate 15. Two fixed cylinder support shafts 12 are installed parallel to each other by sliding buckles between the inclined fixed cylinder support plates 31. Inclined baffle plates 9 are slidably installed on the fixed cylinder support shafts 12. The inclined baffle plates 9 are parallel to the inclined plate 6. The lower edges of the inclined baffle plates 9 and the inclined plate 6 are located in the gap between the conveyor belt 19 and the pressure plate 20. The paper tubes slide down the inclined plate 6 one by one. Under the reverse rotation of the roller 10, the paper tubes are moved and arranged so that they are neatly laid out and slide down the inclined baffle plates 9 one by one onto the conveyor belt 19. The bracket base plate 1, the upright plate 3, and the upper cover plate 5 are all made of plastic. The bracket base plate 1 is fixed on the motherboard, and the pins that interface with the computer chip are located at the central rectangular notch. The upright plate 3, together with the side insulating pad 8, limits the position of the computer chip. The upper cover plate 5 and the upper insulating pad 9 press against the edge of the computer chip from above to fix it. At this time, the side insulating pad 8 and the upper insulating pad 9 both deform, reducing the gap between the computer chip and the upright plate 3 and the upper cover plate 5.

[0017] The working principle of this invention is as follows: During installation, the computer chip is aligned with the pins on the motherboard and placed inside the upright plate 3 from top to bottom. During placement, the metal cover plate presses against the side insulating pad 8, thus limiting the position of the computer chip through the upright plate 3 and the side insulating pad 8. After the computer chip is in place, the upper cover plate 5 is snapped shut from the top, the locking block 6 is secured to the locking plate 4, and the upper insulating pad 9 presses against the edge of the computer chip's metal cover plate, fixing the computer chip in place. Finally, thermal grease is applied to the computer chip's metal cover plate, and the heat sink 7 can be installed on the upper cover plate 5 to improve the heat dissipation effect of the computer chip. If an external water-cooling or air-cooling radiator is required, the heat sink 7 can be removed and fixed in the mounting screw hole 10. This invention does not require excessive force during installation, and the heat dissipation device uses an upright plate for support, preventing deformation of the computer chip's metal cover due to excessive force or the weight of the heat sink. The side insulating pad 8 and the upper insulating pad 9 limit the diffusion range of the thermal grease.

[0018] Components not described in detail in this article are existing technologies.

[0019] While the specific embodiments of this utility model have been described in detail above, this utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this utility model. Modifications or variations that do not involve creative labor are still within the protection scope of this utility model.

Claims

1. A chip mounting support, characterized by: The bracket includes a base plate (1), positioning holes (2), upright plates (3), clamping plates (4), an upper cover plate (5), clamping blocks (6), heat sinks (7), side insulating pads (8), upper insulating pads (9), and mounting screw holes (10). The base plate (1) is a rectangular plate with a rectangular notch in the center and vertical upright plates (3) at the edge of the notch. Positioning holes (2) are provided at all four corners of the base plate (1). The upper side of the outer surface of the upright plates (3) is provided with protruding clamping plates (4). The upper cover plate (5) is a rectangular frame with clamping blocks (6) that cooperate with the clamping plates (4) on all four sides of its lower side. Mounting screw holes (10) are provided at all four corners of the upper cover plate (5). The frame of the heat sink (7) is fixed to the upper cover plate (5) with screws, and the heat sink body extends into the center of the upper cover plate (5). The side insulating pads (8) are installed on the inner wall of the clamping plates (4).

2. The chip mounting support according to claim 1, characterized in that: The upper insulating pad (9) is installed on the inner side of the lower side of the upper cover plate (5).

3. The chip mounting support of claim 1, wherein: The base plate (1), upright plate (3), and top cover plate (5) of the bracket are all made of plastic.

4. The chip mounting support of claim 1, wherein: The frame of the heat sink (7) is made of plastic, and the body of the heat sink is made of copper.

5. The chip mounting support of claim 1, wherein: Both the side insulating pad (8) and the upper insulating pad (9) are made of rubber.

6. The chip mounting support of claim 1, wherein: The lower side of the side insulating pad (8) is flush with the upper side of the bracket base plate (1).

7. The chip mounting support of claim 1, wherein: The upper insulating pad (9) is fitted to the inner wall of the upper cover plate (5) during installation.

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