装有高运算能力芯片的设备、及用于其的散热模块
By using a heat dissipation component that combines a fan and a heat sink in high-performance chip devices, the problem of uneven heat dissipation of the chip is solved, achieving fast and efficient heat dissipation and noise reduction.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BITDEER SEMICONDUCTOR TECHNOLOGY PTE LTD
- Filing Date
- 2025-03-28
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, the heat generated by high-performance chips during operation is difficult to dissipate quickly, efficiently, and evenly, affecting chip performance and user experience.
The heat dissipation assembly consists of multiple primary fans and heat sinks. The fans and heat sinks are kept at an appropriate distance to ensure that the cool air is fully blown onto the heat sink and the heat is dissipated through the heat sink, while reducing equipment noise.
It achieves efficient and rapid heat dissipation, reduces equipment noise, and optimizes the user experience.
Smart Images
Figure CN224519258U_ABST
Abstract
Claims
1. A heat dissipation module for a device equipped with a high operation capability chip, characterized by, It includes a computing component (200) and a heat dissipation component (100); The heat dissipation assembly (100) includes a first main frame (110), a plurality of first fans (120) and at least one heat sink (130). The first fans (120) are used to blow out cold air to dissipate heat from the computing component (200). The first fans (120) are arranged sequentially in the first main frame (110), and each first fan (120) has the same diameter. The computing component (200) includes at least one computing board (210), and each heat sink (130) is respectively set in close contact with at least one computing board (210); The first fan (120) has a first side (121) adjacent to the heat sink (130) and a second side away from the heat sink (130); The heat sink (130) has a first end (131) adjacent to the first fan (120) and a second end away from the first fan (120); A first gap L1 is provided between the first surface (121) and the first end (131) to form a mixing gap. The first gap L1 is one-fifth to one-sixth of the diameter of the first fan (120).
2. The module of claim 1, wherein, In a direction perpendicular to the first surface (121), the projection of the computing component (200) lies within the projection of the first main frame (110).
3. The module of claim 1, wherein, The computing component (200) includes multiple parallel computing boards (210), each computing board (210) being arranged vertically relative to the first main frame (110) of the heat dissipation component (100).
4. The module of claim 3, wherein, The number of heat sinks (130) is the same as the number of computing boards (210), and each heat sink (130) is installed on the same side of the corresponding computing board (210).
5. The module of claim 3, wherein, Each computing board (210) has one or two heat sinks (130) attached to its sides, so that the same computing board (210) can be cooled by multiple heat sinks (130).
6. The module of claim 5, wherein, The number of the first fan (120) is two, the number of the computing board (210) is three, two heat sinks (130) are arranged side by side on the front of each computing board (210), and one heat sink (130) is arranged on the back of each computing board (210).
7. An apparatus equipped with a high operation capability chip, characterized by comprising: The heat dissipation module for a device equipped with a high-performance chip, as described in any one of claims 1-6.
8. The device equipped with a high operation capability chip according to claim 7, characterized by, The device equipped with a high-performance chip includes a chassis with an open front end. The first main frame (110) of the heat dissipation assembly (100) is installed at the open front end of the chassis, and the outer contour dimensions of the first main frame (110) are adapted to the dimensions of the open front end.
9. The device equipped with a high operation capability chip according to claim 8, characterized by, The computing component (200) is installed inside the chassis.
10. The device equipped with a high operation capability chip according to claim 9, wherein, The rear end of the chassis is also open. The device equipped with a high-performance chip also includes an air outlet assembly (300), which includes a second main frame (310) and a plurality of second fans (320). The second fans (320) are arranged sequentially within the second main frame (310), and each second fan (320) has the same diameter. The second main frame (310) is installed at the rear opening of the chassis, and the outer contour dimensions of the second main frame (310) are adapted to the dimensions of the rear opening; The second fan (320) is provided with a second gap L2 between the side of the heat sink (130) adjacent to the heat sink (130) and the end of the heat sink (130) adjacent to the second fan (320). The second gap L2 is one-fifth to one-sixth of the diameter of the second fan (320).