一种新型冷板液冷系统

By directly connecting the liquid cooling equipment in the server rack to the cold source system in small and medium-sized computer rooms and edge computing scenarios, a two-stage heat exchange system is formed. Combined with air cooling equipment, the problems of excessive components and low energy efficiency in traditional cold plate liquid cooling systems are solved, achieving efficient heat dissipation and energy saving and emission reduction.

CN224519259UActive Publication Date: 2026-07-17HEBEI QINHUAI DATA CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HEBEI QINHUAI DATA CO LTD
Filing Date
2025-06-20
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Traditional cold plate liquid cooling systems have too many components and are complex in small and medium-sized computer rooms and edge computing scenarios. Furthermore, energy efficiency cannot be fully utilized during the multiple heat exchange processes of the refrigerant.

Method used

A novel cold plate liquid cooling system is provided, which directly connects the liquid cooling equipment in the server rack to the cold source system through cooling pipes to form a two-stage heat exchange system. Combined with air cooling equipment, multiple heat dissipation is achieved, reducing the application of CDU, improving heat exchange efficiency, and realizing energy saving and emission reduction.

Benefits of technology

It improves heat dissipation in small and medium-sized data centers and edge computing scenarios, reduces system complexity, enhances energy efficiency, and has the effect of energy saving and emission reduction.

✦ Generated by Eureka AI based on patent content.

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Abstract

本申请公开了一种新型冷板液冷系统,包括:冷源侧系统、冷却管路和服务器机柜;所述冷却管路将若干个服务器机柜与冷源侧系统连接;所述服务器机柜内设置有液冷设备和待散热设备,所述液冷设备包括若干个换热管段,所述换热管段与待散热设备之间进行换热;所述冷却管路包括制冷剂的供给管路和回液管路,若干个所述换热管段与所述供给管路和回液管路连接,通过将所述液冷设备与冷源侧系统通过冷却管路直接连接,形成制冷剂与待散热设备之间的直接换热,从而提高换热效率的同时具备节能减排的效果。
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Claims

1. A novel cold plate liquid cooling system characterized by, include: The cold source system (100), cooling pipes (200), and server rack (300); The cooling pipes (200) connect several server racks (300) to the cold source system (100); The server rack (300) is equipped with a liquid cooling device (320) and a device to be cooled (310). The liquid cooling device (320) includes several heat exchange tubes, and the heat exchange tubes exchange heat with the device to be cooled (310). The cooling pipeline (200) includes a refrigerant supply pipeline (201) and a refrigerant return pipeline (202), and several heat exchange pipe sections are connected to the supply pipeline (201) and the refrigerant return pipeline (202).

2. The novel cold plate liquid cooling system of claim 1, wherein, The server rack (300) is equipped with an air-cooling device (330), which is located adjacent to the device to be cooled (310).

3. The novel cold plate liquid cooling system of claim 2, wherein, The air-cooled device (330) includes a liquid-cooled backplate (331), which is provided with an inlet end and an outlet end. The inlet end is connected to the supply pipeline (201), and the outlet end is connected to the return pipeline (202).

4. The novel cold plate liquid cooling system of claim 3, wherein, The air-cooled device (330) includes a fan (332), and the liquid-cooled backplate (331) is disposed on the side of the air outlet of the fan (332).

5. The novel cold plate liquid cooling system of claim 3, wherein, A control valve (333) is provided on one side of the liquid inlet end of the liquid-cooled backplate (331).

6. The novel cold plate liquid cooling system according to any one of claims 1-4, wherein, The liquid cooling device (320) includes a main liquid supply pipe (321) and a main liquid return pipe (322), and several heat exchange pipe sections are connected in parallel between the main liquid supply pipe (321) and the main liquid return pipe (322).

7. The novel cold plate liquid cooling system of claim 6, wherein, The heat exchange pipe section includes a heat exchange branch pipe (323), on which a chip cold plate (324) is provided, and the chip cold plate (324) is attached to the device to be cooled (310).

8. The novel cold plate liquid cooling system of claim 7, wherein, The chip cold plate (324) is bonded to the device to be cooled (310) with thermally conductive adhesive.

9. The novel cold plate liquid cooling system of claim 6, wherein, The main liquid supply pipe (321) and the main liquid return pipe (322) are connected to the cooling pipe (200) via quick-connect fittings (325).

10. The novel cold plate liquid cooling system according to any one of claims 1-2, wherein, The cold source side system (100) includes a radiator (101) and a pump body (102). The radiator (101) includes a liquid supply end and a liquid return end. The drain port of the radiator (101) is connected to the supply pipeline (201) through the pump body (102), and the inlet of the radiator (101) is connected to the return pipeline (202).

11. The novel cold plate liquid cooling system of claim 1, wherein, The refrigerant in the cold source side system (100) includes pure water.

12. The novel cold plate liquid cooling system of claim 1, wherein, The cooling pipes (200) are made of stainless steel or PVR material.