An environmentally controlled air-cooled chassis with temperature control function

Abstract

This utility model belongs to the field of equipment heat dissipation technology, specifically relating to an environmentally controlled air-cooled chassis with temperature control function. It includes a chassis shell, with a cold plate structure inserted inside the shell. Air ducts are formed between adjacent cold plate structures and between the inner wall of the chassis shell and the cold plate structures. The two ends of the air ducts are connected to an environmental control air inlet and an environmental control air outlet. The environmental control air inlet is connected to an environmental control system via a pipeline. The cold plate structure includes a cold plate shell and a PCB board disposed within the shell. A functional chip is disposed on the PCB board. A metal block I is disposed on the heat dissipation path structure of the functional chip. The metal block I is thermally connected to the heat dissipation path structure and contacts a piezoelectric ceramic I or a pressure sensor I. The piezoelectric ceramic I or pressure sensor I is electrically connected to a temperature control module, which is electrically connected to the environmental control system. By automatically adjusting the environmental control airflow in real time, the reliability of heat dissipation is improved, and the workload of debugging is reduced.

Description

Technical Field

[0001] This utility model belongs to the field of equipment heat dissipation technology, specifically relating to an environmentally controlled air-cooled chassis with temperature control function. Background Technology

[0002] like Figure 1 The image shows a traditional air-cooled chassis with environmental control. Its main structure includes the chassis, air-cooling modules (cold plate structure), S6 connectors, and other components. There are air ducts inside the chassis, and air ducts are formed between adjacent air-cooling modules and between the inner wall of the chassis and the air-cooling modules. The two ends of the air ducts are the chassis air inlet and the chassis air outlet. When the air-cooling modules are working, the components on the internal PCB board generate heat. The environmental control system provides cooling air into the air duct through the chassis air inlet. The heat dissipation of the components on the PCB board is conducted to the surface of the heat dissipation fins of the board (air-cooling module) and carried away by the cooling air.

[0003] Figure 1 The airflow distribution debugging of the air-cooled chassis shown is labor-intensive. The environmental control system provides cooling airflow to multiple air-cooled chassis. The heat dissipation of the cold plate structure inside the chassis is a fixed value during design. During flow distribution debugging, the flow needs to be allocated to each chassis based on the actual heat dissipation of the cold plate structure during operation. The actual heat dissipation of the cold plate structure inside the chassis has three states: higher than the design value, equal to the design value, and lower than the design value. Therefore, there are three corresponding flow adjustment states: increasing the air cooling mass, maintaining the air cooling mass, and decreasing the air cooling mass. When multiple air-cooled chassis are working simultaneously, with the number of air-cooled chassis set to N, there are theoretically N3 adjustment conditions. The debugging workload is large, and it is impossible to dynamically adjust the temperature of the cold plate structure in real time. Utility Model Content

[0004] To improve the reliability of heat dissipation of components within the cold plate structure and reduce the workload of equipment debugging, this utility model provides an environmentally controlled air-cooled chassis with temperature control function.

[0005] The purpose of this utility model is achieved through the following technical solution. According to this utility model, an environmentally controlled air-cooled chassis with temperature control function includes a chassis shell, a cold plate structure inserted inside the chassis shell, and air ducts formed between adjacent cold plate structures and between the inner wall of the chassis shell and the cold plate structures. The two ends of the air ducts are connected to an environmental control air inlet and an environmental control air outlet. The environmental control air inlet is connected to the environmental control system via a pipeline. The cold plate structure includes a cold plate shell and a PCB board disposed within the cold plate shell. A functional chip is disposed on the PCB board. A metal block I is disposed on the heat dissipation path structure of the functional chip. The metal block I is thermally connected to the heat dissipation path structure and is in contact with a piezoelectric ceramic I or a pressure sensor I. The piezoelectric ceramic I or the pressure sensor I is electrically connected to a temperature control module, and the temperature control module is electrically connected to the environmental control system.

[0006] Compared with the prior art, the advantages of this utility model are:

[0007] This invention proposes an environmentally controlled air-cooled chassis with temperature control function. A functional chip heats up, causing a metal block to deform, which in turn generates an electrical signal from a piezoelectric ceramic or pressure sensor. This signal is transmitted to the environmental control system via a temperature control module, enabling the system to automatically adjust the flow rate based on the temperature of the functional chip. This eliminates reliance on traditional temperature sensors, solving the installation and placement problems associated with them. Furthermore, the simple structure of the metal block, piezoelectric ceramic, or pressure sensor improves reliability, achieves miniaturization, and reduces maintenance workload. The system automatically adjusts the environmental control flow rate in real time, improving heat dissipation reliability and reducing debugging workload.

[0008] Furthermore, the heat dissipation path structure is also provided with a heat insulation block, which is thermally connected to the heat dissipation path structure. The heat insulation block is in contact with the piezoelectric ceramic II or the pressure sensor II, which is electrically connected to the temperature control module. The metal block I and the heat insulation block are arranged in a group. The distance between the metal block I and the heat insulation block in the same group on the heat dissipation path structure is similar so that the metal block I, the heat insulation block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions.

[0009] Compared with the prior art, the advantages of this utility model are:

[0010] When the system operates under vibration conditions, the vibration will cause relative displacement between the metal block I and the piezoelectric ceramic I 151 or the pressure sensor, thus affecting the contact pressure. This results in inaccurate electrical signals transmitted by the piezoelectric ceramic or pressure sensor corresponding to the metal block I. After setting up the insulation block, the insulation block will only deform due to vibration. After the electrical signal of the piezoelectric ceramic or pressure sensor corresponding to the insulation block is transmitted to the temperature control module, the temperature control module processes the electrical signals of the two piezoelectric ceramics or pressure sensors, calculates the electrical signal generated due to temperature deformation, cancels the electrical signal generated under vibration conditions, corrects the erroneous electrical signal generated under vibration conditions, and makes the temperature control more accurate.

[0011] Furthermore, the temperature control module includes a memory, a control logic circuit, an amplifier circuit for amplifying the input signal, and a power supply.

[0012] Furthermore, the heat dissipation path structure includes a functional chip and a cold plate housing connected in sequence with heat conduction. The inner wall of the cold plate housing is provided with a metal block I and a heat insulation block. The PCB board is integrated with piezoelectric ceramic I or pressure sensor I, piezoelectric ceramic II or pressure sensor II, and a temperature control module.

[0013] Furthermore, a heat dissipation protrusion is provided on the inner wall of the cold plate housing, and the functional chip is thermally connected to the heat dissipation protrusion through a thermally conductive pad.

[0014] Furthermore, the metal block I and the heat insulation block are mounted on the heat dissipation protrusion.

[0015] Furthermore, a module connector is provided on the PCB board, the module connector extends out of the cold plate housing, a backplane assembly is provided inside the chassis housing, a backplane connector that mates with the module connector is provided on the backplane assembly, and a chassis connector that is electrically connected to the backplane assembly is provided on the chassis housing, and the chassis connector is electrically connected to the environmental control system via a cable.

[0016] Furthermore, heat dissipation denticles are provided on the outer wall of the cold plate shell.

[0017] Furthermore, the heat dissipation path structure includes a functional chip, a cold plate housing, and a chassis housing connected in sequence with heat conduction. A temperature control device is provided on the outer wall of the chassis housing. The temperature control device includes a temperature control device housing that is heat conduction connected to the chassis housing. A metal block I and a heat insulation block are provided on the inner wall of the temperature control device housing. The metal block I is heat conduction connected to the temperature control device housing, and the heat insulation block is heat insulation connected to the temperature control device housing. A piezoelectric ceramic I or pressure sensor I, a piezoelectric ceramic II or pressure sensor II, and a temperature control module are provided inside the temperature control device housing.

[0018] Furthermore, the upper part of the inner cavity of the chassis housing is an insertion cavity and the lower part is an air cavity. A cold plate structure is inserted into the insertion cavity. There is a perforated partition between the insertion cavity and the air cavity. The air cavity is connected to the environmental control air inlet, and the insertion cavity is connected to the environmental control air outlet.

[0019] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the purpose, features and advantages of this utility model more obvious and easy to understand, the following are preferred embodiments, and detailed descriptions are provided in conjunction with the accompanying drawings. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of an environmentally controlled air-cooled chassis in the prior art;

[0021] Figure 2 This is a schematic diagram of the overall assembly of the cold plate structure in an embodiment of an air-cooled chassis with temperature control function according to this utility model;

[0022] Figure 3 for Figure 2 A schematic diagram of the decomposition process;

[0023] Figure 4 for Figure 2 A partial sectional view;

[0024] Figure 5 for Figure 3 Schematic diagram of the PCB board assembly;

[0025] Figure 6 for Figure 3 A three-dimensional schematic diagram of the intercooler plate cover I;

[0026] Figure 7 for Figure 4 A partially enlarged schematic diagram of the metal block and piezoelectric ceramics in the middle;

[0027] Figure 8 This is a schematic diagram of the principle of the temperature control module in an embodiment of an air-cooled chassis with temperature control function according to this utility model;

[0028] Figure 9 This is a topology diagram of the temperature control module in an embodiment of an air-cooled chassis with temperature control function according to this utility model;

[0029] Figure 10 This is a schematic diagram of another arrangement of the metal block and piezoelectric ceramic in an embodiment of an air-cooled chassis with temperature control function according to this utility model;

[0030] Figure 11 This is a schematic diagram of the heat transfer structure in an embodiment of an air-cooled chassis with temperature control function according to this utility model;

[0031] Figure 12 for Figure 11 A schematic diagram of the structure shown when it vibrates;

[0032] Figure 13 This is a cross-sectional view of the temperature control device in another embodiment of the environmentally controlled air-cooled chassis with temperature control function according to this utility model.

[0033] Figure label:

[0034] 1-Front panel, 101-Environmental control air inlet, 2-Top panel, 201-Environmental control air outlet, 3-Rear panel, 4-Air cavity, 5-Chassis connector, 6-Back panel assembly, 7-Cold plate structure, 8-PCB board, 9-Module connector, 10-Functional chip, 11-Cold plate cover I, 111-Heat dissipation fins, 12-Cold plate cover II, 13-Handle, 14-Screw, 151-Piezoelectric ceramic I, 152-Piezoelectric ceramic II, 16-Heat dissipation boss, 171-Metal block I, 172-Metal block II, 18-Thermal conductive pad, 19-Temperature control device housing, 20-Temperature control PCB board, 21-Temperature control module. Detailed Implementation

[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0036] An embodiment of the present invention provides an air-cooled chassis with temperature control function, comprising a chassis shell, and a cold plate structure 7 disposed within the chassis shell, the cold plate structure 7 being as follows: Figures 2 to 7 As shown.

[0037] The cold plate structure 7 includes a cold plate cover I 11 and a cold plate cover II 12 that are mated together. The cold plate cover I 11 and the cold plate cover II 12 form a cold plate shell. In this embodiment, the cold plate cover I 11 and the cold plate cover II 12 are fixed together by screws 14.

[0038] A PCB board 8 is disposed in the cavity formed between cold plate cover I 11 and cold plate cover II 12. A module connector 9 is disposed at the rear end of the PCB board 8. The module connector 9 extends out of the cold plate housing and is used to mate with the backplane connector on the backplane assembly 6 inside the chassis housing. In this embodiment, the module connector 9 is an LRM connector or a VPX connector.

[0039] A handle 13 is provided at the front end of the cold plate housing to assist in inserting or removing the cold plate structure 7 into the chassis.

[0040] Multiple heat dissipation teeth 111 are distributed on the outer side wall of the cold plate cover I 11 to increase the heat dissipation area.

[0041] Multiple functional chips 10 are distributed on the side of the PCB board 8 facing the cold plate cover I 11. As devices that require heat dissipation, the functional chips 10 will generate heat during the operation of the cold plate structure.

[0042] The PCB board assembly consists of 8, module connector 9, and functional chip 10.

[0043] A thermally conductive pad 18 is bonded to the functional chip 10. Heat dissipation protrusions 16, corresponding to the positions of the functional chip 10, are distributed on the sidewalls of the cold plate cover I 11. The thermally conductive pad 18 is tightly attached to the heat dissipation protrusions 16. The heat generated by the functional chip 10 is transferred to the cold plate cover I 11 through the thermally conductive pad 18 and the heat dissipation protrusions 16, achieving a thermally conductive connection between the functional chip 10 and the cold plate structure housing. In this embodiment, the heat dissipation protrusions 16 and the cold plate cover I 11 are integrally formed.

[0044] The inner wall of the cold plate cover I 11 is provided with metal blocks I 171 and II 172. The distance between metal blocks I 171 and II 172 is small, such as... Figure 10 As shown. A heat insulation plate is placed between metal block II 172 and cold plate cover I 11 to prevent heat from cold plate cover I 11 from being transferred to metal block II 172. Piezoelectric ceramics I 151 and piezoelectric ceramics II 152 are placed on the PCB board, corresponding to the positions of metal block I 171 and metal block II 172. Metal block I 171 is in contact with piezoelectric ceramic I 151, and metal block II 172 is in contact with piezoelectric ceramic II 152.

[0045] In this embodiment, in order to reduce the volume of metal block I 171 and metal block II 172, metal block I 171 and metal block II 172 are disposed on one of the heat dissipation protrusions 16, such as... Figure 4 , Figure 7 As shown.

[0046] Heat from the cold plate cover I 11 is conducted to the metal block I 171. After the metal block I 171 is heated and expands, it can compress the corresponding piezoelectric ceramic I, causing the piezoelectric ceramic I to generate an electrical signal.

[0047] The heat generated by the functional chip 10 passes sequentially through the thermally conductive pad 18, the heat dissipation boss 16, the cold plate cover I 11, the metal block I 171, and the piezoelectric ceramic I 151, forming a heat transfer structure.

[0048] A temperature control module is installed on PCB board 8. The temperature control module includes a storage module, control logic circuit, power supply, and amplification circuit, such as... Figure 9 As shown, the piezoelectric ceramic and the temperature control module are electrically connected via a PCB board, enabling the transmission of electrical signals generated by the piezoelectric ceramic to the temperature control module.

[0049] The power supply provides appropriate voltage (current) to components such as amplifier circuits, memory modules, and control logic circuits.

[0050] The amplifier circuit amplifies the input piezoelectric ceramic electrical signal appropriately and provides a cutoff upper limit to prevent excessive voltage (current) from damaging the environmental control system components.

[0051] The storage module mainly stores the corresponding relationships and calculation rules of parameters such as the power of the functional chip, the expansion of the metal block, the voltage (current) of the piezoelectric ceramic, and the temperature.

[0052] The control logic circuit mainly controls the amplification factor of the amplifier circuit and outputs a signal to control the control loop voltage, as well as the priority of multiple piezoelectric ceramics working simultaneously, based on the data from the storage module.

[0053] The electrical signal generated by the piezoelectric ceramics (including piezoelectric ceramic I and piezoelectric ceramic II) is input to the temperature control module. After processing by the temperature control module, a suitable environmental control voltage is output. This environmental control voltage is transmitted to the environmental control system via PCB board 8, module connector 9, backplane connector, backplane assembly 6, chassis connector 5, and cables. This system controls the airflow distribution to the air-cooled chassis, causing the airflow to fluctuate according to the power of the functional chip 10. This achieves real-time adjustment of the airflow distribution within the environmental control system, thereby regulating the temperature of the functional chip 10. Figure 8 As shown.

[0054] Let the heat dissipation of the functional chip 10 on PCB board 8 be W, then the corresponding temperature of the cold plate housing is t. The relationship between t and W can be expressed as follows:

[0055] t = f(W) (0.1)

[0056] When the temperature of the cold plate shell is t, the expansion amount Δx of the metal block I (the expansion amount, deformation amount, or displacement amount mentioned in this utility model refers to the expansion amount, deformation amount, or displacement amount generated by the interaction between the metal block and the piezoelectric ceramic in the direction of interaction) can be expressed as:

[0057] Δx=f(t)(0.2)

[0058] When the expansion of the piezoelectric ceramic I into the metal block I is Δx, the change in voltage (current) ΔV can be expressed as:

[0059] ΔV=f(Δx) (0.3)

[0060] When the voltage (current) changes by ΔV, the control voltage V of the environmental control system after adjustment by the temperature control module is:

[0061] V=f(ΔV) (0.4)

[0062] The expressions for the control voltage V and the control flow rate Q of the environmental control system are as follows:

[0063] Q = f(V)(0.5)

[0064] By combining equations 1.1 to 1.5, the relationship between the heat dissipation of functional chip 10 and the flow rate of the environmental control system can be obtained.

[0065] When the bracket assembly system is used under vibration conditions, the structure and components inside the cold plate structure 7 will deform. The deformation caused by vibration and temperature may cause the electrical signal generated by the piezoelectric ceramic to be distorted.

[0066] Ideally, the electrical signal output by the piezoelectric ceramic I is positively correlated with temperature; that is, the higher the temperature, the greater the expansion of the metal block I, and the greater the electrical signal (voltage or current) generated by the piezoelectric ceramic I. For example... Figure 11 , Figure 12As shown, under vibration conditions, the expansion of metal block I 171 due to temperature is Δx1, and the deformation (i.e., displacement) of PCB board 8 at the corresponding positions of metal blocks I and II, and piezoelectric ceramics I 151 and II 152 on PCB board 8 due to vibration is Δx2. When the deformation directions of Δx1 and Δx2 are the same and Δx2 > Δx1, piezoelectric ceramic I 151 loosens from contact with metal block I 171, and the pressure on piezoelectric ceramic I 151 decreases or even disappears; when the deformation directions of Δx1 and Δx2 are the same and Δx2 < Δx1, although piezoelectric ceramic I 151 does not detach from contact, the deformation of Δx2 will offset part of the deformation of Δx1, resulting in a decrease in the pressure on piezoelectric ceramic I 151; when the deformation directions of Δx1 and Δx2 are opposite, the contact pressure between piezoelectric ceramic I 151 and metal block I 171 increases, and the pressure on piezoelectric ceramic I 151 increases. All of the above situations can lead to inaccurate electrical signals generated by the piezoelectric ceramic I 151 (the electrical signal may be larger or smaller under different vibration conditions under the same temperature conditions).

[0067] In this embodiment, two piezoelectric ceramics and two metal blocks are provided. Metal block I 171 is in thermally conductive contact with cold plate cover I11, and the heat from cold plate cover I11 can be transferred to metal block I 171. Metal block I 171 can automatically deform and expand with temperature changes, and the output electrical signal of piezoelectric ceramic I 151 can change with temperature. A heat insulation plate is provided between metal block II 172 and cold plate cover I11 to achieve heat insulation connection, prevent heat from being transferred to metal block II 172, and thus prevent metal block II 172 from expanding and deforming due to temperature changes.

[0068] The initial contact deformation Δx0 is maintained between metal block I 171 and piezoelectric ceramic I 151, and between metal block II 172 and piezoelectric ceramic II 152, under static and initial temperature conditions. This deformation causes the corresponding piezoelectric ceramic to generate a voltage V0. When the cold plate structure starts working, the functional chip 10 begins to heat up. The deformation of metal block I 171 is Δx1. Metal block II 172 is thermally insulated from the cold plate cover I 11 and will not deform due to temperature; its deformation remains Δx0. The actual deformation of metal block I 171 due to temperature is Δx1 - Δx0. The voltage generated by the piezoelectric ceramic when deformation is Δx0 is V0, and the voltage generated by the piezoelectric ceramic when deformation is Δx1 is V1. The amount of deformation corresponds to the voltage generated by the piezoelectric ceramic. This correspondence can be pre-stored in the storage module. The temperature control module receives the voltages generated by the two piezoelectric ceramics and calculates the difference. This difference is the voltage value corresponding to the amount of deformation caused by temperature. Then, the calculated voltage is converted into the voltage required by the environmental control system and the flow rate of the corresponding air-cooled chassis is adjusted to dissipate heat from the chassis and cold plate structure.

[0069] When the cold plate structure vibrates under the aforementioned temperature conditions (i.e., when metal block I 171 expands by Δx1), and the positions of metal block I 171 and metal block II 172 are close, the vibration deformation of the piezoelectric ceramics on the PCB board at corresponding positions is consistent or has a very small difference, which can both be set to Δx2. At this time, the total deformation of metal block I 171 and piezoelectric ceramic I 151 is Δx1 ± Δx2 (the sum of the deformation caused by temperature and the deformation caused by vibration), and the voltage generated by piezoelectric ceramic I 151 is V3. The total deformation of metal block II 172 and piezoelectric ceramic II 152 is Δx0 ± Δx2 (the deformation caused by vibration), and the voltage generated by piezoelectric ceramic II 152 is V4. Since the difference in deformation between metal block I 171 and metal block II 172 is (Δx1±Δx2)-(Δx0±Δx2)=Δx1-Δx0 (removing the deformation caused by vibration), the temperature control module 15 receives the voltage generated by the two piezoelectric ceramics and calculates the difference. The difference between voltage V3 and voltage V4 remains unchanged compared with the difference when there is no vibration. This ensures that the environmental control voltage output by the temperature control module remains unchanged and is not affected by vibration. It can improve the erroneous signal output caused by structural deformation factors. Then, the voltage is converted into the voltage required by the environmental control system and the flow rate of the corresponding air-cooled chassis is adjusted to dissipate heat from the chassis and cold plate structure, thereby realizing the dynamic compensation function.

[0070] When the cold plate structure is in operation, the heat from the functional chip 10 is transferred to the cold plate cover I 11 through the thermally conductive pad 18. The metal block I 171 deforms due to the increased temperature. This deformation acts on the piezoelectric ceramic I 151, and the piezoelectric effect of I 151 generates an electrical signal (voltage or current). This signal is processed and amplified by the temperature control module to form a suitable environmental control voltage. This voltage is transmitted to the environmental control system through the PCB board 8, module connector 9, backplane connector, backplane assembly, chassis connector, and cables. The environmental control system controls the flow rate of cooling air distributed in the air-cooled chassis, further altering the temperature of the chassis and cold plate structure to dissipate heat from the functional chip 10. The temperature control module corrects the electrical signal emitted by the piezoelectric ceramic I 151 under vibration conditions by receiving the electrical signal generated by the piezoelectric ceramic II 152, preventing vibration from affecting the accuracy of the electrical signal.

[0071] Multiple cold plate structures 7 can be installed inside the chassis. A heat dissipation control module is set on the back plate assembly 6. The heat dissipation control module receives the electrical signals output by the temperature control modules in the multiple cold plate structures 7 and selects the largest electrical signal (corresponding to the highest temperature) to send to the environmental control system. The environmental control system allocates flow to the air-cooled chassis according to the largest electrical signal to ensure that the flow can meet the cooling requirements.

[0072] The environmental control system provides cooling air to multiple air-cooled chassis, and is connected to each chassis via corresponding piping. Each air-cooled chassis includes a chassis shell, which comprises a front panel 1, a top panel 2, a rear panel 3, a bottom panel, and left and right side panels, all forming the chassis shell. The internal cavity of the chassis shell is divided into upper and lower parts. The upper cavity houses the cold plate structure 7, and the lower cavity is the air chamber 4. A partition with holes connects the cold plate structure 7 and the air chamber 4. The front panel 1 has an environmental control air inlet 101, which connects to the air chamber 4. The top panel 2 has an environmental control air outlet 201. Air ducts are formed between the inner wall of the chassis shell and the cold plate structure 7, as well as between adjacent cold plate structures 7. The two ends of the air ducts connect to the air chamber 4 and the environmental control air outlet 201, respectively. Cooling air enters the air chamber 4 from the air control inlet 101, then enters the air duct in the insert cavity from the air chamber 4, carrying away the heat emitted by the cold plate structure 7, and is sent out from the air control outlet 201.

[0073] The pipeline connecting the environmental control system and the air-cooled chassis is connected to the environmental control air inlet 101. A valve is installed on the pipeline between the environmental control system and the air-cooled chassis. The environmental control system controls the opening and closing degree of the valve according to the received environmental control voltage, and adjusts the cooling air supply speed as needed, thereby realizing the adjustment of the cooling air flow rate supplied to the air-cooled chassis according to the temperature of the functional chip 10.

[0074] After the functional chip 10 generates heat, the heat passes through the heat dissipation path structure consisting of the functional chip 10, the thermal pad 18, the heat dissipation boss 16, and the cold plate shell. In order to increase the heat dissipation area, the cold plate shell can also be thermally connected to the chassis shell, and the cooling air can dissipate heat to the chassis shell at the same time, thus extending the heat dissipation path structure to the chassis shell.

[0075] A backplate assembly 6 is located at the rear end of the chassis housing insertion cavity. The backplate assembly 6 has a backplate connector. A module connector 9 on the cold plate structure 7 engages with the backplate connector, achieving electrical connection between the cold plate structure 7 and the backplate assembly 6. A chassis connector 5 is located on the rear panel 3, enabling electrical connection between the inside and outside of the chassis. In this embodiment, an S6 connector is used. Electrical connection between the backplate assembly 6 and the chassis connector 5 can be achieved via a cable or a rigid-flex printed circuit board. The chassis connector 5 is electrically connected to the environmental control system via a cable. Connectors can be installed at both ends of the cable, engaging with the chassis connector and the connector on the flow regulation device in the environmental control system, respectively.

[0076] This invention proposes an environmentally controlled air-cooled chassis with temperature control function. The air-cooled chassis can automatically adjust the cooling air flow allocated to the air-cooled chassis by the environmental control system according to the temperature of the functional chip 10. It no longer relies on traditional temperature sensors, solves the installation and layout problems of temperature sensors, improves the reliability and miniaturization design of the system, can effectively control the temperature rise of the cold plate structure (board), effectively improve the reliability of heat dissipation of electronic equipment, and reduce the workload of equipment debugging.

[0077] In other embodiments, improvements are made based on the above embodiments, such as... Figure 13 As shown, in this embodiment, the cold plate structure 7 may not contain metal blocks, piezoelectric ceramics, or a temperature control module; instead, a temperature control device is installed on the outer wall of the chassis. In this embodiment, the cold plate shell and the chassis are thermally connected. The temperature control device includes a temperature control device housing 19, which is fitted to the chassis 4 for thermal connection. To ensure accurate temperature measurement, the temperature control device is positioned on the chassis away from the air cavity 4. Metal blocks I171 and II172 are arranged close together on the inner wall of the temperature control device housing 19. Figure 13 (Cross-sectional view not shown), metal block I 171 is thermally connected to the temperature control device housing 19, and a heat insulation plate is provided between metal block II 172 and the temperature control device housing 19 to achieve thermal insulation connection. A temperature control PCB board 20 is installed inside the temperature control device housing 19. The temperature control PCB board 20 is equipped with a temperature control module 21 and piezoelectric ceramic I 151 in contact with metal block I 171 and piezoelectric ceramic II 152 in contact with metal block II 172. Figure 13 (Cross-sectional view not shown). The heat from the functional chip 10 within the cold plate structure 7 is sequentially transferred to the temperature control device housing 19 via the thermally conductive pad 18, the heat dissipation boss 16, the cold plate housing, and the chassis housing 4, causing the metal block I171 to expand and deform. The electrical signal emitted by the piezoelectric ceramic I151 is processed by the temperature control module 21 and transmitted to the environmental control system. In this embodiment, the temperature control device can be directly connected to the flow regulation device of the environmental control system via a cable. In this embodiment, since the temperature control device needs to obtain the heat from the functional chip 10, the heat dissipation path structure needs to be extended to the chassis housing, that is, the functional chip 10, the thermally conductive pad 18, the heat dissipation boss 16, the cold plate housing, the chassis housing, and the temperature control device housing form a heat dissipation path structure. The temperature control device of this embodiment can improve the existing system. By directly placing the temperature control device on the outer wall of the chassis and electrically connecting it to the environmental control system, the control of the cooling airflow can be achieved, facilitating the modification of the existing system.

[0078] In other embodiments, the outer side wall of the cold plate cover II 12 is provided with heat dissipation teeth, or the outer side walls of both the cold plate cover I11 and the cold plate cover II 12 are provided with heat dissipation teeth 111.

[0079] In other embodiments, to accurately measure the temperature of each functional chip 10, metal blocks I 171 and II 172 (close to the corresponding functional chip 10) can be provided on each heat dissipation protrusion 16, with a piezoelectric ceramic corresponding to each metal block. The heat emitted by the functional chip 10 is absorbed by the nearest metal block, causing the metal block to expand and generate an electrical signal in the corresponding piezoelectric ceramic. Due to the short heat transfer path, the metal block can deform precisely according to the heat generated by the functional chip 10, allowing the piezoelectric ceramic to accurately generate an electrical signal based on the heat generated by the functional chip 10. The electrical signals generated by the piezoelectric ceramics on the same PCB board are transmitted to the temperature control module on the same PCB board. The temperature control module selects the highest value for processing and sends it to the environmental control system.

[0080] In other embodiments, the cold plate structure is provided with two or more sets of metal blocks (including metal block I 171 and metal block II 172) and piezoelectric ceramics (including piezoelectric ceramic I 151 and piezoelectric ceramic II 152), not limited to the number and position of the functional chip 10, for monitoring the temperature at multiple locations in the cold plate structure. The temperature control module on the PCB board 8 outputs an electrical signal corresponding to the maximum deformation (i.e., the highest temperature) to be transmitted to the environmental control system.

[0081] In other embodiments, metal block II 172 may be replaced with other forms of insulating blocks, such as plastic blocks, to insulate the cold plate structural shell.

[0082] In other embodiments, the piezoelectric ceramic can be replaced with a pressure sensor, with metal block I 171 contacting pressure sensor I and metal block II 172 contacting pressure sensor II.

[0083] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A temperature-controlled air-cooled chassis, comprising a chassis shell, a cold plate structure (7) inserted inside the chassis shell, an air duct formed between adjacent cold plate structures (7) and between the inner wall of the chassis shell and the cold plate structure, the two ends of the air duct being connected to an air control inlet (101) and an air control outlet (201), the air control inlet (101) being connected to an air control system via a pipeline; the cold plate structure (7) comprising a cold plate shell and a PCB board (8) disposed within the cold plate shell, characterized in that: The PCB board (8) is provided with a functional chip (10). A metal block I (171) is provided on the heat dissipation path structure of the functional chip (10). The metal block I (171) is thermally connected to the heat dissipation path structure. The metal block I (171) is in contact with the piezoelectric ceramic I (151) or the pressure sensor I. The piezoelectric ceramic I (151) or the pressure sensor I is electrically connected to the temperature control module. The temperature control module is electrically connected to the environmental control system.

2. The air-cooled computer case with temperature control function according to claim 1, characterized in that: The heat dissipation path structure is also provided with an insulation block, which is thermally connected to the heat dissipation path structure. The insulation block is in contact with the piezoelectric ceramic II (152) or the pressure sensor II. The piezoelectric ceramic II (152) or the pressure sensor II is electrically connected to the temperature control module. The metal block I (171) and the insulation block are arranged in a group. The distance between the metal block I (171) and the insulation block in the same group on the heat dissipation path structure is close so that the metal block I (171), the insulation block and the corresponding piezoelectric ceramic or pressure sensor will have equal or similar deformation under vibration conditions.

3. The air-cooled computer case with temperature control function according to claim 2, characterized in that: The temperature control module includes a memory, a control logic circuit, an amplifier circuit for amplifying the input signal, and a power supply.

4. The air-cooled computer case with temperature control function according to claim 2 or 3, characterized in that: The heat dissipation path structure includes a functional chip (10) and a cold plate shell connected in sequence. The inner wall of the cold plate shell is provided with a metal block I (171) and an insulation block. A piezoelectric ceramic I (151) or pressure sensor I, a piezoelectric ceramic II (152) or pressure sensor II, and a temperature control module are integrated on the PCB board.

5. The air-cooled computer case with temperature control function according to claim 4, characterized in that: The inner wall of the cold plate housing is provided with a heat dissipation protrusion (16), and the functional chip (10) is thermally connected to the heat dissipation protrusion (16) through a thermally conductive pad (18).

6. The air-cooled computer case with temperature control function according to claim 5, characterized in that: The metal block I (171) and the heat insulation block are disposed on the heat dissipation boss (16).

7. The air-cooled computer case with temperature control function according to claim 4, characterized in that: The PCB board (8) is provided with a module connector (9), the module connector (9) extends out of the cold plate housing, the chassis housing is provided with a back plate assembly (6), the back plate assembly (6) is provided with a back plate connector that is inserted into the module connector (9), the chassis housing is provided with a chassis connector (5) that is electrically connected to the back plate assembly (6), and the chassis connector (5) is electrically connected to the environmental control system through a cable.

8. The air-cooled computer case with temperature control function according to claim 4, characterized in that: The outer wall of the cold plate shell is provided with heat dissipation teeth (111).

9. A temperature-controlled air-cooled chassis with temperature control function according to claim 2 or 3, characterized in that: The heat dissipation path structure includes a functional chip (10), a cold plate shell, and a chassis shell connected in sequence. A temperature control device is provided on the outer wall of the chassis shell. The temperature control device includes a temperature control device shell (19) that is thermally connected to the chassis shell. A metal block I (171) and an insulation block are provided on the inner wall of the temperature control device shell (19). The metal block I (171) is thermally connected to the temperature control device shell (19), and the insulation block is thermally insulated from the temperature control device shell (19). A piezoelectric ceramic I (151) or pressure sensor I, a piezoelectric ceramic II (152) or pressure sensor II, and a temperature control module (21) are provided inside the temperature control device shell (19).

10. The air-cooled computer case with temperature control function according to claim 2 or 3, characterized in that: The upper part of the inner cavity of the chassis shell is a insertion cavity and the lower part is a wind cavity (4). A cold plate structure (7) is inserted in the insertion cavity. There is a perforated partition between the insertion cavity and the wind cavity. The wind cavity (4) is connected to the environmental control air inlet (101) and the insertion cavity is connected to the environmental control air outlet (201).

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