一种抗干扰高可靠工业工控主板
By combining a support frame, heat sink, and miniature cooling fan, along with a support frame and anti-interference mesh, the problem of poor heat dissipation of the industrial control motherboard is solved, achieving efficient heat dissipation and electromagnetic shielding, and improving the reliability and maintenance convenience of the equipment.
CN224519262UActive Publication Date: 2026-07-17SHENZHEN HUIWAN TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HUIWAN TECH CO LTD
- Filing Date
- 2025-07-10
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
The heat dissipation function of existing industrial control motherboards is inadequate, which leads to unstable operation of components during long-term operation.
Method used
It adopts a combination design of support base, heat sink and miniature cooling fan, combined with support frame and anti-interference mesh to achieve effective heat dissipation and electromagnetic shielding, and the disassembly structure facilitates maintenance.
Benefits of technology
It improves the motherboard's heat dissipation, prevents electromagnetic interference, and enhances the reliability and maintenance efficiency of the equipment.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224519262U_ABST
Abstract
本实用新型公开了一种抗干扰高可靠工业工控主板，涉及主板技术领域。该一种抗干扰高可靠工业工控主板，包括：主板；支撑底架，固定设置于主板底端，所述支撑底架截面为U型；若干散热片，固定设置于支撑底架内部底面，所述散热片顶端与主板底端相贴合；若干微型散热风扇固定设置于支撑底架内部底面，所述微型散热风扇位于支撑底架内部边缘位置处。该一种抗干扰高可靠工业工控主板，通过支撑底架、散热片和微型散热风扇的设置，使得散热片能够将主板的热量进行传导吸收，再通过微型散热风扇将空气送入到支撑底架内部，使得流动的空气将散热片表面的热量带走，实现对主板的散热作用。
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