一种便于安装的芯片散热结构
The innovative design of the heat-absorbing base and mounting mechanism solves the problem of inconvenient disassembly and assembly of traditional chip heat dissipation structures, enabling rapid installation and disassembly, reducing maintenance difficulty and equipment downtime.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU JINGHONG PRECISION TECH CO LTD
- Filing Date
- 2025-09-09
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional chip heat dissipation structures are inconvenient to disassemble and assemble, increasing the difficulty of maintenance and extending equipment downtime, thus affecting the normal use of computers.
It adopts a heat-absorbing base, mounting mechanism and heat dissipation mechanism, and uses a combination of mounting bolts and buffer springs to achieve quick fixation and separation of the heat dissipation structure from the computer case, avoiding the need for soldering.
It enables rapid installation and disassembly of the heat dissipation structure, reduces maintenance difficulty, shortens equipment maintenance time, and reduces labor costs.
Smart Images
Figure CN224519268U_ABST
Abstract
Claims
1. A chip heat dissipation structure which is easy to install, characterized by comprising: It includes a heat-absorbing base, a mounting mechanism, and a heat-dissipating mechanism, wherein the mounting mechanism and the heat-dissipating mechanism are both disposed on the heat-absorbing base, and the mounting mechanism is disposed on one side of the heat-dissipating mechanism; The installation mechanism includes a mounting frame, a first mounting bolt, a second mounting bolt, and a buffer spring. The first mounting bolt is threadedly connected to the mounting frame and the heat-absorbing base in sequence. One end of the mounting frame is provided with a mounting groove. The second mounting bolt is disposed in the mounting groove and movably passes through the mounting frame. The buffer spring is movably sleeved on the second mounting bolt and abuts against the mounting frame and the second mounting bolt respectively.
2. The chip heat dissipation structure for easy installation according to claim 1, characterized in that, The mounting bracket is U-shaped, and there are two first mounting bolts arranged in parallel; both first mounting bolts are sequentially threaded to the mounting bracket and the heat-absorbing base.
3. The chip heat dissipation structure of claim 1, wherein, The installation mechanism is provided in two parts, arranged in parallel and symmetrically.
4. The chip heat dissipation structure of claim 1, wherein, The heat dissipation mechanism includes a heat dissipation pipe, heat dissipation fins, and a support rod. One end of the heat dissipation pipe is fixedly installed on the heat absorption base, and the other end is fixedly inserted through the heat dissipation fins. The support rod is fixedly inserted through the heat dissipation fins.
5. The chip heat dissipation structure of claim 4, wherein, The heat dissipation pipes are U-shaped and there are multiple of them. The multiple heat dissipation pipes are evenly fixedly installed on the heat absorption base.
6. The chip heat dissipation structure of claim 4, wherein, The heat dissipation fins are provided in multiples and are evenly fixedly installed on the heat dissipation pipe and support rod; the heat dissipation fins are spaced apart, and the distance between adjacent heat dissipation fins is 1-5mm.
7. The chip heat dissipation structure of claim 4, wherein, The heat dissipation fins are provided with heat dissipation holes, and there are multiple heat dissipation holes.
8. The chip heat dissipation structure of claim 4, wherein, Two support rods are provided, and both are fixedly inserted into the heat dissipation fins.
9. The chip heat dissipation structure of claim 4, wherein, The heat-absorbing base is provided with limiting grooves, and there are multiple limiting grooves evenly distributed on the heat-absorbing base. The heat dissipation pipe is fixedly installed in the limiting grooves.