A heat dissipation device for a cloud computing host

Abstract

This utility model belongs to the field of cloud computing server maintenance technology, and specifically relates to a heat dissipation device for a cloud computing server. It includes a server housing, with symmetrical supports fixed to the top surface of the housing. The longitudinal section of each support is inverted "U"-shaped, and multiple cooling fans are fixedly installed at equal intervals along the horizontal direction at its top. A heat spreader is fixedly connected to the inner top surface of the server housing, and several heat dissipation fins are embedded at equal intervals along the length of the top surface of the server housing. A water tank is fixedly installed at the middle of the rear outer wall of the server housing, with a water inlet at the top and a rubber sealing plug inside the inlet. This utility model employs a combination of air cooling and liquid cooling. The air cooling also helps to lower the temperature of the liquid cooling system. This multiple cooling method results in more efficient heat dissipation, ensuring the stable operation of the cloud computing server.

Description

Technical Field

[0001] This utility model belongs to the field of cloud computing host maintenance technology, and in particular relates to a heat dissipation device for cloud computing hosts. Background Technology

[0002] With the rapid development of cloud computing technology, the computing power requirements of cloud computing hosts are constantly increasing. The integration and power consumption of their core computing components such as CPUs and GPUs are continuously increasing, generating a large amount of heat during operation. If this heat cannot be dissipated in time, the internal temperature of the host will rise sharply, which will not only reduce the operating efficiency of the computing components, but may also cause equipment downtime, shortened lifespan, and other problems, seriously affecting the stability and reliability of cloud computing services. Therefore, an efficient heat dissipation solution has become one of the core guarantees for the stable operation of cloud computing hosts.

[0003] Currently, the most common heat dissipation method for cloud computing servers is air cooling, which uses cooling fans and heat sinks to exchange heat. While this method is simple in structure and low in cost, it suffers from limited heat dissipation efficiency. When the server is under high load, low heat dissipation efficiency can easily lead to localized heat buildup. Furthermore, the heat dissipation path is singular, and its effectiveness needs improvement. Therefore, there is an urgent need to improve the existing heat dissipation devices for cloud computing servers and provide a new type of heat dissipation device. Utility Model Content

[0004] The purpose of this utility model is to address the shortcomings of existing technologies by providing a cooling device for cloud computing hosts that is reasonably designed, simple in structure, has more heat dissipation paths, better heat dissipation effect, and faster speed, thereby solving the problems existing in the prior art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A heat dissipation device for a cloud computing server, comprising:

[0007] The main unit housing has a bracket fixed symmetrically on its top surface. The bracket has an inverted "U" shaped longitudinal section and multiple cooling fans are fixedly installed at equal intervals along the horizontal direction at its top.

[0008] A heat spreader plate is fixedly connected to the inner top surface of the main unit housing. Several heat dissipation fins are inlaid and fixed at equal intervals along the length direction inside the top of the main unit housing.

[0009] A water tank is fixedly installed in the middle of the outer wall of the rear end of the main unit housing. The top of the water tank has a water inlet with a rubber sealing plug inside. A miniature water pump is fixedly installed on the top side wall of one end of the water tank, and a controller is fixedly installed on the top of the other end of the water tank.

[0010] In a preferred embodiment, one side of the heat spreader is attached to the surface of the CPU and GPU core heat-generating components of the cloud computing host, and the other side of the heat spreader is fixedly connected to a plurality of heat dissipation fins. The side of the heat spreader that is attached to the heat-generating components of the cloud computing host is uniformly coated with a thermally conductive silicone grease layer.

[0011] In a preferred embodiment, a heat-conducting mechanism is also included. The heat-conducting mechanism includes an isolation plate, a first isolation frame, a second isolation frame, and partitions. A plurality of the isolation plates are arranged at intervals with a plurality of heat dissipation fins and are fixedly connected to each other. A second isolation frame is fixed in front of the heat dissipation fins, and a first isolation frame is fixed behind the heat dissipation fins. A plurality of partitions are fixedly fixed on the inner sides of the first isolation frame and the second isolation frame in a staggered manner. The partitions are fixedly connected to the corresponding heat dissipation fins.

[0012] In a preferred embodiment, a closed flow cavity is formed between the main unit housing, heat dissipation fins, isolation plate, first isolation frame, second isolation frame and partition, and the flow cavity is distributed in an "S" shaped curve.

[0013] In a preferred embodiment, a return water pipe and a supply water pipe are fixed at both ends of the first isolation frame, and both the return water pipe and the supply water pipe are connected to the flow cavity.

[0014] In a preferred embodiment, both the water supply pipe and the water tank are fixedly connected to the micro water pump via a first connecting pipe, and the return pipe is fixedly connected to the water tank via a second connecting pipe.

[0015] In a preferred embodiment, the heat spreader, heat dissipation fins, isolation plate, first isolation frame, second isolation frame and partition are all made of copper, and the cooling fan, micro water pump and cooling mechanism are all electrically connected to the controller.

[0016] In a preferred embodiment, the cooling mechanism is an existing device, specifically including a micro compressor, an evaporator, a condenser, a capillary tube, and a thermostat. The evaporator is a copper coil fixed to the bottom of the water tank, and the condenser is an aluminum heat sink and a small fan fixedly installed outside the water tank.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0018] In the solution of this utility model:

[0019] The heat generated by the core computing components such as CPU and GPU inside the cloud computing host can be quickly dissipated to the outside through the thermal grease layer, heat spreader, and multiple equidistant heat dissipation fins. Multiple cooling fans located above the heat dissipation fins can be used for air cooling. At the same time, a micro water pump can be turned on to pump the pre-stored coolant in the water tank into the flow chamber. The flow chamber is distributed in an "S" curve, which not only increases the flow path but also facilitates long-term contact between the coolant and each heat dissipation fin, enabling further heat absorption and dissipation, faster heat conduction, and better cooling effect.

[0020] The heat spreader, heat sink fins, isolation plate, first isolation frame, second isolation frame, and partition are all made of copper. The airflow generated by multiple cooling fans can also dissipate heat from the coolant. In addition, the water tank is equipped with an existing small compression cooling mechanism, which facilitates rapid cooling of the recovered coolant and prevents the heat absorbed during circulation from being unable to be quickly dissipated, thus affecting the heat dissipation effect. This device adopts a combination of air cooling and liquid cooling. At the same time, air cooling can also cool the liquid cooling. Multiple cooling methods can bring more efficient heat dissipation and ensure the stable operation of the cloud computing host. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. The drawings are described as follows:

[0022] Figure 1 This is a three-dimensional top view of the structure of this utility model;

[0023] Figure 2 This is a schematic diagram of the three-dimensional rear view structure of this utility model;

[0024] Figure 3 This is a front view schematic diagram of the heat dissipation plate and heat sink fins of this utility model;

[0025] Figure 4 This is a top view of the flow cavity structure of this utility model;

[0026] Figure 5 This is a schematic diagram of the overall structure of the heat conduction mechanism of this utility model from a bottom view.

[0027] In the picture:

[0028] 1. Main unit casing; 2. Bracket; 3. Cooling fan; 4. Heat spreader; 5. Thermal grease layer; 6. Heat dissipation fins; 7. Isolation plate; 8. First isolation frame; 9. Second isolation frame; 10. Return water pipe; 11. Supply water pipe; 12. Partition; 13. Flow chamber; 14. Water tank; 15. Sealing plug; 16. Miniature water pump; 17. First connecting pipe; 18. Second connecting pipe; 19. Cooling mechanism; 20. Controller. Detailed Implementation

[0029] The embodiments described below are merely some embodiments of the present invention and do not represent all embodiments consistent with the present invention. Exemplary embodiments will now be described with reference to the accompanying drawings:

[0030] like Figure 1-5 As shown, the heat dissipation device for the cloud computing host of this utility model includes:

[0031] The main unit housing 1 has a bracket 2 fixed symmetrically on its top surface. The longitudinal section of the bracket 2 is an inverted "U" shape, and multiple cooling fans 3 are fixedly installed at equal intervals along the horizontal direction at its top.

[0032] A heat spreader 4 is fixedly connected to the inner top surface of the main unit housing 1. Several heat dissipation fins 6 are inlaid and fixed at equal intervals along the length direction inside the top of the main unit housing 1.

[0033] Water tank 14 is fixedly installed in the middle of the outer wall of the rear end of the main unit housing 1. A water inlet is provided on the top of the water tank 14, and a rubber sealing plug 15 is provided inside the water inlet. A micro water pump 16 is fixedly installed on the top side wall of one end of the water tank 14, and a controller 20 is fixedly installed on the top of the other end of the water tank 14.

[0034] Based on the above structure, one side of the heat spreader 4 is attached to the surface of the CPU and GPU core heat-generating components of the cloud computing host, and the other side of the heat spreader 4 is fixedly connected to several heat dissipation fins 6. The side of the heat spreader 4 that is attached to the heat-generating components of the cloud computing host is uniformly coated with a thermally conductive silicone grease layer 5.

[0035] In this embodiment, the uniformly coated thermal grease layer 5 facilitates the faster and more complete transfer of heat generated by the core computing components such as the CPU and GPU inside the cloud computing host to the heat spreader 4, thereby facilitating subsequent heat dissipation.

[0036] Based on the above structure, a heat conduction mechanism is also included. The heat conduction mechanism includes an isolation plate 7, a first isolation frame 8, a second isolation frame 9, and a partition plate 12. Several isolation plates 7 and several heat dissipation fins 6 are arranged at intervals and fixedly connected to each other. A second isolation frame 9 is fixed in front of the heat dissipation fins 6, and a first isolation frame 8 is fixed behind the heat dissipation fins 6. Multiple partition plates 12 are fixedly fixed on the inner sides of the first isolation frame 8 and the second isolation frame 9 in a staggered manner. The partition plates 12 are fixedly connected to the corresponding heat dissipation fins 6.

[0037] In this embodiment, a number of heat dissipation fins 6 and multiple cooling fans 3 located above them can achieve a good air cooling effect.

[0038] Based on the above structure, a closed flow cavity 13 is formed between the main housing 1, heat dissipation fins 6, isolation plate 7, first isolation frame 8, second isolation frame 9 and partition plate 12, and the flow cavity 13 is distributed in an "S" shaped curve.

[0039] In this embodiment, the flow cavity 13 is distributed in an "S" shaped curve, which not only increases the flow path, but also facilitates long-term contact between the coolant and each heat dissipation fin 6, enabling further heat absorption and dissipation, and faster heat conduction.

[0040] Based on the above structure, the two ends of the first isolation frame 8 are respectively fixed with a return water pipe 10 and a supply water pipe 11, and both the return water pipe 10 and the supply water pipe 11 are connected to the flow cavity 13.

[0041] In this embodiment, the arrangement of the return water pipe 10 and the supply water pipe 11 facilitates the control of the circulation of coolant in the flow chamber 13.

[0042] Based on the above structure, both the water supply pipe 11 and the water tank 14 are fixedly connected to the micro water pump 16 by a first connecting pipe 17, and the return water pipe 10 is fixedly connected to the water tank 14 by a second connecting pipe 18.

[0043] In this embodiment, the first connecting pipe 17 facilitates the pumping of coolant from the water tank 14 into the flow chamber 13, and the second connecting pipe 18 facilitates the return of coolant to the water tank 14 for easy recycling.

[0044] Based on the above structure, the heat dissipation plate 4, heat dissipation fins 6, isolation plate 7, first isolation frame 8, second isolation frame 9 and partition plate 12 are all made of copper, and the cooling fan 3, micro water pump 16 and cooling mechanism 19 are all electrically connected to the controller 20.

[0045] In this embodiment, a heat dissipation plate 4, heat dissipation fins 6, isolation plate 7, first isolation frame 8, second isolation frame 9 and partition plate 12 made of copper are used to facilitate the rapid dissipation of heat from inside the equipment.

[0046] Based on the above structure, the cooling mechanism 19 is an existing device, which specifically includes a micro compressor, an evaporator, a condenser, a capillary tube and a thermostat. The evaporator is a copper coil and is fixed to the bottom of the water tank 14. The condenser is an aluminum heat sink and a small fan and is fixedly installed on the outside of the water tank 14.

[0047] In this embodiment, the existing small compression cooling mechanism 19 is used to facilitate rapid cooling of the recovered coolant, thus avoiding the inability to quickly dissipate the heat absorbed during the circulation process and affecting the heat dissipation effect.

[0048] The working principle of this utility model is as follows:

[0049] In use, coolant is first added to the water tank 14, and the water inlet at the top of the water tank 14 is sealed with a sealing plug 15. When the cloud computing host generates a lot of heat during operation, the cooling fan 3 and the micro water pump 16 can be turned on at the same time. The heat generated by the core computing components such as the CPU and GPU inside the cloud computing host can be quickly dissipated to the outside through the thermal grease layer 5, the heat spreader 4, and multiple equidistant heat dissipation fins 6. At the same time, multiple cooling fans 3 can provide air cooling to accelerate the heat conduction speed. Meanwhile, the micro water pump 16 can pump the coolant in the water tank 14 into the flow chamber 13. Since the flow chamber 13 is distributed in an "S" curve, it can not only increase the flow path of the coolant, but also facilitate the long-term contact between the coolant and each heat dissipation fin 6. Thus, the coolant can also remove the heat on the heat dissipation fins 6, achieving further heat absorption and dissipation. The overall heat conduction speed is faster and the cooling effect is better.

[0050] The heat spreader 4, heat dissipation fins 6, isolation plate 7, first isolation frame 8, second isolation frame 9 and partition 12 are all made of copper. The air force generated by multiple cooling fans 3 can also act on the isolation plate 7 to dissipate heat from the coolant. In addition, the water tank 14 is equipped with an existing small compression cooling mechanism 19, which facilitates the rapid cooling of the recovered coolant and prevents the heat absorbed by the coolant during circulation from being unable to be quickly dissipated, thus affecting the heat dissipation effect.

[0051] In summary, this device adopts a combination of air cooling and liquid cooling. At the same time, the air cooling can also cool the liquid cooling. Multiple cooling methods can bring more efficient heat dissipation and ensure the stable operation of the cloud computing host.

[0052] It should be noted that this heat dissipation device is powered by an external power source. The cooling fan 3, micro water pump 16, cooling mechanism 19 and controller 20 in this device are all existing electrical components. Their specific structures, circuit layouts and control methods are all mature existing technologies and are widely used in this field, so they will not be described in detail.

[0053] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Any equivalent changes, modifications, substitutions, and variations made by those skilled in the art based on the concept of this utility model and on the basis of existing technology through logical analysis, reasoning, or limited experiments shall be within the scope of protection defined by the claims.

Claims

1. A heat dissipation device for a cloud computing host, characterized in that, include: The host housing (1) has a bracket (2) fixed symmetrically on the top surface of the host housing (1). The longitudinal section of the bracket (2) is an inverted "U" shape, and multiple cooling fans (3) are fixedly installed at equal intervals along the horizontal direction at its top. A heat spreader (4) is fixedly connected to the inner top surface of the main unit housing (1). Several heat dissipation fins (6) are inlaid and fixed at equal intervals along the length direction inside the top of the main unit housing (1). Water tank (14) is fixedly installed in the middle of the rear outer wall of the main body housing (1). The top of the water tank (14) is provided with a water inlet, and a rubber sealing plug (15) is provided in the water inlet. A micro water pump (16) is fixedly installed on the top side wall of one end of the water tank (14), and a controller (20) is fixedly installed on the top of the other end of the water tank (14).

2. The heat dissipation device of a cloud computing host according to claim 1, wherein: One side of the heat spreader (4) is attached to the surface of the CPU and GPU core heat-generating components of the cloud computing host, and the other side of the heat spreader (4) is fixedly connected to several heat dissipation fins (6). The side of the heat spreader (4) attached to the heat-generating components of the cloud computing host is uniformly coated with a thermally conductive silicone grease layer (5).

3. The heat dissipation device of a cloud computing host according to claim 1, characterized in that: It also includes a heat conduction mechanism, which includes an isolation plate (7), a first isolation frame (8), a second isolation frame (9), and a partition plate (12). Several isolation plates (7) and several heat dissipation fins (6) are arranged at intervals and fixedly connected to each other. A second isolation frame (9) is fixed in front of the heat dissipation fins (6), and a first isolation frame (8) is fixed behind the heat dissipation fins (6). Multiple partition plates (12) are fixedly fixed on the inner sides of the first isolation frame (8) and the second isolation frame (9) in a staggered manner. The partition plates (12) are fixedly connected to the corresponding heat dissipation fins (6).

4. The heat dissipation device of a cloud computing host according to claim 3, characterized in that: The main housing (1), heat dissipation fins (6), isolation plate (7), first isolation frame (8), second isolation frame (9) and partition (12) form a closed flow cavity (13), which is distributed in an "S" shaped curve.

5. The heat dissipation device of a cloud computing host according to claim 4, characterized in that: The first isolation frame (8) has a return water pipe (10) and a delivery water pipe (11) fixed at both ends, and the return water pipe (10) and the delivery water pipe (11) are both connected to the flow cavity (13).

6. The heat dissipation device of a cloud computing host according to claim 5, characterized in that: Both the water supply pipe (11) and the water tank (14) are fixedly connected to the micro water pump (16) by a first connecting pipe (17), and the return water pipe (10) is fixedly connected to the water tank (14) by a second connecting pipe (18).

7. A heat dissipation device for a cloud computing host according to claim 6, characterized in that: The heat spreader (4), heat dissipation fins (6), isolation plate (7), first isolation frame (8), second isolation frame (9) and partition (12) are all made of copper. The heat dissipation fan (3), micro water pump (16) and cooling mechanism (19) are all electrically connected to the controller (20).

8. The heat dissipation device of a cloud computing host according to claim 7, characterized in that: The cooling mechanism (19) is an existing device, which specifically includes a micro compressor, an evaporator, a condenser, a capillary tube and a thermostat. The evaporator is a copper coil and is fixed to the bottom of the water tank (14). The condenser is an aluminum heat sink and a small fan and is fixedly installed outside the water tank (14).

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