一种服务器主板上的CPU供电模块散热装甲
By installing a heatsink armor on the CPU power supply module on the server motherboard, and using components such as heat sink fins and heat conduction strips to improve heat dissipation efficiency, the problem of insufficient heat dissipation of the CPU power supply module is solved, ensuring its stable operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN SHIXIN INFORMATION TECH CO LTD
- Filing Date
- 2025-09-17
- Publication Date
- 2026-07-17
AI Technical Summary
The lack of a dedicated CPU power supply module cooling structure on existing server motherboards results in low heat dissipation efficiency, affecting power supply performance and motherboard stability.
Design a CPU power supply module heat dissipation armor, including components such as a fixing plate, heat dissipation fins, a matching plate, and heat conduction strips. It is fixed to the motherboard by clamping, and uses heat dissipation fins to conduct heat, increase contact area and airflow disturbance, and improve heat dissipation efficiency.
It effectively improves the heat dissipation efficiency of the CPU power supply module, ensuring its stable operation at a suitable temperature and preventing performance degradation or motherboard damage.
Smart Images
Figure CN224519270U_ABST
Abstract
Claims
1. A CPU power module heat dissipation armor on a server motherboard, comprising a fixing plate (1), characterized in that: At least four sets of heat dissipation fins (5) are fixedly connected to the side end of the fixed plate (1) for conducting and dissipating the heat generated by the power supply module. A matching plate (2) for matching different server motherboard structures is inserted into the heat dissipation fins (5). A side plate (4) is fixedly connected to the side end of the fixed plate (1) away from the server motherboard. The heat dissipation fins (5) are fixedly connected to the top of the matching plate (2) with an elastic cylinder (9), and the side of the elastic cylinder (9) facing the server motherboard is fixedly connected to a heat-conducting strip (10) to increase the contact area. The middle part of the heat dissipation fins (5) is provided with two positioning slots (7). The matching plate (2) has a U-shaped structure. The side of the matching plate (2) facing the server motherboard has multiple plug-in interfaces for close contact with the power supply module. Positioning pieces (8) are fixedly connected to the inner walls on both sides of the matching plate (2). The positioning pieces (8) and the heat dissipation fins (5) are interlocked to position and connect the matching plate (2) and the heat dissipation fins (5).
2. The CPU power module heat sink armor on a server motherboard of claim 1, wherein: The heat dissipation fins (5) form ventilation channels for airflow and increase the heat dissipation area.
3. The CPU power module heat sink armor on a server motherboard of claim 1, wherein: The heat dissipation fins (5) are fixedly connected to the side perpendicular to the fixing plate (1) with a turbulence protrusion (6). The side of the turbulence protrusion (6) is arc-shaped and is used to turbulent the airflow flowing between the heat dissipation fins (5).
4. The CPU power module heat sink armor on a server motherboard of claim 1, wherein: The elastic cylinder (9) is formed by stamping elastic copper sheets. The side of the elastic cylinder (9) facing the server motherboard has a planar structure, so that each heat conduction strip (10) is in uniform contact with the matching plate (2). The rest of the elastic cylinder (9) has an arc-shaped structure.
5. The CPU power module heat sink armor on a server motherboard of claim 1, wherein: The side end of the heat-conducting strip (10) is an arc-shaped structure, and the gap between the heat-conducting strip (10) and the matching plate (2) is filled with silicone grease to improve the heat conduction performance.
6. The CPU power module heat sink armor on a server motherboard of claim 1, wherein: The middle part of the positioning slot (7) is an arc-shaped structure, and the positioning piece (8) is an arc-shaped structure. When the matching plate (2) and the heat dissipation fins (5) are installed, the positioning piece (8) is snapped into the positioning slot (7) to fix the matching plate (2) and the heat dissipation fins (5) together.
7. The CPU power module heat sink armor on a server motherboard of claim 1, wherein: The side plate (4) and the fixing plate (1) form an L-shaped structure. The side plate (4) is fixedly connected to the clamping plate (3) with an L-shaped structure by screws. The fixing plate (1) and the clamping plate (3) clamp and fix the server motherboard.