一种LIN转换服务器及总线通信系统
By integrating a LIN conversion server, unified deployment of RS232 and LIN bus is achieved, solving the problems of loose system structure and signal interference in existing technologies, improving communication stability and development efficiency, and making it suitable for embedded platforms.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Filing Date
- 2025-06-23
- Publication Date
- 2026-07-17
AI Technical Summary
In the existing technology, the discrete design of RS232 and LIN bus communication interfaces results in a loose system structure, a large PCB area, and serious problems of signal delay and interference coupling, which affect the stability and reliability of communication, and has limitations, especially in miniaturized devices.
An integrated LIN conversion server is adopted, and a dual-level conversion architecture composed of SP3232 and TJA1020 chips is used to realize the unified deployment and functional integration of RS232 and LIN bus. The main control chip is used to manage different communication standards in a unified manner, and TVS devices and pull-up resistors are introduced to suppress electrostatic interference. LEDs are used for status indication.
It enables unified deployment of RS232 and LIN bus interfaces on the same platform, simplifies interface initialization and communication scheduling, reduces software development complexity, improves system stability and development efficiency, is suitable for embedded platforms, and saves PCB space.
Smart Images
Figure CN224519305U_ABST
Abstract
Claims
1. A LIN translation server, characterized by, It includes a main control chip U1, a level conversion module one, and a level conversion module two. The main control chip U1 is connected to the level conversion module one and the level conversion module two respectively. The level conversion module includes a level conversion chip U3. The T1 IN pin of the level conversion chip U3 is connected to the main control chip U1, the T1 OUT pin is connected to the JA1 interface, the R1 IN pin of the level conversion chip U3 is connected to the JA1 interface, and the R1 OUT pin is connected to the main control chip U1. The level conversion module 2 includes a LIN transceiver U2. The RXD and TXD pins of the LIN transceiver U2 are both connected to the main control chip U1. A diode D5 is connected in parallel to the TXD pin. The negative terminal of the diode D5 is connected to the TXD pin of the LIN transceiver U2, and the positive terminal is connected to a resistor R4. The other end of the resistor R4 is connected to the power supply VCC.
2. The LIN translation server of claim 1, wherein, A diode D3 is configured between the T1OUT pin of the level conversion chip U3 and the JA1 interface, and a diode D2 is configured between the R1IN pin and the JA1 interface. The positive terminals of diodes D2 and D3 are grounded.
3. The LIN translation server of claim 1, wherein, A resistor R1 is connected in parallel between the R1OUT pin of the level conversion chip U3 and the main control chip U1, and the other end of the resistor R1 is connected to the power supply VCC.
4. The LIN translation server of claim 1, wherein, A diode D1 is configured between the R1OUT pin of the level conversion chip U3 and the main control chip U1. The positive terminal of the diode D1 is connected to the main control chip U1, and the negative terminal is connected to the R1OUT pin of the level conversion chip U3.
5. The LIN translation server of claim 1, wherein, The VCC pin of the level conversion chip U3 is connected to the power supply VCC. A capacitor C1 is connected between the VCC pin and the V+ pin of the level conversion chip U3. The GND pin of the level conversion chip U3 is grounded. A capacitor C2 is connected between the GND pin and the V- pin of the level conversion chip U3. A capacitor C4 is connected between the C1+ pin and the C1- pin of the level conversion chip U3. A capacitor C3 is connected between the C2+ pin and the C2- pin.
6. The LIN translation server of claim 1, wherein, A diode D6 is connected in parallel to the RXD pin of the LIN transceiver U2. The cathode of the diode D6 is connected to the RXD pin of the LIN transceiver U2, and the anode is connected to the resistor R2. The other end of the resistor R2 is connected to the power supply VCC.
7. The LIN translation server of claim 1, wherein, The NSLP pin of the LIN transceiver U2 is connected to the main control chip U1, and the NWAKE pin of the LIN transceiver U2 is connected to the power supply BAT through resistor R3.
8. The LIN translation server of claim 1, wherein, The BAT pin of the LIN transceiver U2 is connected to the LIN pin through a resistor R5. A diode D4 is connected in parallel on the LIN pin, and the positive terminal of the diode D4 is grounded.
9. A bus communication system based on a LIN conversion server, characterized in that The LIN conversion server includes any one of claims 1 to 8, wherein the LIN conversion server includes one level conversion module 1 and two level conversion modules 2, wherein the level conversion module 1 is connected to the PC via a serial port server, and the level conversion modules 2 are connected to the product.
10. The bus communication system based on a LIN translation server according to claim 9, characterized in that, The LIN conversion server is configured in multiple ways. Each LIN conversion server has a level conversion module 1 connected to a serial port server, and each LIN conversion server has a level conversion module 2 connected to the product.