一种提高焊接元器件阻抗仿真精度的模型结构
By introducing a solder paste module into the simulation model of soldering components, the impedance data deviation problem caused by ignoring the presence of solder paste in the existing technology is solved, the simulation accuracy is improved, and the accuracy of signal integrity design is ensured.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- EMDOOR ELECTRONICS TECH
- Filing Date
- 2025-05-30
- Publication Date
- 2026-07-17
AI Technical Summary
Existing impedance simulation models for soldering components ignore the presence of solder paste, resulting in significant deviations between impedance data and actual test results, thus affecting simulation accuracy.
A solder paste module is introduced into the simulation model, with its length and width set to be greater than that of the surface mount connector pin module, and it covers the main conductive area of the pin in the vertical direction with a height of 4 to 6 mil. This ensures that the size of the solder paste module is consistent with that of the pad module, simulating the actual soldering state.
It significantly reduced the deviation of impedance data, improved simulation accuracy by 86.59%, and provided a more reliable basis for the signal integrity design of PCB boards.
Smart Images
Figure CN224519426U_ABST