一种RGB幻彩分控式贴片LED

By using the RGB color-coded, individually controllable surface-mount LED design, flexible control of both built-in and external light-emitting units is achieved, solving the problem of limited functional modes in traditional RGB full-color LEDs and providing rich display effects and a stable dynamic visual experience.

CN224519462UActive Publication Date: 2026-07-17DONGGUAN EKINGLUX OPTOELECTRONICS TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN EKINGLUX OPTOELECTRONICS TECH
Filing Date
2025-07-21
Publication Date
2026-07-17

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Abstract

本实用新型公开了一种RGB幻彩分控式贴片LED,包括分控IC、红色LED芯片、绿色LED芯片、蓝色LED芯片、焊盘组件和三颗外置LED;所述焊盘组件包括数据输入焊盘(DIN)、电源输入焊盘(VDD)、公共阳极焊盘(+)、红色控制焊盘(‑R)、接地焊盘(GND)、数据输出焊盘(DOUT)、蓝色控制焊盘(‑B)、绿色控制焊盘(‑G),上述八个焊盘分别与所述分控IC电性连接;所述三颗外置LED分别为红色LED、绿色LED和蓝色LED。本实用新型提供的技术方案既能实现基础的独立RGB全彩显示,又能通过内置的分控IC对内置红、绿、蓝三基色芯片和外置三颗LED进行动态控制,满足多样化场景对静态全彩与动态幻彩效果的需求。
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Claims

1. An RGB fantasy color split-controlled SMD LED, characterized in that, The system includes a control IC, a red LED chip, a green LED chip, a blue LED chip, a pad assembly, and three external LEDs. The pad assembly includes a data input pad (DIN), a power input pad (VDD), a common anode pad (+), a red control pad (-R), a ground pad (GND), a data output pad (DOUT), a blue control pad (-B), and a green control pad (-G). These eight pads are electrically connected to the control IC. The three external LEDs are a red LED, a green LED, and a blue LED. The negative terminal of the red LED is connected to the red control pad (-R) via a wire, the negative terminal of the green LED is connected to the green control pad (-G) via a wire, and the negative terminal of the blue LED is connected to the blue control pad (-B) via a wire. The positive terminals of the red LED, the green LED, and the blue LED are connected to the power input pad (VDD).

2. The RGB iridescent split-wick chip LED of claim 1, wherein, The sub-control IC has the following pins and is electrically connected to the pad assembly: The data input pin (DI) is connected to the data input pad (DIN). The positive power supply pin (+) is connected to the power input pad (VDD). The ground pin (-) is connected to the ground pad (GND). The red control pin (R) is connected to the red control pad (-R). The data output pin (DO) is connected to the data output pad (DOUT). The blue control pin (B) is connected to the blue control pad (-B). The green control pin (G) is connected to the green control pad (-G).

3. The RGB iridescent split-wick chip LED of claim 1, wherein, The common anode pad (+), red control pad (-R), blue control pad (-B), and green control pad (-G) are external circuit control terminals for the built-in RGB full-color mode. They achieve the RGB full-color effect through parallel driving of red LED chips, green LED chips, and blue LED chips.

4. The RGB iridescent split-wick chip LED of claim 1, wherein, The data input pad (DIN), power input pad (VDD), ground pad (GND), and data output pad (DOUT) are external line control interfaces for the built-in RGB color mode. By connecting to the chip's built-in sub-control IC, the red LED chip, green LED chip, and blue LED chip can be independently controlled to achieve the RGB color effect.

5. The RGB iridescent split-wick chip LED of claim 1, wherein, The data input pad (DIN), power input pad (VDD), ground pad (GND), and data output pad (DOUT) are external circuit control terminals for the external RGB color mode. They are electrically connected to the three external LEDs through the chip's built-in control IC to achieve independent control of the three external LEDs and realize the RGB color effect.

6. The RGB iridescent split-wick chip LED of claim 1, wherein, The control IC has an address control function, which can independently control the red LED chip, green LED chip, blue LED chip and three external LEDs to achieve color and brightness adjustment.

7. The RGB iridescent split-wick chip LED of claim 1, wherein, The control IC, red LED chip, green LED chip, blue LED chip, and pad assembly are integrated into an SMD surface mount device package.