一种固态硬盘用散热结构

By combining the design of the hard drive mechanism, shielding mechanism, and heat dissipation mechanism, the problem of poor heat dissipation of solid-state drives is solved, achieving effective heat dissipation and improved hard drive stability.

CN224519510UActive Publication Date: 2026-07-17SUZHOU GUANWEN STORAGE TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU GUANWEN STORAGE TECH CO LTD
Filing Date
2025-03-14
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing solid-state drives (SSDs) have poor heat dissipation structures, such as closed casings that allow air to come into contact with the air or poor heat dissipation from heat sinks, making it difficult to effectively dissipate internal heat.

Method used

A heat dissipation structure including a hard drive mechanism, a shielding mechanism, and a heat dissipation mechanism is designed. The shielding mechanism blocks the socket when not in use, and drives the heat dissipation mechanism to disengage the blocking rod from the heat dissipation hole when in use, ensuring that the heat dissipation hole is actively exposed for heat dissipation when in use.

Benefits of technology

This improves the heat dissipation of the solid-state drive, prevents particles and impurities from entering, ensures that internal heat can be effectively dissipated, and enhances the stability and performance of the drive.

✦ Generated by Eureka AI based on patent content.

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Abstract

本实用新型公开了一种固态硬盘用散热结构,包括硬盘机构,包括上外壳、下外壳、散热孔、插孔和存储板,所述散热孔开设于上外壳和下外壳表面,所述插孔设置于上外壳和下外壳表面,所述存储板固定连接于上外壳和下外壳内。本实用新型通过遮挡机构能够对固态硬盘插孔处不使用时进行封堵,并且在插头插入时能够驱动散热机构,使散热机构上的堵杆脱离散热孔进行散热,通过散热机构在固态硬盘不使用时,能够对外壳上的散热孔进行封堵,避免颗粒杂质的进入,在使用时可将散热孔主动露出进行散热,提高散热的效果,便于将内部热量容易散出,并且可将固体硬盘放置时进行倾斜顶起,避免遮挡散热孔的散热。
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Claims

1. A heat dissipation structure for a solid state drive, characterized by: include, The hard disk assembly (100) includes an upper outer shell (101), a lower outer shell (102), heat dissipation holes (103), insertion holes (104), and a storage board (105). The heat dissipation holes (103) are formed on the surfaces of the upper outer shell (101) and the lower outer shell (102). The insertion holes (104) are formed on the surfaces of the upper outer shell (101) and the lower outer shell (102). The storage board (105) is fixedly connected inside the upper outer shell (101) and the lower outer shell (102). The upper outer shell (101) is fixedly connected to the top of the lower outer shell (102). A shielding mechanism (200), installed in a socket (104), includes a short rod (201), a baffle (202), and a torsion spring (203). The two ends of the short rod (201) are fixedly connected to the inner wall of the socket (104). The baffle (202) is sleeved on the surface of the short rod (201). The torsion spring (203) is sleeved on the surface of the short rod (201), and its two ends are fixedly connected to the surface of the short rod (201) and the surface of the baffle (202), respectively. A heat dissipation mechanism (300) is installed on the inner walls of the upper outer shell (101) and the lower outer shell (102), including a driving component (301), a sealing component (302) and a support rod (303). The driving component (301) and the sealing component (302) are installed on the inner walls of the upper outer shell (101) and the lower outer shell (102). The sealing component (302) is disposed on the surface of the driving component (301), and the support rod (303) is installed on the surface of the driving component (301).

2. The heat dissipation structure for a solid state drive according to claim 1, wherein: The bottom of the upper outer shell (101) is fixedly connected to a positioning rod (106), and the top of the lower outer shell (102) is provided with a positioning groove, into which the positioning rod (106) is inserted.

3. The heat dissipation structure for a solid state drive according to claim 1, wherein: The driving component (301) includes a fixing plate (301a), a groove (301b), and a pressing plate (301c). The fixing plate (301a) is fixedly connected to the inner wall of the upper outer shell (101) and the lower outer shell (102). The groove (301b) is opened inside the fixing plate (301a), and the pressing plate (301c) is slidably connected to the groove (301b).

4. The heat dissipation structure for a solid state drive according to claim 3, wherein: A first inclined block (301d) is slidably connected in the groove (301b). A drive plate (301e) is fixedly connected to the surface of the first inclined block (301d). The drive plate (301e) is slidably connected to the surface of the fixed plate (301a). The support rod (303) is fixedly connected to the surface of the first inclined block (301d). The support rod (303) is slidably connected to the upper outer shell (101) and the lower outer shell (102). 5.The heat dissipation structure for solid state hard disks according to claim 3, wherein: The sealing component (302) includes a slide rod (302a), a connecting plate (302b), and a plug rod (302c). The slide rod (302a) is fixedly connected to the inner wall of the upper outer shell (101) and the lower outer shell (102). The connecting plate (302b) is sleeved on the surface of the slide rod (302a). The plug rod (302c) is fixedly connected to the surface of the connecting plate (302b). The plug rod (302c) is slidably connected inside the heat dissipation hole (103). 6.The heat dissipation structure for solid state hard disks according to claim 5, wherein: A spring (302d) is fitted on the surface of the slide rod (302a), and the two ends of the spring (302d) are fixedly connected to the connecting plate (302b), the upper shell (101) and the lower shell (102) respectively.

7. The heat dissipation structure for a solid state drive according to claim 6, wherein: A second inclined block (302e) is slidably connected within the groove (301b). A connecting rod (302f) is fixedly connected to the surface of the second inclined block (302e). The connecting rod (302f) is fixedly connected to the surface of the connecting plate (302b). The connecting rod (302f) is slidably connected to the fixing plate (301a). A connecting block (302g) is fixedly connected to the surface of the connecting plate (302b). 8.The heat dissipation structure for solid state hard disks according to claim 4, wherein: A limiting block (304) is fixedly connected to the surface of the drive plate (301e), and the drive plate (301e) is slidably connected to the upper shell (101) and the lower shell (102). 9.The heat dissipation structure for solid state hard disks according to claim 4, wherein: A guide block (305) is fixedly connected to the surface of the extrusion plate (301c), and a guide hole (306) that cooperates with the guide block (305) is opened on the surface of the fixing plate (301a). The guide block (305) is slidably connected in the guide hole (306). 10.The heat dissipation structure for solid state hard disks according to claim 7, wherein: The surface of the fixing plate (301a) is provided with a first through hole (307) that mates with the first inclined block (301d), and the surface of the fixing plate (301a) is provided with a second through hole (308) that mates with the second inclined block (302e).